Axcelis Technologies, Inc. announced the shipment of the Company’s Purion EXE SiC Power Series™ 200mm high energy implanter to a leading SiC power device chipmaker located in Japan. The system will be used in high volume production of SiC power devices for use in automotive applications.

Executive Vice President of Marketing and Applications, Greg Redinbo, commented, “The power device market is one of the fastest growing segments in IC manufacturing, due in part to the robust growth in the electric vehicles market. The power device market is at a critical inflection point as chipmakers transition from 150mm to 200mm SiC wafers.

The Purion Power Series family is uniquely suited to excel at these applications due to its innovative platform that offers the flexibility to handle multiple wafer sizes, various substrate types and operate at various implant temperatures. We look forward to continuing to expand the Purion platform footprint in Japan and supporting our customers’ goals to increase their manufacturing capacity.”

Original – Axcelis Technologies