Category: Si

Micro Commercial Components introduced the MCAC055N20YH, a 200 V N-channel power MOSFET designed for compact, high-efficiency power designs where power density, footprint, and thermal performance are critical. Built on advanced Split-Gate Trench technology and housed in a space-saving DFN5060 package, the device combines fast switching with low conduction losses and robust thermal characteristics for applications spanning data center power, telecom infrastructure, industrial automation, renewable energy systems, and professional audio equipment.

With a 200 V VDS rating, 34 A continuous current capability, and a low RDS(on) of 55 mΩ, the MCAC055N20YH provides ample margin for voltage transients while minimizing heat and energy loss. Its 0.9 °C/W junction-to-case thermal resistance supports stable operation under heavy loads, enabling cooler, longer-lasting systems.

Features & benefits:

• 200 V N-channel power MOSFET for high-voltage industrial and telecom applications
• Split-Gate Trench technology optimized for low on-resistance and high switching speed
• Low RDS(on) of 0.055 Ω (max) at VGS = 10 V to reduce conduction losses and heat generation
• Excellent thermal performance with 0.9 °C/W RθJC for efficient heat transfer and stable high-power operation
• Compact DFN5060 package (5 mm × 6 mm) for high power density in space-constrained designs
• 200 V drain-source rating provides headroom for spikes and ringing in demanding 48–100 V systems

Original – Micro Commercial Components

Micro Commercial Components introduced the MCTL011N20YH, a 200 V N-channel MOSFET designed for high-power systems where efficiency, thermal performance and board space are critical. Built on Split Gate Trench MOSFET Technology and housed in a thermally efficient TOLL-8L package, the device delivers low conduction and switching losses with low parasitic inductance—supporting fast, clean transitions and stable operation up to Tj(max) = 175 °C.

The optimized thermal path of the TOLL-8L package improves heat dissipation, enabling higher current handling with reduced temperature rise and lighter cooling requirements. This helps engineers increase power density, meet tight efficiency targets and enhance long-term reliability in motor drivers, DC-DC converters, UPS systems and server power modules.

Features and benefits:

• 200 V N-channel power MOSFET
• Split Gate Trench MOSFET Technology for low losses and high efficiency
• TOLL-8L surface-mount power package with compact footprint
• Low parasitic inductance for fast, clean switching
• Excellent thermal performance and heat dissipation
• High current handling capability
• Maximum junction temperature: Tj(max) = 175 °C
• Mechanically robust package suited for harsh and industrial environments

Original – Micro Commercial Components

Micro Commercial Components has introduced the MCAC2D6N04Y, a 40 V N-channel MOSFET in a compact DFN5060 package, engineered for applications where efficiency, power density and board space are equally critical. With an ultra-low RDS(on) of 2.6 mΩ at VGS = 10 V and a continuous drain current rating of 166 A, the device minimizes conduction losses and heat generation, enabling more power delivery in a smaller footprint while easing thermal design. Its combination of very low on-resistance, fast and efficient switching, and small package size makes it a strong fit for battery protection circuits, compact DC-DC converters, motor drive stages and other space-constrained power systems.

Leveraging a Split Gate Trench structure optimized for low gate charge (Qg = 38.3 nC), the MCAC2D6N04Y-TP supports high-frequency operation where switching losses and EMI must be tightly controlled. A maximum junction temperature of 175 °C provides ample headroom under demanding load conditions, reducing heatsink requirements and lowering overall thermal overhead.

Features & benefits:

• 40 V N-channel power MOSFET
• Ultra-low RDS(on) of 2.6 mΩ (max) at VGS = 10 V to cut conduction losses and improve system efficiency
• Split Gate Trench technology with low gate charge (Qg = 38.3 nC) for fast, efficient switching
• High continuous drain current (ID) of 166 A for robust power handling
• Maximum junction temperature of 175 °C for enhanced ruggedness and relaxed cooling needs
• Compact DFN5060 package (5.0 mm × 6.0 mm) to save board area and support high power density layouts
• RoHS compliant and halogen-free for global environmental and regulatory alignment

Original – Micro Commercial Components

Micro Commercial Components (MCC) has introduced the MCTT1D7N10Y, a 100V power MOSFET housed in a TO-Leaded Topside Cooling (TOLT) package, engineered to deliver exceptional thermal performance and rugged reliability. Designed for space-constrained, high-demand environments such as industrial systems and server-grade power electronics, the MCTT1D7N10Y combines high current capability with advanced thermal management.

Topside cooling is a thermal architecture that allows heat to be dissipated directly from the top of the package. Unlike conventional bottom-cooled designs that rely on the printed circuit board (PCB) for heat transfer, the TOLT package features an exposed drain pad on the top surface, enabling direct thermal contact with a heatsink, cold plate, or thermal interface material (TIM). This approach significantly shortens the thermal path, resulting in more efficient heat dissipation and enhanced device performance.

By removing the PCB from the primary thermal path, topside cooling enables lower junction temperatures, greater current handling with minimal derating, simplified PCB layouts, and extended system longevity through reduced thermal stress on adjacent components.

Key features of the MCTT1D7N10Y include:

• 100V N-channel MOSFET with maximum RDS(on) of 1.7 mΩ
• TO-Leaded Topside Cooling (TOLT) package with exposed drain for efficient heat transfer
• Direct die-to-heatsink thermal path bypassing the PCB
• Junction-to-case thermal resistance (RthJC) of 0.36 K/W
• Low-profile package suited for compact designs
• High current capability with strong thermal cycling robustness

With its combination of electrical performance and advanced packaging, the MCTT1D7N10Y offers an ideal solution for designers seeking to enhance power density, efficiency, and reliability in next-generation industrial and data-centric power applications.

Original – Micro Commercial Components