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The latest spice simulation and design tools for creating state-of-the-art switching power supplies. Fully updated to incorporate new SPICE features and capabilities, this practical guide explains, step by step, how to simulate, test, and improve switch-mode power supply designs. Detailed formulas with founding equations are included. Based on the author’s continued research and in-depth, hands-on work in the field, this revised resource offers a collection of the latest SPICE solutions to the most difficult problem facing power supply designers: creating smaller, more heat-efficient power supplies in shorter design cycles.
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Semiconductor Modeling: For Simulating Signal, Power, and Electromagnetic Integrity gives designers and engineers a broad view of using semiconductor models to design high-speed circuit boards. Most issues in the field of designing high-frequency circuits, from the beginning of modeling and simulation using EDA tools to future trends, are discussed and integrated.
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This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
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Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage of the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information and hybrid electric vehicles.
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Offering step-by-step, in-depth coverage, the new Third Edition of Power Electronics: Converters, Applications, and Design provides a cohesive presentation of power electronics fundamentals for applications and design in the power range of 500 kW or less. The text describes a variety of practical and emerging power electronic converters made feasible by the new generation of power semiconductor devices.
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This book introduces the basics of entrepreneurship and a methodology for the study of entrepreneurship in electrical engineering and other engineering fields. Entrepreneurship is considered here in three fields of electrical engineering, viz. power semiconductor devices, power electronics and electric machines and drive systems, and their current practice. It prepares the reader by providing a review of the subject matter in the three fields, their current status in research and development with analysis aspect as needed, thus allowing readers to gain self-sufficiency while reading the book.
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This book relates the recent developments in several key electrical engineering R&D labs, concentrating on power electronics switches and their use. The first sections deal with key power electronics technologies, MOSFETs and IGBTs, including series and parallel associations. The next section examines silicon carbide and its potentiality for power electronics applications and its present limitations. Then, a dedicated section presents the capacitors, key passive components in power electronics, followed by a modelling method allowing the stray inductances computation, necessary for the precise simulation of switching waveforms.
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The book covers thyristor controlled drives, single phase semi and fully controlled converters connected to separately excited and D.C series motors – continuous current operation – output voltage and current wave-forms – speed and torque expressions – speed – torque characteristics – problems on converter fed d.c motors.
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Recent advances in robotics, automatic control and power conditioning systems have prompted research into increasingly sophisticated power semiconductor devices. This cutting-edge text explores the design, physical processes and applications performance of current power semiconductor devices. The extensive scope covers the complete range of discrete and integrated devices now available.
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This book addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.
