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Danfoss has appointed Kern Jain as President of Danfoss Power Electronics, effective August 1, 2026. Jain succeeds Dominic Dorfner, who has left the company at his own request following a planned leadership transition.
Jain has been with the Danfoss Group for three years and most recently served as Segment CFO of Danfoss Power Electronics and Drives. He previously served as a board member of Semikron Danfoss and brings more than 20 years of experience across global technology and pharmaceutical companies.
The transition was prepared over several months, with Jain and Dorfner working together to ensure continuity. This included Jain meeting customers and colleagues at the PCIM Europe Expo & Conference in Nuremberg ahead of formally assuming the role.
As President, Jain will lead the business unit responsible for developing and marketing Danfoss’ power electronics products and solutions. The unit plays a central role in the group’s electrification strategy, serving applications that require advanced power conversion technologies.
The leadership change coincides with the renaming of the business unit from Semikron Danfoss to Danfoss Power Electronics, reinforcing its position within the Danfoss Group’s core electrification business. The established Semikron Danfoss brand will continue to be used for products and solutions.
Within the broader Danfoss Power Electronics and Drives segment, the company now operates two distinct businesses: Danfoss Drives and Danfoss Power Electronics.
Mika Kulju, President of Danfoss Power Electronics and Drives and Chairman of the Danfoss Power Electronics Board, highlighted Jain’s existing knowledge of the power electronics business as an important factor in ensuring leadership continuity and advancing the company’s strategic priorities.
Jain said Danfoss Power Electronics sits at the heart of the group’s electrification portfolio and emphasized its role in creating value for customers as demand for power electronics and electrification solutions continues to develop.
Original – Semikron Danfoss
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Semikron Danfoss has announced the initiation of patent enforcement proceedings in Germany concerning its patent DE 10 2017 218 875 C5, which covers key aspects of the company’s DCM power module technology.
The DCM platform represents a core element of Semikron Danfoss’ power semiconductor portfolio and is widely deployed across a broad range of power electronics applications.
According to the company, ongoing market monitoring activities have identified products that it believes utilize technology protected under the patent. As a result, Semikron Danfoss is pursuing these matters through the appropriate legal channels.
As part of the Danfoss Group, the company continues to invest significantly in the development of advanced technologies and regards the protection of intellectual property as a fundamental component of innovation, fair competition, and the delivery of high-quality solutions to customers.
Semikron Danfoss stated that it will continue to enforce its intellectual property rights in a consistent and proportionate manner, in accordance with the policies and principles of the Danfoss Group.
The company added that it will not provide further comment regarding the details of the ongoing legal proceedings at this stage.
Original – Semikron Danfoss
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Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration focused on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The initiative aims to combine Nexperia’s expertise in SiC semiconductor technology with Semikron Danfoss’ capabilities in power module packaging and integration to evaluate the development of high-performance, scalable solutions for next-generation electric vehicles.
As the automotive industry continues to increase the adoption of SiC technology in electric drivetrains, the demand for solutions that improve efficiency, power density, and overall vehicle performance continues to grow. Through this collaboration, the two companies intend to leverage their complementary strengths across the value chain, from semiconductor devices to fully integrated power modules, to address the evolving requirements of automotive applications.
The companies will explore joint engineering approaches, including early-stage integration and co-design methodologies, with the objective of maximizing the performance potential of SiC-based power systems.
Commenting on the agreement, Carsten Götte, Senior Vice President of the Automotive Power Modules Division at Semikron Danfoss, said the combination of Nexperia’s semiconductor expertise and Semikron Danfoss’ module capabilities creates an opportunity to explore solutions that could deliver additional value to customers in the rapidly developing electric vehicle market.
Edoardo Merli, Senior Vice President and Head of the Wide Bandgap, IGBT & Modules (WIM) Business Group at Nexperia, highlighted the importance of industry partnerships in advancing the adoption of wide-bandgap technologies such as SiC and gallium nitride (GaN). He noted that Nexperia’s ongoing investments in research and development, together with a focus on early-stage collaboration, support the alignment of semiconductor and system requirements from the outset of product development.
The Memorandum of Understanding was signed on June 8, 2026, by Stefan Tilger, Nexperia’s Interim Chief Executive Officer, and Carsten Götte, Senior Vice President of the Semikron Danfoss Automotive Power Modules Division.
Both companies share strong European roots and extensive experience in the power electronics industry, providing a foundation for exploring future opportunities in automotive power semiconductor and module technologies.
Original – Semikron Danfoss
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Semikron Danfoss and Mitsubishi Electric Corporation have jointly developed a new standard package for power modules featuring integrated 3-level circuit technology. The package has been designed to address the growing demand for high-efficiency power conversion solutions in industrial drive systems and renewable energy applications.
The new package combines key elements of Semikron Danfoss’ established SEMITRANS 20 platform and Mitsubishi Electric’s LV100-type package. By incorporating an optimized terminal layout specifically tailored for 3-level circuits while maintaining compatibility between both platforms, the new design aims to support inverter standardization and provide customers with greater flexibility in supply chain management.
Designed to support both IGBT and silicon carbide (SiC) technologies, the package is suitable for voltage classes up to 3.3 kV, enabling its use across a broad range of high-power applications.
The development comes as industries worldwide continue to pursue higher energy efficiency and carbon reduction targets. Increasing adoption of 3-level inverter topologies has been driven by their ability to improve energy efficiency while enabling more compact system designs. To support this trend, Semikron Danfoss and Mitsubishi Electric collaborated to create a package that integrates a complete 3-level T-type circuit within a single power module.
Based on the proven SEMITRANS 20 and LV100-type platforms, the new package offers a standardized main terminal pinout and aligned functional interfaces, allowing customers to standardize inverter architectures while benefiting from compatibility across suppliers.
The package has been engineered to accommodate both conventional IGBT devices and next-generation SiC semiconductors, providing a scalable platform capable of supporting current and future power conversion requirements.
A key feature of the design is the integration of the complete 3-level T-type circuit into a single module. This approach eliminates the need for more complex multi-module configurations, simplifying inverter design while contributing to improved system efficiency and reduced inverter size.
The terminal arrangement has also been optimized to reduce parasitic inductance within the module and simplify busbar design. In addition, the package incorporates three auxiliary control terminals that streamline gate drive circuit implementation and provide increased design flexibility for high-power 3-level inverter systems.
Moving forward, Semikron Danfoss plans to develop its own product portfolio based on the new standard package, supporting broader inverter standardization efforts and expanding sourcing options for customers in industrial and renewable energy markets.
Original – Semikron Danfoss
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Danfoss has acquired the remaining shares in Semikron Danfoss, increasing its ownership from 62% to 100% and turning the former joint venture into a fully owned subsidiary.
The move supports Danfoss’ electrification strategy under its LEAP 2030 plan, which prioritizes investment in high-value growth areas such as advanced power electronics and industrial-scale electrification technologies.
With full ownership, Danfoss gains greater strategic control over Semikron Danfoss and aims to accelerate investments in technology leadership, advanced power modules, and large-scale power electronics systems. The company expects the transition from a joint venture structure to full ownership to strengthen its ability to serve key markets including industrial drives, renewable energy systems, data centers, energy storage, off-highway equipment, construction machinery, and commercial vehicles.
Danfoss stated that the ownership change will not affect day-to-day operations. Semikron Danfoss will continue operating with the same teams and leadership structure while maintaining its focus on delivering power semiconductor modules and power electronics solutions to global customers.
Semikron and Danfoss originally merged their power module businesses in March 2022 to create Semikron Danfoss, combining expertise in power semiconductors and industrial power electronics. Since the merger, Danfoss has continued investing in the company’s technology and manufacturing capabilities.
As part of the strategic realignment, Danfoss also announced plans to divest the Semikron Danfoss business focused on power modules for electric passenger cars. The company considers this segment non-core and intends to concentrate on industrial electrification markets and broader energy transition applications.
Original – Danfoss
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In a major step toward advancing renewable energy technologies, SMA Solar Technology AG has selected a new high-performance power module from Semikron Danfoss, integrating ROHM’s latest 2kV Silicon Carbide (SiC) MOSFETs. This collaboration marks a milestone in the evolution of high-voltage solar inverter solutions.
The new SEMITOP E1/E2 SiC power module from Semikron Danfoss combines compact design with cutting-edge 2kV-rated SiC MOSFETs from ROHM. Tailored specifically for solar applications, the solution addresses the rising demands for higher voltage, increased efficiency, and greater system reliability.
Key Benefits:
- Higher System Voltage: Enables 1500V DC systems with reduced derating margins, maximizing energy yield.
- Improved Efficiency: SiC technology dramatically reduces switching losses compared to traditional silicon, enhancing overall inverter performance.
- Compact Design: Supports smaller inverter footprints and lower system costs due to reduced cooling requirements and simpler circuitry.
- Extended Lifetime: Enhanced reliability and ruggedness, crucial for long-term solar energy deployments.
By adopting Semikron Danfoss’ advanced SiC modules, SMA positions itself at the forefront of the solar inverter industry, delivering more efficient and resilient solutions for the fast-growing global renewable energy market.
This partnership underlines the growing importance of wide-bandgap semiconductors like SiC in renewable energy applications. As the demand for high-efficiency, high-voltage solar inverters continues to soar, collaborations like this set new industry benchmarks for performance and sustainability.
Original – Semikron Danfoss
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For next-generation power electronics, BASF has developed a polyphthalamide (PPA) that is especially suited for manufacturing housings of IGBT (insulated-gate bipolar transistor) semiconductors. Ultramid® Advanced N3U41 G6 addresses the growing demand for high-performance, reliable electronic components for e.g., electric vehicles, high-speed trains, smart manufacturing and the generation of renewable energy.
Semikron Danfoss, a global technology leader in power electronics, now uses the BASF PPA as housing in its Semitrans 10 IGBT which can be installed in inverters of photovoltaic and wind energy systems. Due to its outstanding chemical resistance and dimensional stability, the Ultramid® Advanced N grade enhances the robustness, long-term performance and reliability of these IGBTs, thus meeting growing needs for energy saving, higher power density and increased efficiency. IGBTs enable efficient switching and control of electrical circuits in power electronics.
“IGBTs are a key element of modern electronics, particularly in the renewable energy sector,” explains Jörn Grossmann from research and predevelopment at Semikron Danfoss. “IGBTs must operate at higher temperatures while maintaining long-term stability and performance. The Semitrans 10 has set a new benchmark for performance and efficiency benefiting from the unique properties of BASF’s PPA. We chose this material because of its extraordinary electrical isolation even in harsh environments and because of its excellent robustness against short-term temperature peaks in the assembly process.” The combination of high-performance material and smart design allows for faster switching speeds, lower conduction losses, and improved thermal management, thus addressing key needs in power electronics.
In today’s IGBTs, BASF’s proven Ultradur® (PBT: polybutylene terephthalate) is widely used. The new PPA is designed to meet the stringent requirements of next-generation IGBTs for rapidly evolving power electronics. They demand materials that can withstand higher temperatures, provide sustained electrical insulation, and maintain dimensional stability under challenging environmental conditions like humidity, dust and dirt.
The laser-sensitive Ultramid® Advanced N3U41G6 with non-halogenated flame retardant combines high thermal stability with low water uptake and excellent electrical properties. It is characterized by a high CTI (Comparative Tracking Index) of 600 (acc. to IEC 60112): This supports miniaturization of IGBTs by lower creepage and better insulation than materials so far used for power switches. The UL-certified grade shows an excellent electrical RTI (Relative Temperature Index) value of 150°C.
“BASF’s PPA compound is globally available and ready for sampling”, says Jochen Seubert, senior application expert for power electronics at BASF. “Backed by our customer-focused technical support in part development, we expect this innovative material to significantly contribute to the advancement of power electronics, supporting the global transition to renewable energies.” For manufacturing of IGBTs, the BASF PPA is compatible with potting materials used to assemble the semi-conductors with metal pins and clamps after injection molding.
BASF’s polyphthalamide portfolio is based on the six polymers Ultramid® Advanced N (PA9T), Ultramid® Advanced T1000 (PA6T/6I), Ultramid® Advanced T2000 (PA6T/66), Ultramid® T KR (PA6T/6), Ultramid® T6000 (PA66/6T) and Ultramid® T7000 (PA/PPA). They open the door to the next generation of lightweight, high-performance plastic components in many different sectors including the automotive industry, electronics and electric devices, mechanical engineering and consumer goods.
The PPA portfolio is available globally and complemented by BASF’s Ultrasim® simulation tool and extensive experience in application development. It includes more than 50 compounded grades for injection molding and extrusion, products with or without flame retardants. The compounds are available in different colors, from colorless to laser-markable black, with short-glass, long-glass or mineral fiber reinforcement, and with various heat stabilizers.
Original – BASF
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Dominic Dorfner, Senior Vice President of the Automotive Division in Semikron Danfoss, will take over as President, when Claus A. Petersen retires on August 31, after 40 years in the Danfoss Group – the last 26 years leading Danfoss Silicon Power and Semikron Danfoss.
Dominic Dorfner has been named new President of Semikron Danfoss – a leading global manufacturer of power electronics based in Germany and part of the Danfoss Group. Dominic Dorfner joined Semikron Danfoss in 2021 as Head of the Industry Business in Danfoss Silicon Power. For the past 13 months he has been leading the Automotive Division in Semikron Danfoss.
Chairman of the Semikron Danfoss Board, Danfoss Power Electronics and Drives Segment president Mika Kulju says:
“The Board of Directors for Semikron Danfoss are very pleased that Dominic Dorfner has accepted the role as President. It is an important continuation of the work that has been done in Semikron Danfoss since the company was established two years ago with the merger of Danfoss Silicon Power and SEMIKRON. We are very excited to be working with him to continue the growth and realizing the huge potential for Semikron Danfoss in energy efficiency, in electrification, and in green energy.
Dominic Dorfner is taking over for Claus A. Petersen – a renowned name in the power electronics industry.
Claus A. Petersen has been with Danfoss for more than 40 years. He was named President of Semikron Danfoss when the merger was finalized in 2022. Before the merger he was leading Danfoss Silicon Power, a position he has held since the company was established in Schleswig-Holstein in 1998 with, at that time only around 20 employees. Today, Semikron Danfoss has around 4,000 global employees and annual sales over EUR 1 billion.
Though now retiring as company President, Claus A. Petersen is not completely leaving Semikron Danfoss, as he has joined the Board of Directors.
“We are fully committed to the ambitions and the strategy for Semikron Danfoss that has been developed under Claus’ leadership. I want to extend a big thank you to him, both for what he has accomplished, and for accepting to join the Board. This will ensure a very smooth and proficient transition,” says Mika Kulju, and continues: “Dominic Dorfner has big shoes to fill, but he has all the needed qualities to do so, and strong teams around him.”
Efficient power electronics are vital for decarbonization. Yet another reason why the new President of Semikron Danfoss is really excited about the challenge ahead.
Says Dominic Dorfner:
“Our purpose is to enable a huge transformation towards a CO2 neutral world for us and our kids. To do so, we need extensive electrification, we need green energy, and we need to save energy much more through energy efficiency. All that needs power electronics with the best power modules and systems out there. We can provide that, and I can’t think of a better reason to wake up early and go to work.”
First day in the new role for Dominic Dorfner will be September 1, 2024.
Original – Semikron Danfoss
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As the deployment of Energy Storage Systems (ESS) accelerates, there is a critical need for compact and high-efficiency Power Conversion Systems (PCS) optimized for ESS applications. To address this requirement, Semikron Danfoss K.K. and Headspring Inc. have joined forces to develop advanced PCS solutions specifically for ESS, targeting mass production by 2026. This collaboration aims to enable more efficient and space-saving storage solutions.
Energy Storage Systems are essential components for renewable energy and power grids, ensuring resilience and stable supply. The global ESS market is projected to grow by 20%-30% annually, with expectations to exceed 400 GWh of storage systems worldwide by 2030. This exponential growth is driven by the increasing share of renewable energy in the grid, necessitating the accelerated deployment of ESS solutions for stable grid operation.
To address this rapidly growing market, Semikron Danfoss is developing a series of adaptable power solutions. Central to this initiative is the ANPC (Active Neutral Point Clamping) topology for ESS, which demonstrates a significant performance improvement by reducing power loss by over 50% compared to traditional NPC/MLI topologies. However, to fully harness the potential of ANPC technology, collaboration with Headspring is crucial. Headspring’s expertise in high-speed controller technology is vital for effectively controlling ANPC systems and ensuring optimal performance.
Semikron Danfoss brings extensive expertise and innovation in power electronics to the ESS market. Their ANPC technology in LF/HF configuration, featuring a hybrid circuit of silicon IGBTs and silicon carbide MOSFETs, significantly enhances efficiency and cost performance. The availability of ANPC power modules in PCB-mountable, industry-standard housings reduces both material and assembly costs, making them ideal for high-volume production.
The ANPC power modules provided by the SEMITOP E2 platform offer superior thermal performance, contributing to the downsizing and high-capacity PCS for ESS. Semikron Danfoss aims to set new benchmarks in ESS performance and value with their comprehensive design package that supports improvements in both hardware and software.
Headspring excels in developing high-speed real-time controllers essential for power electronics applications. Headspring’s controllers combine commercial microcontrollers with FPGA technology, providing flexible programming tailored to the specific demands of power electronics applications. Headspring has participated in the Strategic Innovation Promotion Program (SIP) “Energy Systems for an IoT Society by Japan’s Cabinet Office,” leading the development of ultra-high-speed controllers for power electronics. These controllers, integrating high-speed multi-core CPUs, high-performance FPGAs, and high-speed AD converters, achieve a feedback control performance of 50MHz, approximately 1000 times faster than conventional systems.
Semikron Danfoss and Headspring are collaborating to develop a compact, high-efficiency PCS tailored for large-scale, scalable ESS applications by integrating Semikron Danfoss’s ANPC technology-based power modules with Headspring’s advanced controller technology. Semikron Danfoss will offer the expertise for developing the power stack, which includes power modules, drive circuits, and coolers, while Headspring will be responsible for the controllers, peripheral circuits, software, and PCS integration.
This synergy aims to create an ESS-specific PCS with optimized cost, efficiency, and size. A primary goal is to enable containerized ESS solutions to increase storage capacity per 20-foot container from 3.3MWh to 5MWh. This will establish a roadmap setting hardware and software benchmarks for ESS performance, delivering superior ESS solutions that promote the advancement of renewable energy technologies.
Original – Semikron Danfoss
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Semikron Danfoss and SMA announced that the Sunny Boy Smart Energy incorporates the SEMITOP E power modules based on silicon carbide. The SEMITOP E features a low-inductance design with superior thermal performance, all in an industry standard housing. The SEMITOP E product offers a variety of circuit topologies based on the latest 650V-1200V silicon carbide technology from multiple sources.
“We strongly believe that the SEMITOP E is the power semiconductor package of choice for applying silicon carbide in advanced solar inverters,” says Roberto Agostini, Product Manager Semikron Danfoss.
“The SEMITOP E has been essential in increasing throughput and efficiency in our assembly,” says SMA Product Manager Petra Nawratil. “The press-fit design and simple mounting approach enabled a higher automation level in the assembly line for the Sunny Boy Smart Energy and following products.”
Residential solar inverters are tasked with generating solar power with the highest efficiency, enabled through silicon carbide technology.
The Sunny Boy Smart Energy is part of the new SMA Home Storage Solution, which enables fast and effective solar generation and storage. It is scalable to meet changing needs and adaptable to additional use cases such as an EV charger, a heat pump, dynamic tariffs, or peak load shaving. The modular SMA Home Storage battery can be expanded anytime to store more solar power.
Original – Semikron Danfoss
