• SemiQ to Showcase Latest SiC Power Solutions and Known-Good-Die Screening Process at PCIM Europe 2024

    SemiQ to Showcase Latest SiC Power Solutions and Known-Good-Die Screening Process at PCIM Europe 2024

    2 Min Read

    SemiQ will showcase its latest SiC power solutions and recently launched Known-Good-Die (KGD) screening process at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.

    During the event SemiQ will debut the latest addition to its QSiC™ family of high-speed-switching MOSFET half-bridge modules in S3 packages, which offer enhanced design flexibility and performance in current applications.

    Featuring industry-standard 62mm footprints and standing at 26.3mm in height, the new power modules address the size, weight and power demands of challenging applications, ranging from induction heaters, welding equipment and uninterruptible power supplies (UPS) to photovoltaic and wind inverters, energy storage systems, high-voltage DC-DC converters and battery charging systems for electric vehicles (EVs). They are available in 600A (GCMX003A120S3B1-N) and 400A (GCMX005A120S3B1-N). Visitors will also be able to see SemiQ’s QSiC family of 1200V modules in SOT-227, half-bridge and full-bridge options.

    Attendees visiting SemiQ’s stand at Alfatec’s booth (Hall 7, 418) will have the unique opportunity to learn more about the recently launched Known-Good-Die (KGD) screening program and see SemiQ’s MOSFET bare die on Known-Good-Die UV tape array for the first time. The KGD process delivers high-quality, electrically sorted and optically inspected advanced SiC MOSFET technology ready for back-end processing and direct die attachment.

    “We’re thrilled to participate at PCIM, a significant event in the power electronics industry,” said Dr. Timothy Han, President of SemiQ. “With the expansion of our QSiC family, our goal is to offer a comprehensive, high-performance SiC portfolio across various sectors and offer customized solutions for cutting-edge designs. Our continued dedication to rigorous testing and quality assurance, delivering unmatched reliability, is embodied in our new KGD program which we will be demonstrating at the event.”

    Founded in 1979, PCIM Europe stands as the pinnacle exhibition and conference for power electronics and its applications. Held annually in Nuremberg, the event attracts industry specialists and academia from around the globe, serving as the platform where new trends, technologies, and developments are first unveiled to the public.

    Schedule a meeting with the SemiQ team right away using online calendar here or email at media@semiq.com.

    Original – SemiQ

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  • X-FAB Silicon Foundries Updated XP018 High-Voltage CMOS Semiconductor Fabrication Platform

    X-FAB Silicon Foundries Updated XP018 High-Voltage CMOS Semiconductor Fabrication Platform

    2 Min Read

    X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has updated its XP018 high-voltage CMOS semiconductor fabrication platform with new 40V and 60V high-voltage primitive devices, which feature an extended SOA for improved operational robustness.

    These 2nd generation high-voltage primitive devices exhibit up to a 50% reduction in RDSon figures compared to the previous version. This offers an alternative which is better positioned to address certain key applications – particularly where devices’ footprints need to be reduced and unit costs minimized.

    The XP018 platform is a modular 180nm high-voltage EPI technology solution, based on a low mask count 5V single-gate core module. It supports an extended temperature range of -40 to 175°C and offers a wide range of optional devices and modules, including high-gain bipolar devices, standard and high-capacitance MIM capacitors, multi-threshold (Vt) options, Schottky diodes, and depletion devices.

    The platform is supported by high-reliability automotive NVM solutions, such as embedded Flash, EEPROM, and OTP, making it specifically designed for cost-sensitive and robust automotive, industrial, and medical applications.

    In addition to the new 40V/60V devices, the platform has been enhanced by the inclusion of 5.3V Zener diodes. The new low leakage Zener diode is designed to effectively protect the gate oxide in critical applications, such as Wide Bandgap gate driver applications. Furthermore, there are also new isolated drain high-voltage devices up to 24V and a new 1.8 V medium Vt option on offer.

    Tilman Metzger, Product Line Manager for High-Voltage at X-FAB, comments: “With this update of our XP018 platform we are demonstrating X-FAB’s commitment to enhancing established technologies. XP018 has been in production for more than a decade and still sees widespread adoption for new designs from our focus market segments: automotive, industrial and medical. The new competitive high-voltage devices and updates will enable our customers to implement more innovative and cost-effective products. Designers utilizing the new XP018 primitive devices have access to comprehensive PDK support across major EDA platforms like Cadence, Siemens EDA, Synopsys, ensuring seamless integration and optimization for a range of applications.”

    A new medium Vt standard cell library is scheduled to be released in Q3 2024. Further details on the XP018 platform can be accessed by going to: www.xfab.com/technology/high-voltage

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  • DISCO Developed KABRA Process for Diamond Wafer Manufacturing

    DISCO Developed KABRA Process for Diamond Wafer Manufacturing

    2 Min Read

    DISCO Corporation has developed a process for diamond wafer manufacturing that applies the KABRA process, an ingot slicing method using laser technology. This process contributes to increasing the diameter of diamond wafers.

    that Achieves Large-Diameter Diamond Wafer

    Diamond is often called the “ultimate semiconductor material” due to its superior material characteristics compared to Si, SiC, and GaN. In particular, as diamond has excellent insulation strength and heat conductivity, it is expected to be a good material for power semiconductors, and device development is underway at various research institutes.

    On the other hand, as it is an extraordinarily hard material, it came to be known that it is difficult to process mechanically. Therefore, laser became the general method used to slice wafers from a diamond crystalline ingot. However, with the conventional laser slicing method, as the ingot is processed from the sidewall, there was a limitation on the ingot diameter, and it was difficult to increase it.

    With KABRA slicing, there is no limitation on the ingot diameter as the laser is irradiated from the upper surface of the ingot, making it possible to increase the ingot diameter.

    Figure 1: Conventional slicing method using laser

    Figure 2: KABRA for diamond processing


    • Supports large-diameter ingots exceeding Φ50 mm
      With the conventional method where the laser is irradiated from the sidewall of an ingot (Figure 1), the largest supported diameter was approx. Φ30 mm, but with the KABRA method (Figure 2), as the laser is irradiated from the upper surface of the ingot, there is no limitation on the ingot diameter.
    • Splitting wafers with a thickness of 100 µm or less is possible
      By irradiating the laser at a shallow depth from the upper surface of the ingot, it is possible to split thin wafers. Therefore, a larger number of split wafers can be expected compared to the conventional method.
    • Achieves equivalent or higher throughput compared to the conventional method
      The splitting speed is equal to or faster than the conventional method, achieving lower processing costs.

    In addition, 45 patents related to this technology have been registered. Test cuts are available. Contact a DISCO sales representative.

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  • Alpha and Omega Semiconductor to Showcase Expanding Line of Advanced Power Management Solutions at PCIM 2024

    Alpha and Omega Semiconductor to Showcase Expanding Line of Advanced Power Management Solutions at PCIM 2024

    3 Min Read

    Alpha and Omega Semiconductor Limited (AOS) will showcase its expanding line of advanced power management solutions at PCIM 2024. Designed to meet the dynamic, important power management challenges in several key application areas and markets, the AOS products highlighted at PCIM include:

    • New Silicon Carbide (SiC) MOSFET Announcement at PCIM: Supporting the needs of a wide range of automotive and industrial applications, AOS will introduce three new advanced package options for its latest Gen2 SiC MOSFET line. The new packages comprise a surface mount topside cooling option with a Kelvin source that meets the needs of the most power-dense advanced designs. It will also be announced that an AEC-Q101-qualified surface mount package will be in the standard D2PAK-7L footprint. The third package is a half-bridge module that provides an excellent solution for the high power industrial solar and charging station markets. The announcements will detail how these packages support AOS’ comprehensive line of SiC MOSFETs from 10mOhm to 500mOhm and voltages from 650V to 1700V.
    • New Motor Drive Announcement at PCIM: AOS will announce a new range of 60V and 100V drivers for power tools, outdoor garden equipment, and e-mobility applications, including a 100V half bridge, a 100V 3-phase, and a 60V 3-phase. These products all support 100 percent duty cycle operation, and demo boards using AOS motor drivers and MOSFETs will be featured in the AOS booth.
    • Power Supply and Renewable Energy: A significant solution in AOS’ growing High Voltage Super Junction MOSFET portfolio is its industry-leading optimized αMOS5™ 600V to 700V Super Junction MOSFETs that help designers achieve efficiency and density goals while satisfying budget goals. Featuring fast switching, a robust UIS/body diode, and ease of use, these state-of-the-art MOSFETs meet the latest server, telecom rectifier, solar inverter, EV charger, gaming, PC, and universal charging/PD design requirements. The newly released AONA66916, a 100V AlphaSGT™ MOSFET, delivers industry-leading Rthjc-top and Rthjc-bottom thermal resistances. A compact DFN 5×6 double-sided cooling package offers improved thermal designs in demanding telecom, solar, and DC-DC converter applications.
    • Automotive and E-mobility: In AOS’ increasing line of automotive MOSFETs, the new automotive grade 80V (AOTL66810Q) and 100V (AOTL66912Q) MOSFETs in the TOLL package are designed to achieve the highest current capability. The AOS TOLL package utilizes advanced clip technology to achieve a high in-rush current rating and very low package resistance and inductance, enabling improved EMI performance compared to other TOLL packages based on standard wire-bonding technology packages. These new automotive-grade MOSFETs help designers meet the power requirements in electric vehicles, battery management systems (BMS), and high-performance inverters (BLDC motors) for e-mobility.
    • Intelligent Power Modules, Mega IPM7: AOS has integrated its latest RC IGBT and high-voltage gate driver into the world’s most compact package design, capable of delivering mega power of up to 100W in motor control applications. The portfolio covers 600V / (1A−3A) in a variety of package options (Mega IPM-7D, IPM7DT, IPM-7E) that are ideal solutions for a broad array of design requirements.
    • Poster Presentation: Jong-Mu Lee, Ph.D. and director of AOS IGBT and Module Product Lines, will present SiC-IPM for Compact and Energy Efficient in the Intelligent Power Modules session on Tuesday, June 11, at 15:30.

    Original – Alpha and Omega Semiconductor

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  • Taiwan Semiconductor Announced a Family of 650V SiC SBDs

    Taiwan Semiconductor Announced a Family of 650V SiC SBDs

    1 Min Read

    Taiwan Semiconductor – a global supplier of discrete power electronics devices, LED drivers, analog ICs and ESD protection devices – announced a family of 650V silicon carbide Schottky barrier diodes which are suitable for high-efficiency AC-DC, DC-DC and DC-AC conversion applications.

    Unlike silicon-based fast-recovery rectifiers, these SiC devices have negligible switching losses due to low capacitive charge (QC). This makes them suitable for high-speed switching applications, benefitting circuit designs with increased power density and can reduce overall solution size.

    Key Features

    • Max. junction temperature 175°C
    • High-speed switching
    • High frequency operation
    • Positive temperature coefficient on VF
    • SPICE Models available
    • Thermal Models available


    • AD-DC conversion – PFC Boost
    • DC-DC, Solar inverters
    • Data center and server power
    • Telecom – Datacom power
    • UPS systems

    Circuit Functions

    • PFC boost diode
    • Free-wheeling diode
    • Full wave bridge
    • Vienna bridgeless circuit

    Original – Taiwan Semiconductor

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  • Ideal Power Published Q1 2024 Financial Results

    Ideal Power Published Q1 2024 Financial Results

    4 Min Read

    Ideal Power Inc. reported results for its first quarter ended March 31, 2024.

    “Commercial momentum continues as we commenced shipments of SymCool™ power modules to fulfill customer orders in the first quarter. We expect industrial markets, particularly the solid-state circuit breaker market served by our SymCool™ power module, to be the earliest source of our sales ramp,” said Dan Brdar, President and Chief Executive Officer of Ideal Power.

    “In addition, all of our Phase II deliverables with Stellantis were successfully completed ahead of schedule and we added our first distributor, Richardson Electronics. They placed multiple orders with Ideal Power including an order from a company not previously in our sales funnel.”

    Key First Quarter and Recent Business Highlights

    Execution to B-TRAN™ commercial roadmap continues, including:

    • Commenced commercial shipment of SymCool™ power modules to fulfill customer orders. The SymCool™ power module targets several applications including solid-state switchgear and circuit protection, renewable energy inverters for solar and wind, industrial inverters, hybrid and electric vehicles (“EVs”) and EV charging.
    • Received an order for SymCool™ power modules and drivers from one of the two Forbes Global 500 leaders in diverse power management markets in Ideal Power’s B-TRAN™ test and evaluation program. This global power management market leader is evaluating SymCool™ against IGBT modules for use in solid-state circuit breaker (“SSCB”) applications.
    • Received an order for B-TRAN™ devices and a circuit breaker evaluation board from a global leader in power semiconductor and power electronics solutions in connection with its launch of a multi-year DC power distribution system program. This global leader presents multiple opportunities as it addresses several of our target industrial markets: SSCBs, industrial and grid infrastructure and renewable energy.
    • Successfully completed Phase II of a product development program with Stellantis, a top 10 global automaker. All Phase II deliverables were completed ahead of schedule including a wafer run and deliveries of tested B-TRAN™ devices, drivers and a Stellantis approved comprehensive reliability test plan for automotive qualification. Ideal Power is partnering with Stellantis’ advanced technology development team to develop a custom B-TRAN™ power module for use in EV drivetrain inverters in Stellantis’ next generation EV platform.
    • Added the first distributor, Richardson Electronics, for discrete B-TRAN™ device and SymCool™ power modules. Richardson Electronics placed multiple orders with Ideal Power including an order from a company not previously in Ideal Power’s sales funnel.
    • Added a global leader in circuit protection, industrial fuses and power conversion technology with over a billion in annual sales to the roster of the B-TRAN™ test and evaluation program.
    • Released B-TRAN™ and SymCool™ videos and application notes for the technical audience at prospective customers, resulting in the addition of new opportunities to the sales funnel. The videos demonstrate the testing of discrete B-TRAN™ devices and SymCool™ power modules and the compelling advantages B-TRAN™ offers to SSCB applications.
    • Nearing completion of a qualification run with the second high-volume wafer fabrication partner. This wafer fab in Europe will support future revenue growth and add dual sourcing for wafer fabrication.
    • B-TRAN™ Patent Estate: Currently at 86 issued B-TRAN™ patents with 39 of those issued outside of the United States and 41 pending B-TRAN™ patents. Current geographic coverage includes North America, China, Japan, South Korea, India, and Europe, with pending coverage in Taiwan.

    First Quarter 2024 Financial Results

    • Completed a public offering, raising net proceeds of $15.7 million. The initial closing in late March resulted in net proceeds of $13.7 million and the exercise of the underwriter’s overallotment option in April resulted in additional net proceeds of $2.0 million.
    • Commercial revenue increased to $78,739 in the first quarter of 2024 from $0 in the first quarter of 2023.
    • Operating expenses in the first quarter of 2024 were $2.5 million compared to $2.6 million in the first quarter of 2023.
    • Net loss in the first quarter of 2024 was $2.5 million compared to $2.5 million in the first quarter of 2023.
    • Cash used in operating, investing and financing activities in the first quarter of 2024, excluding the net proceeds from the public offering, was $1.9 million compared to $1.8 million in the first quarter of 2023 and down from $2.3 million in the fourth quarter of 2023.
    • Cash and cash equivalents totaled $20.2 million at March 31, 2024.
    • No long-term debt was outstanding at March 31, 2024.

    2024 Milestones

    For 2024, the Company has set or achieved the following milestones:

    • Successfully completed Phase II of development program with Stellantis
    • Secure Phase III of development program with Stellantis
    • Complete qualification of second high-volume production fab
    • Convert large OEMs in test and evaluation program to design wins/custom development agreements
    • Add distributors for SymCool™ products
    • Initial sales of SymCool™ IQ intelligent power module
    • Begin third-party automotive qualification testing

    Original – Ideal Power

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  • Infineon Technologies Extends Management Board Contracts of Andreas Urschitz and Rutger Wijburg

    Infineon Technologies Extends Management Board Contracts of Andreas Urschitz and Rutger Wijburg

    2 Min Read

    Infineon Technologies AG Supervisory Board has extended the contract of Dr. Rutger Wijburg (62), Management Board member and Chief Operations Officer, for a period of one year, until 31 March 2026. In addition, the Supervisory Board will extend the contract of Andreas Urschitz (52), Management Board member and Chief Marketing Officer, for a period of five years, until 31 May 2030. The current contract of Andreas Urschitz expires at the end of May 2025; Rutger Wijburg’s contract would otherwise have expired in March 2025.

    “Andreas Urschitz and Rutger Wijburg have played a decisive role in charting a course of profitable growth for Infineon. We are pleased that they will both continue as members of the Infineon Management Board in the upcoming years,” says Dr. Herbert Diess, Chairman of the Supervisory Board of Infineon Technologies AG. He adds that the Supervisory Board particularly respects the personal decision by Rutger Wijburg to extend his contract only until March 2026.

    Andreas Urschitz has been a member of the Management Board since 2022, prior to which he was President of the Infineon Power & Sensor Systems (PSS) Division. Rutger Wijburg has been a member of the Management Board and Infineon’s Chief Operations Officer since 2022; he was previously Head of Frontend as well as Managing Director at Infineon Dresden.

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  • CVD Equipment Announced Q1 2024 Financial Results

    CVD Equipment Announced Q1 2024 Financial Results

    3 Min Read

    CVD Equipment Corporation announced its financial results for the first quarter ended March 31, 2024.

    Manny Lakios, President and CEO of CVD Equipment Corporation, commented, “First quarter 2024 revenue was $4.9 million, down significantly versus the prior year period, as our business continues to experience fluctuations in revenue given the nature of the emerging growth end markets we serve. While we are disappointedwith our first quarter performance, we’ll stay the course on strategic efforts to achieve profitability, carefully managing our costs and cash flow while simultaneously focusing on growth and return on investment.”

    Mr. Lakios added, “As we mentioned in our year-end press release, we started off the year with several key order wins during the first quarter. These included a strategic order for our PVT200™ system from a new customer, marking an important milestone as we seek to gain traction for SiC crystal boule growth, as well as a multi-system order for our SiC CVD coating reactors. The PVT200™ customer plans to evaluate our equipment for potential additional orders. This improved order performance resulted in an increase in backlog from $18.4 million at year-end to $27.1 million at March 31, 2024. We are encouraged by these orders, as we continue to fund both research and development and sales and marketing activities, including direct engagementwith multiple potential customers, highly focused on penetrating key market opportunities.”

    First Quarter 2024 Financial Performance

    • Revenue of $4.9 million, down $3.8 million or 43.4% year over year primarily due to lower system revenues.
    • Gross profit margin percentage was 17.5% due to lower gross profit margins on certain contracts in progress at our CVD Equipment segment partially offset by higher gross profit margins by our SDC segment.
    • Operating loss of $1.6 million.
    • Net loss of $1.5 million or $0.22 basic and diluted share, compared to a net loss of $40,000 or $0.01 per basic and diluted share for the prior year first quarter.
    • Cash and cash equivalents of $11.9 million as of March 31, 2024 as compared to $14.0 million as of December 31, 2023.

    First Quarter 2024 Operational Performance

    • Orders for the first quarter were $13.5 million primarily driven by demand in the aerospace sector and in our SDC segment for gas delivery equipment.
    • As mentioned above we received these important orders in the quarter:
      • An order for our new PVT200™ system used to grow silicon carbide crystals for the manufacture of 200 mm wafers. This represents our second customer for our PVT equipment that the customer will evaluate for potential additional orders.
      • A multisystem order from an industrial customer for approximately $10 million that will be used for depositing a silicon carbide protective coating on OEM components, with systems      scheduled to ship in 2025.
    • During the first quarter, we implemented a plan to reduce our operating costs to be consistent with current customer demand. This resulted in a reductionin our work force in early January 2024. We continue to evaluate the demand for our products and opportunities to reduce our operating costs.

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  • Polar Semiconductor to Expand Bloomington Manufacturing Facility

    Polar Semiconductor to Expand Bloomington Manufacturing Facility

    8 Min Read

    Polar Semiconductor, the only U.S.-based manufacturer specializing in sensor, power, and high-voltage semiconductors, announced plans to expand its Bloomington, Minnesota manufacturing facility and branch into innovative technologies to serve new customers and markets. Polar expects to invest approximately $525 million in the expansion of the facility over the next two years, subject to receipt of appropriate approvals and federal, state, and local incentives.

    Polar has signed a non-binding preliminary memorandum of terms with the Department of Commerce, under which it would receive $120 million in proposed direct funding as part of the U.S. CHIPS and Science Act, and a $75 million investment from the State of Minnesota. In addition, Polar has entered into a definitive agreement pursuant to which Niobrara Capital and Prysm Capital are leading an equity investment of $175 million, enabling Polar to transition to a U.S.-owned merchant foundry. Polar plans to claim the Department of the Treasury’s Investment Tax Credit, which is expected to be up to 25% of qualified capital expenditures.

    Through these investments, Polar expects to:

    • Double its current U.S. production capacity of 200mm semiconductor wafers, increasing production from approximately 20,000 wafers per month to nearly 40,000 wafers per month;
    • Expand and modernize its facility with new automation and AI capabilities to become globally competitive through economies of scale;
    • Better serve customers in automotive, aerospace and defense, optoelectronics, MEMS, and medical devices in the U.S. with cutting-edge semiconductor products; and
    • Create over 160 new jobs to further strengthen Polar’s support of its community.

    Surya Iyer, President and COO of Polar Semiconductor, said, “We are very pleased to announce this historic investment in Minnesota semiconductor manufacturingOur expanded manufacturing facility will allow us to increase capacity and branch into innovative technologies to serve new customers and markets. Polar and its employees are grateful to the U.S. Department of Commerce and the State of Minnesota for their commitment to the future of American semiconductor manufacturing and appreciate the strong collaboration with the CHIPS Program Office, Minnesota Department of Employment and Economic Development (“DEED”), and the City of Bloomington, Minnesota, throughout this process. Polar is also pleased to welcome a significant equity investment from Niobrara Capital and Prysm Capital, which will allow the Company to become U.S.-owned, and for the continued support of our long-term partners, Sanken Electric and Allegro MicroSystems.”

    Chip Schorr, Founder and Managing Partner of Niobrara Capital, said, “Polar is positioned to enable many of America’s most critical industries, such as aerospace and defense, automotive and medical, to have a dedicated, high performance, low cost, onshore source of power semiconductors and sensors. We are pleased to be partnering with the company to support its growth and the growth of U.S. technology manufacturing leadership.”

    Jay Park, Co-Founder and Managing Partner of Prysm Capital, said “The public and private investment in Polar is a testament to the strength of Polar’s offering and team and a significant event for onshore technology investment in America. We are already seeing robust demand for Polar’s planned capacity that exceeds our expectations and reinforces our confidence in Polar.”

    “Thanks to President Biden’s leadership, with this announcement we are making taxpayer dollars go as far as possible to create jobs, secure our supply chains, and bolster manufacturing in Minnesota,” said U.S. Secretary of Commerce Gina Raimondo. “This proposed investment in Polar will crowd in private capital, which will help make Polar a U.S.-based, independent foundry. They will be able to expand their customer base and create a stable domestic supply of critical chips, made in America’s heartland.”

    “When President Biden signed the CHIPS and Science Act, he put a stake in the ground about the importance of semiconductor manufacturing in the United States,” said Assistant to the President for Science and Technology and Director of the White House Office of Science and Technology Policy Arati Prabhakar. “This is where the President’s leadership changes communities and changes lives. This proposed federal investment will catalyze $525 million from private companies and the state of Minnesota to create a healthy supply of made-in-Minnesota semiconductors that are essential to producing cars, electrical grids, defense systems, and more.”

    “The future of the semiconductor industry is being built right here in the United States, and Polar will be part of that innovation boom. Their high-voltage technology has critical customer end uses across the aerospace, automotive, and defense sectors, and this proposed investment would help them introduce new capabilities to manufacture the next generation of semiconductors,” said Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology Director Laurie E. Locascio.

    “If we want our country to continue leading the global economy, we must stay on the cutting edge of manufacturing. This landmark investment in Polar Semiconductor’s Bloomington facility will be a game changer for domestic semiconductor manufacturing,” said Senator Amy Klobuchar. “I’m proud to have worked with Polar Semiconductor to secure the resources needed to ensure Minnesota continues to be a leader in advanced manufacturing for decades to come.”

    Governor Tim Walz said, “As a top state for innovation, education, and workforce training, Minnesota has an established reputation as a leader in the growing high-tech economy. We have been consistent and creative in our support for companies like Polar that want to establish and grow their businesses here in Minnesota. We’re grateful to the Commerce Department for its commitment to Minnesota’s future and its partnership with our state.”

    The $75 million state award is through the Minnesota Forward Fund, a new DEED program Gov. Walz signed into law last year to invest $400 million in business growth and attract new companies to Minnesota. It also provides matching funds for companies seeking federal resources like CHIPS Act funding. This is the Minnesota Forward Fund’s first award.

    “The Minnesota Forward Fund is one of the ways the Walz-Flanagan Administration is supporting innovative companies like Polar Semiconductor that are helping build Minnesota’s cutting-edge economy,” said DEED Commissioner Matt Varilek. “The number of semiconductor companies in Minnesota is growing, and they’re creating hundreds of new, high-paying jobs every year. I appreciate the Commerce Department’s support as we make this innovative industry even stronger.”

    Polar Semiconductor is a leader of the Minnesota CHIPS Coalition, formed by the GREATER Minneapolis–Saint Paul Partnership, the economic development partnership for the 15-county region, in late 2022 after the passage of the federal CHIPS and Science Act. Composed of more than 70 organizations, including manufacturers, supply-chain partners, education and training providers, labor organizations, and state and local governments, the coalition is determined to reinvigorate the region’s legacy in technology and establish the Midwest’s semiconductor industry as a national leader.

    “As a key leader in the Minnesota CHIPS Coalition, Polar Semiconductor is accelerating the growth of Minnesota’s existing semiconductor and microelectronics industry with their investment in Bloomington,” said Peter Frosch, President and CEO of the GREATER MSP Partnership. “Together with Polar and more than 70 organizations across industry, government, academia, and community, we have a shared ambition to double the size of the semiconductor and microelectronics industry in Minnesota by adding 10,000 more great jobs. The State of Minnesota’s $250 million match funds for CHIPS, along with federal grants, makes us ready to scale the industry here in Minnesota.”

    Polar is leading the Minnesota CHIPS Coalition Workforce Partnership, in collaboration with semiconductor ecosystem companies, educational institutions, employment and training organizations, the Governor’s Workforce Development Board (GWDB), and DEED to develop the high-tech manufacturing workforce of the next generation.

    Educational institution partners include the University of Minnesota, University of St. Thomas, Minnesota State College and University System, private technical colleges, and several high school systems in the state. The workforce partnership is already creating impact through training, upskilling, and apprenticeship programs, and will continue to build on its successful collaborative model, partially supported by investments from the State and CHIPS funding.

    $1.6 million of Polar’s CHIPS award will be allocated towards its workforce development efforts. Additionally, the workforce partnership expects to leverage preeminent nationwide programs, for example SCALE (Indiana-based DoD program), to boost and supplement local efforts.

    “Bloomington has always been a place where innovation thrives. Polar Semiconductor’s significant private investment in expanding its facilities, with potential direct funding from the CHIPS and Science Act and a substantial investment by the State of Minnesota, will boost our local economy and will contribute to the growth and vibrancy of semiconductor manufacturing in Bloomington,” said Bloomington Mayor Tim Busse. “We’re excited to see the tangible benefits of these investments right here in our city, bringing jobs and new opportunities for our workforce and community.”

    Original – Polar Semiconductor

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  • SK siltron to Open Semiconductor School in Gumi

    SK siltron to Open Semiconductor School in Gumi

    3 Min Read

    SK siltron announced the signing of an agreement with the city of Gumi and the Gumi Chamber of Commerce and Industry that will help foster the next generation of semiconductor professionals in the Gumi region through the “Semiconductor School” program.

    The signing ceremony took place at the Gumi Chamber of Commerce and Industry on May 7, and was attended by the Director of Gumi’s Economy & Industry Bureau, Yoo Kyung-sook; Secretary-General of the Gumi Chamber of Commerce and Industry, Jang Dong-ki; and External Cooperation Director for SK siltron, Cho Kyung-chul. The tri-party partnership between SK siltron, Gumi, and the Gumi Chamber of Commerce and Industry will educate approximately 2,700 students from 12 high schools in Gumi to become future semiconductor professionals.

    In July of last year, the Korean government designated several “specialized semiconductor complexes” to reinforce the security of semiconductor supply networks and the national economy. Gumi has the only specialized semiconductor complex outside of the Seoul area. The new Semiconductor School will familiarize students with Gumi’s specialized semiconductor complex, which supplies semiconductor essentials such as wafers and substrates.

    Students will also be provided with lessons about the present and future of the semiconductor industry, and semiconductor processes and technologies. Students will also enjoy support with choosing their career path, as they will be able to take advantage of study and work opportunities in Gumi’s semiconductor industry. The SK siltron Semiconductor School is an advanced arm of the SK siltron-run Wafer School, a program which introduces elementary and middle school students to the world of semiconductors. The Wafer School has been running since 2019.

    Enlistment of high schools to participate in the SK siltron Semiconductor School has taken place since April this year with the support of Gumi’s Office of Education. SK siltron staff and local university students majoring in semiconductors will be trained to become lecturers for the Semiconductor School. Approximately 100 classes are scheduled to be given at selected Gumi high schools between July and September.

    “As Gumi is a designated specialized semiconductor complex, we will be able to foster local semiconductor professionals who can help Gumi’s semiconductor industry grow into one of the biggest industries in the region,” said Yoo Kyung-sook, Director of Gumi’s Economy & Industry Bureau.

    “The SK siltron Semiconductor School is of monumental significance to Gumi, as SK siltron is a semiconductor company based in the city,” said Jang Dong-ki, Secretary-General of the Gumi Chamber of Commerce and Industry. “We will provide our full support for the growth of all semiconductor companies in the Gumi region.”

    Since 2019, SK siltron has run its Wafer School for some 9,300 elementary and middle school students in Korea to introduce them to semiconductors as a possible career. The Wafer School imparts basic knowledge of semiconductors and wafers, and supports interested students in exploring career options in the industry. This year, the Wafer School has been in session for around 2,900 students from 17 middle schools in Gumi since April.

    Original – SK siltron

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