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Infineon Technologies Accelerates 300mm GaN Production to Cement Leadership in Next-Gen Power Semiconductors

Infineon Technologies Accelerates 300mm GaN Production to Cement Leadership in Next-Gen Power Semiconductors

July 2, 2025 Comments Off on Infineon Technologies Accelerates 300mm GaN Production to Cement Leadership in Next-Gen Power Semiconductors
Navitas Partners with Powerchip to Launch High-Volume 200mm GaN-on-Silicon Production for AI, EV, and Energy Markets

Navitas Partners with Powerchip to Launch High-Volume 200mm GaN-on-Silicon Production for AI, EV, and Energy Markets

July 1, 2025 Comments Off on Navitas Partners with Powerchip to Launch High-Volume 200mm GaN-on-Silicon Production for AI, EV, and Energy Markets
Renesas Unveils Gen IV Plus 650V GaN FETs for Multi-kW AI Data Centers and Power Systems, Marking First Major Launch Post-Transphorm Acquisition

Renesas Unveils Gen IV Plus 650V GaN FETs for Multi-kW AI Data Centers and Power Systems, Marking First Major Launch Post-Transphorm Acquisition

July 1, 2025 Comments Off on Renesas Unveils Gen IV Plus 650V GaN FETs for Multi-kW AI Data Centers and Power Systems, Marking First Major Launch Post-Transphorm Acquisition
Okmetic Produces First Wafers from €400M Vantaa Fab Expansion, Doubling 200mm Capacity for MEMS, RF, and Power Devices

Okmetic Produces First Wafers from €400M Vantaa Fab Expansion, Doubling 200mm Capacity for MEMS, RF, and Power Devices

June 30, 2025 Comments Off on Okmetic Produces First Wafers from €400M Vantaa Fab Expansion, Doubling 200mm Capacity for MEMS, RF, and Power Devices
Renesas Converts $2.06B Wolfspeed Deposit into Equity and Debt Amid Restructuring, Faces Estimated ¥250B Loss

Renesas Converts $2.06B Wolfspeed Deposit into Equity and Debt Amid Restructuring, Faces Estimated ¥250B Loss

June 23, 2025 Comments Off on Renesas Converts $2.06B Wolfspeed Deposit into Equity and Debt Amid Restructuring, Faces Estimated ¥250B Loss
Wolfspeed Announces Major Debt Restructuring to Slash Liabilities by $4.6B and Strengthen Position as SiC Leader amid Chapter 11 Filing Plan

Wolfspeed Announces Major Debt Restructuring to Slash Liabilities by $4.6B and Strengthen Position as SiC Leader amid Chapter 11 Filing Plan

June 23, 2025 Comments Off on Wolfspeed Announces Major Debt Restructuring to Slash Liabilities by $4.6B and Strengthen Position as SiC Leader amid Chapter 11 Filing Plan
Texas Instruments Announces Historic $60 Billion U.S. Investment into Seven Semiconductor Fabs Across Texas and Utah, Creating Over 60,000 Jobs

Texas Instruments Announces Historic $60 Billion U.S. Investment into Seven Semiconductor Fabs Across Texas and Utah, Creating Over 60,000 Jobs

June 18, 2025 Comments Off on Texas Instruments Announces Historic $60 Billion U.S. Investment into Seven Semiconductor Fabs Across Texas and Utah, Creating Over 60,000 Jobs
ROHM Powers NVIDIA’s Leap to 800 V AI Infrastructure with Optimized SiC, GaN and Silicon MOSFET Solutions

ROHM Powers NVIDIA’s Leap to 800 V AI Infrastructure with Optimized SiC, GaN and Silicon MOSFET Solutions

June 13, 2025 Comments Off on ROHM Powers NVIDIA’s Leap to 800 V AI Infrastructure with Optimized SiC, GaN and Silicon MOSFET Solutions

Latest News

Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications
LATEST NEWSPRODUCT & TECHNOLOGYSiCWBG

Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications

July 10, 2025 Comments Off on Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications
2 Min Read

Nexperia announced the addition of two 1200 V 20 A silicon carbide (SiC) Schottky diodes to its continuously expanding portfolio of power electronics components. The PSC20120J and PSC20120L have been designed to address the demand for ultra-low power loss rectifiers which enable high-efficiency energy conversion in industrial applications. As such they are ideally suited for the power supply units (PSUs) in power-intensive artificial intelligence (AI) server infrastructure, telecommunications equipment and solar inverter applications.

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ROHM Unveils Level 3 SPICE Models for SiC MOSFETs with 50% Faster, High-Accuracy Circuit Simulations

ROHM Unveils Level 3 SPICE Models for SiC MOSFETs with 50% Faster, High-Accuracy Circuit Simulations

July 10, 2025 Comments Off on ROHM Unveils Level 3 SPICE Models for SiC MOSFETs with 50% Faster, High-Accuracy Circuit Simulations
EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones

EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones

July 10, 2025 Comments Off on EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones
Vishay Unveils Compact Gen 3 SiC Schottky Diodes With High Creepage, Low Capacitance for High-Speed Power Designs

Vishay Unveils Compact Gen 3 SiC Schottky Diodes With High Creepage, Low Capacitance for High-Speed Power Designs

July 9, 2025 Comments Off on Vishay Unveils Compact Gen 3 SiC Schottky Diodes With High Creepage, Low Capacitance for High-Speed Power Designs
Aehr Test Systems Announced FY 2025 Results

Aehr Test Systems Announced FY 2025 Results

July 8, 2025 Comments Off on Aehr Test Systems Announced FY 2025 Results
Toshiba Unveils AI-Optimized Resin-Insulated SiC Power Module with 21% Better Thermal Performance and 61% Smaller Cooling Needs

Toshiba Unveils AI-Optimized Resin-Insulated SiC Power Module with 21% Better Thermal Performance and 61% Smaller Cooling Needs

July 7, 2025 Comments Off on Toshiba Unveils AI-Optimized Resin-Insulated SiC Power Module with 21% Better Thermal Performance and 61% Smaller Cooling Needs
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WBG NEWS

Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications

Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications

July 10, 2025 Comments Off on Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications
ROHM Unveils Level 3 SPICE Models for SiC MOSFETs with 50% Faster, High-Accuracy Circuit Simulations

ROHM Unveils Level 3 SPICE Models for SiC MOSFETs with 50% Faster, High-Accuracy Circuit Simulations

July 10, 2025 Comments Off on ROHM Unveils Level 3 SPICE Models for SiC MOSFETs with 50% Faster, High-Accuracy Circuit Simulations
EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones

EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones

July 10, 2025 Comments Off on EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones
Vishay Unveils Compact Gen 3 SiC Schottky Diodes With High Creepage, Low Capacitance for High-Speed Power Designs

Vishay Unveils Compact Gen 3 SiC Schottky Diodes With High Creepage, Low Capacitance for High-Speed Power Designs

July 9, 2025 Comments Off on Vishay Unveils Compact Gen 3 SiC Schottky Diodes With High Creepage, Low Capacitance for High-Speed Power Designs
Toshiba Unveils AI-Optimized Resin-Insulated SiC Power Module with 21% Better Thermal Performance and 61% Smaller Cooling Needs

Toshiba Unveils AI-Optimized Resin-Insulated SiC Power Module with 21% Better Thermal Performance and 61% Smaller Cooling Needs

July 7, 2025 Comments Off on Toshiba Unveils AI-Optimized Resin-Insulated SiC Power Module with 21% Better Thermal Performance and 61% Smaller Cooling Needs
Infineon Technologies Accelerates 300mm GaN Production to Cement Leadership in Next-Gen Power Semiconductors

Infineon Technologies Accelerates 300mm GaN Production to Cement Leadership in Next-Gen Power Semiconductors

July 2, 2025 Comments Off on Infineon Technologies Accelerates 300mm GaN Production to Cement Leadership in Next-Gen Power Semiconductors
Navitas Partners with Powerchip to Launch High-Volume 200mm GaN-on-Silicon Production for AI, EV, and Energy Markets

Navitas Partners with Powerchip to Launch High-Volume 200mm GaN-on-Silicon Production for AI, EV, and Energy Markets

July 1, 2025 Comments Off on Navitas Partners with Powerchip to Launch High-Volume 200mm GaN-on-Silicon Production for AI, EV, and Energy Markets
Renesas Unveils Gen IV Plus 650V GaN FETs for Multi-kW AI Data Centers and Power Systems, Marking First Major Launch Post-Transphorm Acquisition

Renesas Unveils Gen IV Plus 650V GaN FETs for Multi-kW AI Data Centers and Power Systems, Marking First Major Launch Post-Transphorm Acquisition

July 1, 2025 Comments Off on Renesas Unveils Gen IV Plus 650V GaN FETs for Multi-kW AI Data Centers and Power Systems, Marking First Major Launch Post-Transphorm Acquisition

FINANCIAL RESULTS

Aehr Test Systems Announced FY 2025 Results

Aehr Test Systems Announced FY 2025 Results

July 8, 2025 Comments Off on Aehr Test Systems Announced FY 2025 Results
Soitec Reports FY2025 Results

Soitec Reports FY2025 Results

May 27, 2025 Comments Off on Soitec Reports FY2025 Results
Analog Devices Reports Q2 FY2025 Results

Analog Devices Reports Q2 FY2025 Results

May 22, 2025 Comments Off on Analog Devices Reports Q2 FY2025 Results
Applied Materials Announced Q2 2025 Results

Applied Materials Announced Q2 2025 Results

May 16, 2025 Comments Off on Applied Materials Announced Q2 2025 Results
Toshiba Announced FY 2024 Results

Toshiba Announced FY 2024 Results

May 16, 2025 Comments Off on Toshiba Announced FY 2024 Results
Ideal Power Reports Q1 2025 Financial Results

Ideal Power Reports Q1 2025 Financial Results

May 16, 2025 Comments Off on Ideal Power Reports Q1 2025 Financial Results
Nexperia Announced FY 2024 Results

Nexperia Announced FY 2024 Results

May 15, 2025 Comments Off on Nexperia Announced FY 2024 Results
CVD Equipment Reports Q1 2025 Financial Results

CVD Equipment Reports Q1 2025 Financial Results

May 14, 2025 Comments Off on CVD Equipment Reports Q1 2025 Financial Results
Magnachip Reports Q1 2025 Results

Magnachip Reports Q1 2025 Results

May 13, 2025 Comments Off on Magnachip Reports Q1 2025 Results
SMIC Reports Q1 2025 Financial Results

SMIC Reports Q1 2025 Financial Results

May 8, 2025 Comments Off on SMIC Reports Q1 2025 Financial Results

PRODUCT & TECHNOLOGY NEWS

View All

Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications
LATEST NEWSPRODUCT & TECHNOLOGYSiCWBG

Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications

July 10, 2025 Comments Off on Nexperia Launches 1200V SiC Schottky Diodes for High-Efficiency AI Servers, Telecom, and Solar Applications
2 Min Read

Nexperia announced the addition of two 1200 V 20 A silicon carbide (SiC) Schottky diodes to its continuously expanding portfolio of power electronics components. The PSC20120J and PSC20120L have been designed to address the demand for ultra-low power loss rectifiers which enable high-efficiency energy conversion in industrial applications. As such they are ideally suited for the power supply units (PSUs) in power-intensive artificial intelligence (AI) server infrastructure, telecommunications equipment and solar inverter applications.

Continue Reading →
EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones
GaNLATEST NEWSPRODUCT & TECHNOLOGYWBG

EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones

July 10, 2025 Comments Off on EPC Unveils First GaN IC-Based Humanoid Joint Inverter, Shrinking Size by 66% for Robotics and Drones
2 Min Read

Efficient Power Conversion Corporation (EPC) introduced EPC91118, the first commercially available reference design to integrate gallium nitride (GaN) IC technology for humanoid robot motor joints. Optimized for space-constrained and weight-sensitive applications such as humanoid limbs and compact drone propulsion, the EPC91118 delivers up to 15 ARMS per phase from a 15 V to 55 V DC input in an ultra-compact circular form factor.

Continue Reading →

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Power Semiconductors Weekly Vol 127

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  • Power Semiconductors Weekly - 2025