• Wise-integration Raises €15 million in Series B Funding Round

    Wise-integration Raises €15 million in Series B Funding Round

    3 Min Read

    Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power supplies, announced financing of €15 million. The Series B round wasled by imec.xpand, with participation from Supernova Invest, BNP Paribas Developpement, Région Sud Investissement (RSI), Creazur, CASRA Capital and Angels for Greentech.

    The round will fuel mass production and commercial deployment of the company’s flagship products, WiseGan® and WiseWare®, its disruptive digital-control technology, and its support for clients globally as they adopt these solutions. It included the five investors from the previous funding and three new investors.

    CEO Thierry Bouchet said, “The €15 million of new funding will accelerate the company’sinternational expansion, ongoing R&D programs and the introduction of new products and solutions. “This funding will enable Wise-integration to accelerate our commercial development and product development and the launch of a new generation of high-performance GaN technology, which is designed to seamlessly integrate with digital controls and boost the efficiency and performance of power systems across various sectors,” Bouchet continued. “A third roadmap focus will be to broaden our WiseWare® product development, targeting high-value markets, such as industrial, telecom and automotive sectors.”

    Since its launch in 2020, the fabless company has established itself as an award-winning innovator in the power electronics industry, building a portfolio of more than 10 patent families. WiseGan® encompasses GaN power integrated circuits designed to maximize the benefits of GaN technology, including higher power density, efficiency and reduced heat generation. WiseWare® is a 32-bit, MCUbased, AC-DC digital controller optimized for GaN-based power supply architectures, offering simplified system design, a lower bill of materials and improved power density and efficiency.

    The company’s target markets include consumer electronics, from laptops to e-bikes, scooters and motorcycles, to industrial applications like robotics, as well as data centers and electric vehicles. All its solutions address the increasing demands for miniaturization, electrification and efficient power management.

    Wise-integration has established a first-class semiconductor GaN supply chain to support its mass production and commercialization strategy, while ensuring the most competitive costs in the market.

    “Wise-integration’s GaN technology can play a significant role in the global shift to electrification by enhancing the efficiency and performance of power systems across various sectors,” said Cyril Vančura, imec.xpand partner. “In the four years since its founding, this start-up has demonstrated the vision, drive, execution and technological knowhow to deliver game-changing power-electronics solutions, and we look forward to witnessing the next phase of its growth journey.”

    “With this new funding, Supernova Invest reaffirms its support for Wise-integration, a CEA-Leti spinoff that we have trusted since its creation,” said Damien Bretegnier, investment director, Supernova Invest. “We strongly believe in the huge potential of its WiseWare® digital control technology and associated WiseGan® components, anticipating a profound revolution in the power conversion market that propels GaN technology to replace legacy solutions even more rapidly.”

    “Wise-integration is one of the finest up and-coming companies in the hardware sector, a key sector in our beautiful region,” said Pierre Joubert, general director of RSI. “A high-potential company with a top management team, it fits in perfectly with the investment thesis of our Transition fund and its 100 percent Paris Agreement strategy. It has all the assets to become one of the strong links in the regional economic development strategy.”

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  • Toshiba Started Construction of a Back-End Fab for Power Semiconductors

    Toshiba Started Construction of a Back-End Fab for Power Semiconductors

    1 Min Read

    Toshiba Electronic Devices & Storage Corporation announced that it has started construction of a back-end production facility for power semiconductors at Himeji Operations – Semiconductor, in Hyogo Prefecture, western Japan. The new facility will start mass production in spring 2025.

    Toshiba will promote smart factory initiatives that bring automated transportation systems into manufacturing processes, promote work efficiency through adoption of RFIDNote tags, and improve the accuracy of inventory management. The facility will be 100% powered by renewable energy and equipped with solar power generation systems, underlining Toshiba’s commitment to the SDGs.

    Power devices are essential components for managing and reducing power consumption in all kinds of electronic equipment, and for saving energy. With the start of production at the new Himeji facility, Toshiba will more than double its production capacity for automotive power semiconductor production, against fiscal 2022, and reinforce its contributions to advancing carbon neutrality.

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  • Qorvo® Delivers Four 1200V SiC Modules

    Qorvo® Delivers Four 1200V SiC Modules

    2 Min Read

    Qorvo® announced four 1200V silicon carbide (SiC) modules – two half-bridge and two full-bridge – in a compact E1B package with RDS(on) starting at 9.4mΩ. These highly efficient SiC modules are excellent solutions for electric vehicle (EV) charging stations, energy storage, industrial power supplies and solar power applications.

    “The modules in this new family can replace as many as four discrete SiC FETs, thus simplifying thermomechanical design as well as assembly. Our cascode technology also allows higher switching frequency operation, further reducing solution size by using smaller external components,” said Ramanan Natarajan, director of product line marketing for Qorvo’s SiC Power Products business.

    “For our customers, the high efficiency of these modules streamlines the power supply design process, so they can focus on the design, layout, assembly, characterization and qualification of one module as opposed to numerous discrete components.”

    Led by the 9.4mΩ UHB100SC12E1BC3N, these four SiC modules leverage Qorvo’s unique cascode configuration, which minimizes RDS(on) and switching losses to maximize efficiency, especially in soft-switching applications. Silver-sinter die attach reduces thermal resistance to as low as 0.23 °C/W; when combined with the stacked die construction found in the “SC” part numbers, power cycling performance is improved by 2X over comparable SiC power modules on the market.

    Together, these characteristics contribute to superior thermal performance and reliability with the ease of use and power density of a highly integrated SiC power module.

    The table below provides a snapshot of Qorvo’s new 1200V SiC module family:

    Part #DescriptionRDS(on) @25C (mΩ)
    UFB15C12E1BC3N1200V, 15A SiC full-bridge module70
    UFB25SC12E1BC3N1200V, 25A SiC full-bridge module35
    UHB50SC12E1BC3N1200V, 50A SiC half-bridge module19
    UHB100SC12E1BC3N1200V, 100A SiC half-bridge module9.4

    Qorvo’s suite of powerful design tools like its FET-Jet Calculator and QSPICE™ software aid in product selection and performance simulation. For more information about Qorvo’s advanced SiC solutions for industrial applications, please visit www.qorvo.com/go/sic.

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  • Nexperia Released New 40V and 100V MOSFETs

    Nexperia Released New 40V and 100V MOSFETs

    3 Min Read

    Nexperia is once again bringing its product innovations to APEC and today announced the release of several new MOSFETs to further broaden its range of discrete switching solutions for use in various applications across multiple end markets.

    This release includes 100 V application specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement in 60% smaller DFN2020 packaging, and 40 V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance.

    PoE switches typically have up to 48 ports, each requiring 2 MOSFETs for protection. With up to 96 MOSFETs on a single PCB, any reduction in device footprint is attractive. For this reason, Nexperia has released 100 V PoE ASFETs in 2 mm x 2 mm DFN2020 packaging which occupies 60% less space than previous versions in LFPAK33 packaging.

    A critical function of these devices is to protect PoE ports by limiting inrush currents while safely managing fault conditions. To manage this scenario, Nexperia has enhanced the safe operating area (SOA) of these devices by up to 3x with only a minimal increase in RDS(on).  These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications and can serve as replacements for mechanical relays in smart thermostats, for example.

    EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release. Typical solutions include using significantly more expensive MOSFETs with lower RDS(on) (to slow down switching and absorb excessive voltage ringing) or to fit an external capacitive snubber circuit but this approach has the disadvantage of increasing component count.

    Nexperia has optimized its 40 V NextPowerS3 MOSFETs to offer similar EMC performance as that which can be achieved using an external snubber circuit, while also offering higher efficiency. These MOSFETs are suitable for use in switching converters and motor controllers across various applications and are available in LFPAK56 packaging.

    “By introducing these latest additions to our range of discrete FET solutions at APEC 2024, Nexperia showcases how we leverage our expertise in R&D to deliver optimized solutions. Both our new 100 V PoE ASFETs as well as improved EMC performance in our 40 V NextPowerS3 MOSFETs demonstrate our commitment to supporting engineers in overcoming challenges across diverse applications. These innovations underscore Nexperia’s dedication to providing efficient, compact, and reliable solutions that empower our customers to succeed in today’s ever-evolving market,” says Chris Boyce, MOSFET Marketing & Product Group Director at Nexperia.

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  • EPC Introduced 1 mOhm GaN FET

    EPC Introduced 1 mOhm GaN FET

    1 Min Read

    EPC introduced the 100 V, 1 mOhm EPC2361. This is the lowest on-resistance GaN FET on the market offering double the power density compared to EPC’s prior-generation products.

    The EPC2361 has a typical RDS(on) of just 1 mOhm in a thermally enhanced QFN package with exposed top and tiny, 3 mm x 5 mm, footprint. The maximum RDS(on) x Area of the EPC2361 is 15 mΩ*mm2 – over five times smaller than comparable 100 V silicon MOSFETs.

    With its ultra-low on-resistance, the EPC2361 enables higher power density and efficiency in power conversion systems, leading to reduced energy consumption and heat dissipation. This breakthrough is particularly significant for applications such as high-power PSU AC-DC synchronous rectification, high frequency DC-DC conversion for data centers, motor drives for eMobility, robotics, drones, and solar MPPTs. 

    “Our new 1 mΩ GaN FET continues to push the boundaries of what is possible with GaN technology, empowering our customers to create more efficient, compact, and reliable power electronics systems,” comments Alex Lidow, EPC CEO and co-founder.

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  • Arrow Electronics and Infineon Technologies Deliver 30kW DC Fast Charger Reference Platform

    Arrow Electronics and Infineon Technologies Deliver 30kW DC Fast Charger Reference Platform

    2 Min Read

    Arrow Electronics, Inc. and its engineering services company, eInfochips, are working with Infineon Technologies AG to help eInfochips’ customers accelerate the development of electric vehicle (EV) chargers.

    Development of EV chargers, especially DC “fast chargers,” is becoming increasingly challenging to equipment manufacturers due to several factors, such as lack of prior experience, stringent functional safety and reliability requirements, and a fledgling support network. The collaboration between Arrow and Infineon aims to help innovators navigate these challenges while accelerating time-to-market.

    As part of the collaboration, Arrow’s High Power Center of Excellence has developed a 30kW DC fast charger reference platform. This includes Infineon’s 1200V CoolSiC™ Easy power modules and also hardware design, embedded firmware, bi-directional charging support and energy metering functionality.

    “Combining Arrow’s strength in components, engineering and design services with Infineon’s innovative products will help customers accelerate their design and speed to market in e-mobility applications,” said Murdoch Fitzgerald, vice president, global engineering and design services at Arrow. “Customers can rely on this collaboration to deliver innovative and leading edge DC faster chargers, accelerate and de-risk design cycles, and get access to a world-class support team enabling them to plan and manage their product roadmap and lifecycles.”

    “Infineon is on a drive towards decarbonization and digitalization with our ecosystem partners, and this collaboration with Arrow is a testament to this mission,” said Shri Joshi, vice president of Green Industrial Power, Infineon Technologies Americas. “The joint 30kW DC fast charger reference platform, which includes Infineon’s latest power modules and devices, will help our customers bring more fast chargers to market as the future moves to electrical vehicles. We look forward to this ongoing collaboration to support our customer base.”

    The first reference design from this collaboration, a production-grade 30kW DC fast charger reference development platform, is being demonstrated at Applied Power Electronics Conference, Feb. 25-29, in Long Beach, Calif.

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  • onsemi Expands Its Portfolio with 1200V SPM31 Intelligent Power Modules Featuring Field Stop 7 IGBT Technology

    onsemi Expands Its Portfolio with 1200V SPM31 Intelligent Power Modules Featuring Field Stop 7 IGBT Technology

    2 Min Read

    onsemi announced the availability of its 1200V SPM31 Intelligent Power Modules (IPMs) featuring the latest generation Field Stop 7 (FS7) Insulated Gate Bipolar Transistor (IGBT) technology. The SPM31 IPMs deliver higher efficiency, smaller footprint and higher power density resulting in lower total system cost than other leading solutions on the market.

    Given the greater efficiency realized using optimized IGBTs, these IPMs are ideal for three-phase inverter drive applications such as heat pumps, commercial HVAC systems, servo motors, and industrial pumps and fans.

    Operating residential and commercial buildings is estimated to contribute 26% of greenhouse gas emissions, with indirect emissions such as heating, cooling and powering buildings accounting for approximately 18%. As governments worldwide strive to meet their energy and climate commitments, more energy-efficient and lower-carbon solutions are becoming increasingly critical.

    The SPM31 IPMs control the power flow to the inverter compressor and fans in heat pumps and air conditioning systems by adjusting the frequency and voltage of the power supplied to three-phase motors for maximum efficiency. For example, onsemi’s 25A-rated SPM31 using FS7 IGBT technology can decrease power losses by up to 10% and increase in power density up to 9%, compared to our previous generation products.

    With the transition to electrification and heightened efficiency mandates, these modules help manufacturers drastically improve system design while increasing efficiency in heating and cooling applications. With the improved performance, our SPM31 IPM family featuring FS7 enables high efficiency with reduced energy losses, further reducing harmful emissions globally.

    These highly integrated modules contain gate-driving ICs, multiple on-module protection features along with our FS7 IGBTs enabling industry-leading thermal performance with the ability to support a wide range of currents, from 15A to 35A. With their best-in-class power density, SPM31 FS7 IGBT IPMs are an ideal answer to save mounting space and improve performance expectations while shortening the development time. In addition, the SPM31 IPMs include the following benefits:

    • Controls for gate drivers and protections
    • Low loss, short-circuit-rated IGBTs
    • Negative IGBT terminals available for each phase to support a wide variety of control algorithms
    • Built-in under-voltage protection (UVP)
    • Built-in bootstrap diodes and resistors
    • Built-in high-speed high-voltage integrated circuit
    • Single-grounded power supply

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  • Infineon Technologies Introduced Dual-Phase Power Modules for AI Data Centers

    Infineon Technologies Introduced Dual-Phase Power Modules for AI Data Centers

    2 Min Read

    Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing the energy demands of the chips supporting this data growth. Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total cost of ownership (TCO) for AI data centers.

    The TDM2254xD series products blend innovation in robust OptiMOS TM MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centers operate at higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing TCO.

    Given that AI servers require 3 times more energy than traditional servers, and data centers already consume more than 2 percent of the global energy supply, it is essential to find innovative power solutions and architecture designs that further drive decarbonization. Paving the way for the green AI factory, Infineon’s TDM2254xD dual-phase power modules combine with XDP TM Controller technology to enable efficient voltage regulation for high-performance computing platforms with superior electrical, thermal and mechanical operation.

    Infineon introduced the TDM2254xD series at the Applied Power Electronics Conference (APEC). The modules’ unique design allows for efficient heat transfer from the power stage on to the heat sink through novel inductor design that is optimized to transfer current and heat, thereby allowing for a 2 percent higher efficiency than industry average modules at full load. Improving power efficiency at the core of a GPU yields significant energy savings at scale. This translates into megawatts saved for data centers computing generative AI and in turn leads to reduced CO 2 emissions and millions of dollars in operating cost savings over the system’s lifetime.

    “This unique Product-to-System solution combined with our cutting-edge manufacturing lets Infineon deliver solutions with differentiated performance and quality at scale, thereby significantly reducing total cost of ownership for our customers,” said Athar Zaidi, Senior Vice President, Power & Sensor Systems at Infineon Technologies. “We are excited to bring this solution to market; it will accelerate computing performance and will further drive our mission of digitalization and decarbonization.” 

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  • CISSOID Released New Series of SiC Inverter Control Modules

    CISSOID Released New Series of SiC Inverter Control Modules

    2 Min Read

    At the Applied Power Electronics Conference (APEC), CISSOID released its new series of SiC Inverter Control Modules (ICMs) dedicated to the E-mobility market. These software-powered SiC Inverter Control Modules are designed to help engineers create functionally safe, robust and modular E-motor drives while dramatically shortening time-to-market.

    The new CXT-ICM3SA series offers optimal hardware and software integration of CISSOID’s existing line of 3-phase 1200V/340A-550A SiC MOSFET Intelligent Power Modules (IPMs) with an OLEA® T222 Field Programmable Control Unit (FPCU) control board and OLEA® APP INVERTER application software, supplied in partnership with Silicon Mobility. Depending on the selected ICM product, this modular core engine is capable of powering and controlling high voltage SiC traction inverters with battery voltages up to 850V, at output power exceeding 350kW, and with peak efficiency above 99%.
    This unique integration facilitates the rapid development of SiC inverters by solving head-scratching EMC issues often generated due to fast-switching SiC transistors, by supporting different modulation schemes, e.g. SVPWM or DPWM, combined with dead time compensation, and by offering advanced motor control algorithms, including Field Oriented Control (FOC) and Flux Weakening management.
    CISSOID further improves time-to-market by providing a complete SiC inverter reference design allowing motor bench testing of the ICM together with key peripheral elements such as current sensors, a high-performance DC-Link capacitor and EMI filter. Both the ICM and the reference design can be obtained from CISSOID, together with the motor control software and on-site technical support.

    Delivering leadership performance, the ICM supports the drive of high-speed motors, with no compromise on efficiency, thanks to the combination of CISSOID’s low losses SiC power module with the ultra-fast real-time FPCU, enabling high switching frequencies up to 50kHz. Furthermore, this application-specific processor dedicated to e-motor control, with onboard programmable hardware, accelerates the response time to critical events, off-loading the processor cores and enhancing functional safety. Both the FPCU and the control software are ISO-26262 ASIL C/D certified and AUTOSAR 4.3 compliant.

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  • Infineon Technologies to Sell Two Manufacturing Sites to ASE Technology Holding

    Infineon Technologies to Sell Two Manufacturing Sites to ASE Technology Holding

    3 Min Read

    Infineon Technologies AG and ASE Technology Holding Co., Ltd. announced that definitive agreements were signed under which Infineon will sell two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE, a leading provider of independent semiconductor manufacturing services in assembly and test.

    The plants currently run under the entity names Infineon Technologies Manufacturing Ltd. – Philippine Branch (Cavite) and Infineon Technologies Power Semitech Co., Ltd. (Cheonan) and will be acquired by ASE Inc. and ASE Korea Inc. respectively. Post the transaction, ASE will assume operations with current employees, and further develop both sites to support multiple customers. As such, ASE and Infineon have also concluded long-term supply agreements under which Infineon will continue to receive previously established services as well as services for new products to support its customers and fulfill existing commitments. 

    Infineon’s manufacturing strategy, with a balanced operations footprint combining in-house and external manufacturing, is an important pillar of the company’s profitable growth path. By pooling manufacturing volumes in Cavite and Cheonan under a new owner and offering highest-quality manufacturing services to the overall industry, Infineon and ASE will be able to leverage mutual synergy potentials, thus generating attractive growth potentials for both companies.

    “We have excellent, highly competent teams and a great track record of highest quality standards at both sites, Cavite and Cheonan,” said Alexander Gorski, EVP and Head of Backend Operations at Infineon. “ASE has been a trusted, strategic partner of Infineon for many years and will be an excellent new owner that will continue on this successful path and strengthen both fabs even further. The sale of our sites to ASE is in line with Infineon’s manufacturing strategy, provides mutual synergies and enables further growth while strengthening supply chain resilience”.

    “Both the automotive and power management market segments are strategic focus areas for ASE,“ said Dr. Tien Wu, Chief Operating Officer of ASE. “This acquisition of Infineon’s facilities in Cavite and Cheonan marks ASE’s strong commitment to form a strategic long-term partnership with Infineon in developing backend manufacturing solutions matching future growth opportunities. Given Infineon’s market leadership in automotive and power semiconductors and ASE’s leading position in backend semiconductor manufacturing, this partnership creates a win-win solution for the entire ecosystem from product companies to the end consumer.”

    Infineon Technologies Power Semitech is a backend manufacturing site with around 300 employees. The fab is located in Cheonan, South Korea, about 60 miles south of Seoul. Infineon Technologies Cavite, is a backend manufacturing site with more than 900 employees. It is located in one of the fastest growing and most industrialized provinces in the Philippines.

    The transaction is expected to close towards the end of the second calendar quarter of 2024, when all pending closing conditions will have been fulfilled.

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