Direct Copper Interconnection for Advanced Semiconductor Technology

In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low temperature direct copper bonding, in particular, will become widely adopted for a broad range of high performance semiconductor devices in the years to come.