Power Semiconductors Weekly Blog is a series of articles and newscasts covering the latest news from power semiconductors industry. Delivered to you every month by Alexey Cherkasov, Power Semiconductors Weekly brings you the most interesting events in the world of power semiconductors and power electronics. Now you will never miss any major power semiconductors product release, technology update or market trends and news.

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Power Semiconductors Weekly Vol 126

Christmas Newscast Overview:

Market News

• Power Semiconductors Weekly Platform Updates
• Preferred Semiconductor Technology for the EVs
• December Top 5 Power Semiconductors News

Preferred Semiconductor Technology for the EVs in the Next 3-5 Years

Preferred Semiconductor Technology for the EVs in the Next 3-5 Years

In my recent poll I asked the industry community to share their thoughts on the leading semiconductor technology for EV industry in the next 5 years. As expected, WBG semiconductors dominate with silicon accounting only for 5%.

Most Promising Application for Silicon Carbide Power Semiconductors

Most Promising Application for SiC

In my recent poll I asked the industry community to share their thoughts on what industries will benefit most by using the latest silicon carbide semiconductor technology.

Power Semiconductor Manufacturers Landscape

Power Semiconductors Manufacturers Landscape

About a year ago I published my research on the global power semiconductor manufacturers landscape. In 2022 my database included over 150 companies who produced power devices (power MOSFETs, IGBTs, thyristors, diodes).

Power Semiconductors Weekly Vol 125

December Newscast Overview:

Market News

  • Most Promising Application for SiC
  • Anwenderforum Leistungshalbleiter 2023
  • Bodo’s Wide Bandgap Event
  • November Top 5 Power Semiconductors News
Power Semiconductors Weekly Vol 124

November Newscast Overview:

Market News

  • Anwenderforum Leistungshalbleiter 2023
  • E-CHARGE 2023
  • Power Semiconductors Manufacturers
  • Top 5 Power Semiconductors News 2023

Power semiconductors weekly Vol 123

October Newscast Overview:

Market News

  • Welcome to EPE 2023
  • Resurgence and Future of European Semiconductor Landscape
  • Why Silicon Carbide (SiC) Still Lags Behind Silicon (Si)?
  • Top 5 Power Semiconductors News September 2023

Silicon Carbide Barriers Poll Data

Why Silicon Carbide Still Lags Behind Silicon?

Despite the fast growth and penetration into the power electronics market, many companies still feel uncomfortable when they hear about silicon carbide and the benefits it has. Find out why SiC still lags behind Si.

Choosing a Supplier of SiC Power Devices for Vehicle Electrification

Choosing a Supplier of SiC Power Devices for Vehicle Electrification

Previously, silicon IGBT modules served as the heart of electronic control systems with their relatively high switching speed and low conduction loss. But with the growth of silicon carbide technology, EVs step into the new era of electrification.

Power semiconductors weekly Vol 122

September Newscast Overview:

Power Semiconductors Weekly

  • Platform Updates

Market News

  • Welcome to EPE 2023
  • Semiconductor Industry Challenge
  • What is Most Important When Choosing a Supplier of SiC Power Devices for Vehicle Electrification?
  • Top 5 Power Semiconductors News August 2023

Power semiconductors weekly_Vol 121

August Newscast Overview:

Power Semiconductors Weekly

  • New Functions Added. More to Come.

Market News

  • Power Semiconductors Investment Projects Surpass 70 b USD
  • Frost & Sullivan WBG Semiconductors Think Tank: Overcoming Challenges, Unlocking Potential
  • Welcome to ISES EU Power 2023
  • Top 5 Power Semiconductors News July 2023

Power semiconductors weekly Vol 120
  • Vitesco Technologies And ROHM Have Signed a Long-Term SiC Supply Partnership
  • Toyoda Gosei Develops Horizontal GaN Power Device of World-Class High-Voltage, High-Speed Operation
  • Airbus and STMicroelectronics Collaborate on Power Electronics for Aircraft Electrification
  • Toshiba Launches 600V Super Junction N-channel Power MOSFET Series with Ultra-Low RDS(on)
  • Chinese SiC Power Device Provider AscenPower Mass Produces SiC Chips for Vehicle and Industrial Control
  • Alpha and Omega Semiconductor Announces Logo Redesign that Reflects its Commitment to Developing Cutting-Edge Power Management Solutions
Power semiconductors weekly Vol 119
  • Toshiba Releases 600V Super Junction Structure N-Channel Power MOSFET
  • Mitsubishi Electric to Ship Samples of NX-type Full-SiC Power Semiconductor Modules for Industrial Equipment
  • Infineon Releases Next Generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 Package to Boosts e-Mobility
  • Nexperia Launches E-mode GAN FETs for Low and High-voltage Applications
  • SK Powertech Adopts Silvaco’s Victory TCAD Solution for the Development of NextGen SiC Power Devices
  • Chinese Cities Back Compound Semiconductor Industry as Demand Grows
Power semiconductors weekly Vol 118
  • GE Scientists Demonstrate Ultra-High Temperature SiC MOSFET Electronics
  • Simulation Model of Industry’s First 1200 V GaN-on-Sapphire Device Released by Transphorm
  • Nidec and Renesas Collaborate on Semiconductor Solutions for Next-Generation E-Axle for EVs
  • GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France
  • STMicroelectronics and Sanan Optoelectronics to Advance Silicon Carbide Ecosystem in China
  • Wolfspeed Webinar: Understanding Wolfspeed’s WolfPACK™ Power Module Family: Your Questions Answered!
Power semiconductors weekly Vol 117
  • Mitsubishi Electric Develops SBD-embedded SiC-MOSFET with New Structure for Power Modules
  • Navitas Initiates Strategic Manufacturing Investments
  • Vitesco Technologies and onsemi Sign SiC Long-Term Supply Agreement and Agree to Invest In SiC Technology Capacity Expansion
  • iDEAL Semiconductor Launches SuperQ™ Technology, Ushering in a New Era of Power Device Performance in Silicon
  • Danfoss to Further Tap Green Biz Opportunities in China
  • Magnachip Announces Plan to Separate Display and Power Businesses
  • Semikron Danfoss Webinar: Silicon Carbide in AC Motor Drives
Power semiconductors weekly Vol 116
  • Orbray and MIRISE Technologies Collaborate on Diamond Power Devices
  • Analog Devices Announces Investment of €630 Million in Next Generation Semiconductor R&D and Manufacturing Facility in Limerick
  • Coherent and Mitsubishi Electric Collaborate to Scale Manufacturing of SiC Power Electronics on 200 mm SiC Technology Platform
  • onsemi and Sineng Electric Spearhead the Development of Sustainable Energy Applications
  • Power Integrations’ New 3300 V IGBT Module Gate Driver Reports Telemetry Data for Observability, Predictive Maintenance and Lifetime Modelling
  • Infineon to Hire More in Korea as Power Chip Demand Set to Surge
  • Nexperia Webinar: Nexperia Power Rectifier. The Importance of Power Rectifier in Fast Switching Applications
Power semiconductors weekly Vol 115
  • Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module
  • TI Helps Maximize EV Driving Range with SiC Gate Driver
  • New Innovation Center to Provide AIXTRON with Expanded Capacities for R&D
  • Power Integrations Unveils New SCALE-iFlex LT NTC IGBT/SiC Module Gate Drivers with Temperature Readout
  • Penn State and onsemi Sign MOU to Boost Silicon Carbide Research in the U.S.
  • Pioneering Interactive Datasheets from Nexperia put MOSFET Behavior Analysis at Engineers’ Fingertips
  • onsemi Considers $2 billion Investment in EV Chip Production
Power semiconductors weekly Vol 114
  • DENSO and USJC Announce Mass Production Shipment of Automotive IGBT
  • Vishay Intertechnology Releases Gen 3 650 V SiC Schottky Diodes
  • onsemi 1200 V EliteSiC M3S Devices Enhance Efficiency of EVs and Energy Infrastructure Applications
  • Navitas Launches into High-Power Markets with GeneSiC SiCPAK™ Modules and Accelerates Bare-Die Sales
  • Henkel Debuts Ultra-High Thermal Conductivity Pressure-Less Sintering Die Attach Adhesive
  • Partnership for True Multiple Sourcing: Semikron Danfoss Power Modules with ROHM IGBTs
  • Infineon and Hon Hai Technology Group (Foxconn) Sign MoU to Partner on SiC Collaboration
Power semiconductors weekly Vol 113
  • Alpha and Omega Semiconductor Releases 600V 50mohm αMOS7™ Super Junction MOSFETs Family
  • SPEC Developed an Advanced SiC Power Chip
  • Magnachip Debuts New Family of 600V SJ MOSFET Products
  • Wolfspeed and ZF to Open R&D Center in Nuremberg
  • Infineon Diversifies Its Silicon Carbide Supplier Base
  • Infineon Announces Supplier Agreement on Wafers and Boules with TanKeBlue
  • Infineon Breaks Ground for New Plant in Dresden
Power semiconductors weekly Vol 112
  • Infineon Introduces HybridPACK™ Drive G2
  • Mitsubishi Electric to Ship Samples of HV100 Dual-type X-Series HVIGBT Modules
  • onsemi and ZEEKR Sign Long-Term Supply Agreement for SiC Power Devices
  • Infineon and SCHWEIZER Extend Cooperation in Chip Embedding to Develop More Efficient SiC Automotive Solutions
  • Bosch Plans to Acquire U.S. Chipmaker TSI Semiconductors
  • Toshiba Starts Construction of 300-milimeter Wafer Fabrication Facility for Power Semiconductors
  • SMIC-Backed Chinese Contract Chip Maker Seeks to Raise US$1.4 billion on Shanghai’s Star Market
Power semiconductors weekly Vol 111
  • Nexperia Releases 650V Silicon Carbide Diodes for Demanding Power Conversion Applications
  • Microchip Technology Announces Promotion of Rich Simoncic to Executive Vice President
  • Kyocera to Acquire Construction Site in Japan for New Smart Factory
  • China Chip Event Draws Applied Materials and Others Despite U.S. Tensions
  • Finepower Webinar-Series: “Brain Power 2023”
Power semiconductors weekly Vol 110
  • ZF Signs Multi-Year Supply Agreement with STMicroelectronics
  • CIL’s Advanced Semiconductor Packaging Facility Update
  • SwissSEM Gets ISO 14001 and ISO 45001 Certifications for Its Production Site
  • Leapers Semiconductor to Showcase SiC Power Portfolio during Fortronic in Bologna
  • PowerUP Expo Returns in June
Power semiconductors weekly Vol 109
  • DISCO Developed a Fully Automatic Dicing Saw Supporting φ8-inch Wafers
  • Axcelis Announces Shipment of 500th Purion Ion Implanter
  • EPC Presented Projected GaN Device Lifetime in Real World Applications
  • Infineon Changes IPC to GIP
  • Bosch Receives “Green Light” for Its $1 billion EV Parts Plant in Suzhou
Power semiconductors weekly Vol 108
  • Toshiba Releases 150V N-channel Power MOSFET to Increase the Efficiency of Power Supplies
  • DENSO Develops Its First SiC Inverter
  • CISSOID & Silicon Mobility Expand Partnership
  • onsemi Launches Simulation Tools
  • Industrial-Grade SiC MOSFET from Diodes Incorporated Enables Higher Power Density
  • China Becomes Top Holder of Ultra WBG Semiconductor Patents
Power semiconductors weekly Vol 107
  • onsemi Develops IGBT FS7 Switch Platform with Leading Performance for Industrial Markets
  • Qorvo® Delivers 5.4 mOhm 750V SiC FETs in TOLL Package for High Power Applications
  • New MPLAB® SiC Power Simulator from Microchip Allows to Test SiC Power Solutions in Design Phase
  • Power Integrations Launches 900 V GaN Flyback Switcher ICs
  • Transphorm Releases 3 kW Inverter Board with Microchip’s Digital Signal Controller
  • ROHM Establishes Ultra-High-Speed Control IC Technology that Maximizes the Performance of GaN Devices
Power semiconductors weekly Vol 106
  • VisIC Technologies Demonstrates Efficient GaN 3-Phase Traction Inverter with Automotive-Grade PMSM Motor
  • Mitsubishi Electric to Construct New Wafer Plant to Boost SiC Power Semiconductor Business
  • Microchip Reaches Milestone in Initiative Aiming to Triple Semiconductor Production at its Oregon Facility
  • South Korea to Build World’s Largest Semiconductor Cluster
  • Fortronic Invites You to Bologna in April
Power semiconductors weekly Vol 105
  • Resonac to Use Virtual Reality for Product Development
  • SiC SBDs from ROHM Chosen by Murata Power Solutions for Data Center PSUs
  • onsemi to Integrate its SiC Technology in BMW Group’s Next-Generation EVs
  • Lawrence Livermore Chooses SemiQ’s SiC Diodes for Particle Accelerator Project
  • Groundbreaking Ceremony Held for GWM Subsidiary’s Semiconductor Module Packaging & Testing Project
  • Vincotech Webinar: Embedded Designs Drive Tomorrow’s Solutions
Power semiconductors weekly Vol 104
  • Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers
  • Infineon to Acquire GaN Systems to Strengthen Its GaN Portfolio
  • Sineng Electric and onsemi Cement Strategic Alliance with a Joint Laboratory for Sustainable Energy Applications
  • McLaren Applied Selects STMicroelectronics to Supply Silicon Carbide Power Modules
  • InventChip Closes Series B Financing Round
  • Infineon Wide-Bandgap Developer Forum
Power semiconductors weekly Vol 103
  • Leapers Semiconductor Delivers Highest Power Density Ultra Compact SiC Power Modules on the Market
  • PANJIT Introduces New High Voltage FRED for Various Power Systems
  • Daxin Semi Sets up a 6-inch IGBT Production Line
  • AdvanSiC Brings Together 11 Entities to Produce, Test and Validate Cost-Effective HV SiC MOSFETs
  • PowerAmerica Annual Meeting
Power semiconductors weekly Vol 102
  • Toshiba’s Lineup Expansion of 150 V N-Channel MOSFETs
  • Microchip Plans to Invest $880 Million to Expand its SiC and Si Capacity in Colorado
  • Infineon Kicks off New Fab in Dresden
  • Texas Instruments Selects Utah for its Next 300-mm Semiconductor Wafer Fab
  • Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
  • ECPE SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in Power Electronic Applications
Power semiconductors weekly Vol 101
  • Infineon QDPAK and DDPAK Packages Registered as JEDEC Standard for High-Power Applications
  • Polar Semiconductor Investment and Expansion
  • Pan-European Research Initiative PowerizeD for Intelligent Power Electronics Launched
  • 20 Years of LFPAK Technology
  • PCIM Asia Conference 2023 Call for Papers Open
  • PowerAmerica Webinar: Bidirectional SiC and GaN Switch Technology
Power semiconductors weekly Vol 100
  • Diodes Incorporated Releases Its First Silicon Carbide Schottky Barrier Diodes
  • NexGen Announces Production Availability of World’s First 700V and 1200V Vertical GaN Semiconductors
  • Wolfspeed Announces Plan to Construct World’s Largest, Most Advanced SiC Facility in Germany
  • Wolfspeed and ZF Announce Partnership for Future Silicon Carbide Semiconductor Devices
  • Veeco Acquires Epiluvac AB to Accelerate Penetration into High Growth SiC Epitaxy Equipment Market
  • CGD Webinar: Powering up the Future with GaN
Power semiconductors weekly Vol 99
  • Renesas Introduces New Gate Driver IC for IGBTs and SiC MOSFETs Driving EV Inverters
  • Ideal Power Launches Its SymCool™ Power Module
  • Navitas and KATEK Accelerate Solar Adoption
  • Chemnitz University of Technology Achieved Progress in Improving Reliability and Robustness of Power Semiconductors
  • Filtronic’s Automating Wedge Bonding for Complex Wire Components
  • Wolfspeed Officially Names Its Siler City Facility
Power semiconductors weekly Vol 98
  • New All-in-One Hybrid Power Drive Module Solution from Microchip
  • AIST Demonstrates World’s First Hybrid Transistor Integrating GaN and SiC
  • Bosch to Invest Over $1 billion in E-mobility Capacities in China
  • Wolfspeed Plans a Chip Factory in Germany
  • Haviv Ilan to Become Next President and CEO of Texas Instruments
  • Semikron Danfoss Webinar: Benefits of Schottky Barrier Diodes
Power semiconductors weekly Vol 97
  • New STPOWER Devices from STMicroelectronics
  • Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors
  • Infineon Technologies Increases Focus and Investment into Core Semiconductor Development
  • CVD Equipment Receives Additional Order for PVT-150 Systems for SiC Growth
  • Arizona State University Developing Transistors Made of Diamond and Boron Nitride
  • IDTechEx Webinar: The Evolution of EV Thermal Management and What’s Beyond 2022?
Power semiconductors weekly Vol 96
  • Leapers Semiconductor Releases Compact Three-Phase SiC Power Module for EV Air Compressor
  • onsemi Introduced EliteSiC Silicon Carbide Family Solutions
  • Wolfspeed to Power Future Mercedes-Benz EV Platforms
  • Aehr Reports 54% Revenue Growth on Strength of Semiconductor Test and Burn-In Sales for EVs
  • Infineon’s CEO Notes Lack of Power Semiconductor Investment
  • Wolfspeed Webinar: The Industry’s Most Versatile Modular Evaluation Platform is the Starting Point for All Silicon Carbide Designs
Power semiconductors weekly Vol 95
  • DISCO Developed Two Types of Grinding Wheels for Si and SiC Wafers
  • DFG8541: DISCO’s Newly Developed Fully Automatic Grinder
  • European Collaborative Project Power2Power Successfully Completed
  • TI’s Latest 300-millimeter Wafer Fab in Lehi, Utah, Begins Production
  • Geely Chip Affiliate Wraps Up First Fundraiser
  • Nexperia Calls in the Lawyers to Save Welsh Chip Fab Deal
Power semiconductors weekly Vol 94
  • Coherent Partners with ETRI and KAIST to Focus on Advanced Semiconductor Devices for the Korean Market
  • LA Semiconductor Purchases Fabrication Plant From onsemi
  • Toshiba to Expand Power Semiconductor Production Capacity with New Production Facility
  • Hunan Sanan Secures Order for $524 Million from a Leading NEV Brand
  • Applied Materials to Extend Global Leadership in Semiconductor Manufacturing Technology
  • Supervisory Board Appoints Dr. Michael Heckmeier as Future CEO Of Siltronic AG
Power semiconductors weekly Vol 93
  • Leapers Semiconductor Expands Its E0 Family of SiC Power Modules
  • Mitsubishi Electric to Launch “SLIMDIP-Z” Power Semiconductor Module
  • Torex Semiconductor to Collaborate with YES POWERTECHNIX
  • Wolfspeed Expands and Extends SiC Wafer Supply Agreement
  • Monolithic Power Systems Signs Agreement with Vanguard International to Secure Semiconductor Supply
  • EPC and VIS Announce Joint Collaboration on 8-inch Gallium Nitride Power Semiconductor Manufacturing
Power semiconductors weekly Vol 92
  • Vishay Presents Three Phase Bridge Power Modules in the Compact MTC Package
  • Toshiba Develops SiC MOSFET with Embedded Schottky Barrier Diode
  • Vincotech Updates MiniSkiiP® Product Line
  • Soitec Breaks Ground on Singapore Fab Extension
  • Yole Webinar: Semiconductor Trends in Automotive
  • NexGen Power Systems Webinar: NexGen Vertical GaN™ Deep Dive: The Future of Power Semiconductors
Power semiconductors weekly Vol 91
  • STMicroelectronics and Soitec Cooperate on SiC Substrate Manufacturing Technology
  • Transphorm Expands Footprint with GaN Application Lab in China
  • Jaguar TCS Racing Reveal I-TYPE 6 – The Most Advanced All-Electric Jaguar Race Car Ever
  • ROHM and BASiC Semiconductor Form a Strategic Partnership
  • Purdue University and GlobalFoundries Partner to Strengthen Research and Development, Semiconductor Education
  • Wolfspeed Webinar: Virtual Seminar 2022
Power semiconductors weekly Vol 90
  • Infineon New Modules for 352 kW PV String Inverter
  • ROHM, Mazda, and Imasen Sign a Joint Agreement to Develop Inverters
  • Call for Proposals for SEMIKRON Innovation Award and SEMIKRON Young Engineer Award
  • BYD Scraps Spin-off of Chip Unit
  • Unikorn Announces Joining of the Taiwan Talent Sustainability Action Alliance
  • Wolfspeed Webinar: Design and Implementation of Future EV
Power semiconductors weekly Vol 89
  • Infineon to Invest €5 billion in a New Fab in Dresden
  • BorgWarner to Invest $500 Million in Wolfspeed
  • Infineon and Stellantis Agree on Silicon Carbide Chips
  • Nexperia is Shocked by the Secretary of State’s Order to Divest Newport Wafer Fab
  • Wide-Bandgap Power at Silicon Cost
  • GaN Systems Unveils Annual Power Semiconductor Predictions for 2023
Power semiconductors weekly Vol 88
  • Leapers Semiconductor Opens a New SiC Fab to Correspond to Market Challenges
  • Alpha and Omega Semiconductor Announces New 650V and 750V Automotive Qualified αSiC MOSFETs
  • Leapers Semiconductor Expands Its E0 Series SiC Power Modules Product Line
  • NXP Joins Semiconductor Climate Consortium
  • Photonic, Power Electronics & RF Packaging Forum
Power semiconductors weekly Vol 87
  • Odyssey Semiconductor Achieves 1200 Volt Rating on Vertical GaN Power Devices
  • New Vishay Intertechnology FRED Pt® Gen 5 Hyperfast and Ultrafast Rectifiers
  • First Aluminum Nitride Crystal with 43 mm Diameter
  • SK Siltron to Form JV to Develop SiC and GaN Chips
  • EPC Opens New Motor Drive Center of Excellence
Power semiconductors weekly Vol 86
  • Third Generation 1200V SiC MOSFETs from Toshiba
  • Wolfspeed Selects North Carolina for World’s Largest SiC Materials Facility
  • II-VI Changes Name to Coherent and Launches New Brand Identity
  • Showa Denko Starts to Ship Samples of 200mm SiC Epi-wafers
  • Showa Denko Group Doubles the Site of Storage Facility for Semiconductor Processing High-Purity Gas in South Korea
  • PCIM Asia 2022 to Be Moved to October with Major Brands and Concurrent Events Confirmed
Power semiconductors weekly Vol 85
  • Next Generation Uninterruptible Power Supplies with SiC Solutions from Leapers Semiconductor
  • Renesas Unveils New-Generation Si IGBTs for Electric Vehicle Inverters
  • Toshiba Launches Third Generation 650V SiC MOSFETs
  • SK Siltron CSS Opens a New Fab in Gumi
  • Marelli Motorsport and Politecnico di Torino Cooperate on GaN
  • Wolfspeed Webinar: Build More Efficient Solar Inverters and Energy Storage Systems with SiC
Power semiconductors weekly Vol 84
  • New Vishay FRED Pt® Gen 5 600 V Ultrafast Rectifiers in TO-244 Package
  • Infineon Expands Supplier Base for SiC Wafers with II-VI
  • Green Light for Semikron Danfoss
  • Li Auto to Develop SiC Power Modules
  • SK Siltron to Complete New Wafer Fab in US Next Month
  • Japan’s Startup Flosfia to Produce Power Semiconductors That Increase EV Range
Power semiconductors weekly Vol 83
  • Bourns Enters IGBT Market
  • Navitas to Buy GeneSiC
  • Vishay to Expand Production in Germany
  • Ferrotec Breaks Ground at New Malaysia Factory
  • Hyundai to Produce Their Own Semiconductors
  • II-VI Closes $100 Million Contract to Supply Tianyu with SiC Substrates
Power semiconductors weekly Vol 82
  • Henkel and CITC Forge Partnership to Accelerate High-Thermal Die Attach Solutions
  • Traction Inverters Go GaN
  • onsemi Celebrates Expansion of SiC Production in New Hampshire
  • Vishay Receives R&D Grant for WATT4FRED Project
  • Demand for Chips is Collapsing Just as Biden Signs CHIPS and Science Act
  • Join Power Semiconductor Executive Summit in Munich
Power semiconductors weekly Vol 81
  • Leapers Semiconductor High Power Density SiC Modules Target Solar Application
  • SEMIKRON under Attack
  • Welcome to Bodo’s Wide Bandgap Event
  • Wolfspeed Webinar: Optimizing Drive Cycle Simulations for Automotive Applications
  • onsemi Power Webinars Series
Power semiconductors weekly Vol 80
  • Toshiba’s New SiC MOSFETs Delivers Low On-Resistance and Significantly Reduced Switching Loss
  • UnitedSiC (now Qorvo®) Extends Highest Performance, Most Efficient 750V SiC FET Portfolio for Power Designs
  • flowBOOST Dual and Triple Boosters for 1500 V Solar Inverters
  • LPE and A*Star’s Institute of Microelectronics to Develop High Quality 200mm SiC and Specialty Epitaxy Processes
  • Japan’s Denso Pushes EV Efficiency with New Power Semiconductors
  • Infineon Webinar: Hybrid and Electric Solutions for Commercial Vehicles
Power semiconductors weekly Vol 79
  • Bosch Invests Further Billions in Chip Business
  • onsemi to Invest $1 Billion in Gyeonggi Research Center
  • Silicon Carbide Cooperation between SEMIKRON and ROHM Semiconductor
  • Soitec Boosts Customer Yield of SiC Manufacturing with KLA Inspection Technology
  • IMEC to Help Set Up Semiconductor Units in India
  • Talk to the Experts at Bodo’s Wide Bandgap Talk
  • PSMA PTR Webinar: SiC Power Technology Status and Barriers to Overcome
Power semiconductors weekly Vol 78
  • Toshiba Announced Availability of Highly Accurate SPICE Models
  • GlobalWafers Selects Sherman, Texas for New Semiconductor Silicon Wafer Site
  • Navitas Acquires VDD Tech to Expand High-Power, Next-Gen Semiconductor Capabilities
  • STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France
  • GaN Webinar Series by EPC
  • Infineon Webinar: High-Power Semiconductor Solutions for Green Hydrogen Electrolyzer Applications
  • SEMIKRON Webinar: Power Module Reliability: Humidity
Power semiconductors weekly Vol 77
  • Infineon and Delta Electronics Strengthen Collaboration in WBG-based Server and Gaming PC Power Solutions
  • Toshiba Launches Fast Recovery Diode Housed in a Press-Pack Package
  • Temperature-Resistant Power Semiconductors 3D Printed by Chemnitz University of Technology
  • SK Siltron Leads Domestic SiC Power Semiconductor Production
  • Japan’s Greatest Chipmakers from Toshiba to Sony Brace for Engineer Scarcity
  • Infineon Webinar: Driving 100 km on 10 kWh? It’s All About Efficiency!
Power semiconductors weekly Vol 76
  • Leapers Semiconductor Introduces New Package SiC Power Module
  • DB HiTek Builds 8-inch SiC Semiconductor Production Line
  • Wise-integration Launches Most-Compact Gallium Nitride Half-Bridge Power IC
  • Wolfspeed Power Applications Forum
  • EPE 2022 ECCE Europe is on Its Way
Power semiconductors weekly Vol 75
  • Leapers Semiconductor Hybrid Solutions Contribute to Greener Future
  • Magnachip Unveils a New 650V IGBT for Solar Inverters
  • PANJIT Introduces Two New Bridge Rectifiers
  • BYD Invests in TYSiC
  • Innoscience Opens European R&D Centre in Belgium’s ‘GaN Valley’
Power semiconductors weekly Vol 74
  • Toshiba Develops World’s First Double-Gate RC-IEGT
  • STMicroelectronics to Cooperate with GlobalFoundries
  • Mitsubishi Electric Initiates Semiconductor and Devices Lab Program
  • Toshiba Partners with Farnell to Strengthen Supply Chain
  • Navitas Highlights Next-Gen Power IC Technology at ‘GaN Marathon’
  • Wolfspeed Webinar: Silicon Carbide Power Devices Improve Heat Pump and Air Conditioner Efficiency, Size, Weight and Cost
Power semiconductors weekly Vol 73
  • Leapers Semiconductor Expands Compact SiC MOSFET Portfolio with E2 Series Modules
  • Advantest Acquires CREA
  • STMicroelectronics Opens New Clean Room in Morocco
  • Yole Développement and System Plus Consulting Combine their Expertise to Become Yole Group
  • PowerUP EXPO 2022
  • SEMIKRON Webinar: SEMITRANS 20 – High Power, Higher Reliability
Power semiconductors weekly Vol 72
  • ENPOWER First to Adopt Infineon’s Latest 750 V Discrete IGBTs
  • Okmetic Invests 400 million Euro to Build a New Fab in Finland
  • Diodes Incorporated Completes Acquisition of onsemi’s Wafer Fab
  • Transphorm’s GaN FETs Enable High Reliability Medical Applications
  • Allegro MicroSystems Announces Agreement to Acquire Heyday Integrated Circuits
  • DENSO Shares Company Direction Updates of Semiconductor Strategy
  • Wolfspeed Announces Appointment of New Global Sales and Marketing Leadership
Power semiconductors weekly Vol 71
  • Showa Denko’s Program to Develop 8-inch SiC Wafers Selected for NEDO’s Green Innovation Fund Projects
  • Hon Hai, YAGEO to Jointly Participate in XSemi’s Capital Increase for a Private Placement in Taiwan MOSFET Leader APEC
  • RS Semiconductor Materials Groundbreaking Ceremony of New Factory Construction for 300mm Silicon Wafer
  • Siemens Mobility and Mitsubishi Electric Europe B.V. Sign MoU to Push the Use of High Voltage SiC Technology
  • Texas Instruments Breaks Ground on New 300-mm Semiconductor Wafer Fabrication Plants in Sherman, Texas
  • Innoscience and WPG Sign Worldwide Distribution Agreement
  • EBV Elektronik Webinar: Energy Storage Systems Powered by CoolSiC™
Power semiconductors weekly Vol 70
  • Sensitron and EPC Collaborate to Introduce a High-Power Density 350 V GaN Intelligent Power Module
  • Infineon Expands Prime Switch Family with Press Pack IGBT
  • Nexperia and KYOCERA AVX Components Salzburg Agree Partnership for GaN Automotive Power Modules
  • Mitsubishi Electric Adds a New Module to SiC Power Device Lineup
  • Hitachi Energy Launches Power Semiconductor Module for EVs Globally
  • Rhombus Energy Solutions to Leverage Wolfspeed’s SiC Devices for Faster EV Charging Infrastructure
  • Renesas to Invest and Restart Operation of Kofu Factory as 300mm Wafer Fab Dedicated for Power Semiconductors
Power semiconductors weekly Vol 69
  • Power Integrations Launches SCALE EV: Automotive-Qualified IGBT/SiC Module Driver Family
  • STMicroelectronics Launches New MDmesh MOSFETs
  • STMicroelectronics Cooperates with SEMIKRON to Integrate SiC Power Technology in Next-Gen EV Drives
  • UnitedSiC (now Qorvo) Announces 1200V Gen 4 SiC FETs with Industry-best Figures of Merit
  • Infineon Expands CoolSiC™ Portfolio
  • onsemi Unveils World’s First TOLL-packaged 650 V Silicon Carbide MOSFET
  • Keysight Technologies Delivers Next-Generation Power Device Analyzer / Double-Pulse Tester
Power semiconductors weekly Vol 68
  • Solitron Devices Announced Low Cost 1200V Silicon Carbide MOSFET
  • Leapers Semiconductor Introduced Its 850V SiC High Voltage Platform
  • Infineon Updates EconoDUAL™ 3 Modules
  • Soitec on Track to Enlarge Silicon Carbide Product Portfolio
  • DENSO and USJC Collaborate on Automotive Power Semiconductors
  • II-VI Incorporated Extends Ion Implanter Disk Refurbishing Services to Asia
  • STMicroelectronics Webinar: Innovative Power Solutions to Meet the Challenges of Car Electrification
Power semiconductors weekly Vol 67
  • SanRex Launched GSA Series IGBT Modules
  • Leapers Semiconductor to Provide SiC Solutions for Renewable Energy Applications
  • ROHM and Delta Electronics Form a Strategic Partnership on Developing Power Devices for Power Supply Systems
  • SK Inc. Acquires Controlling Stake in Yes Power Technix
  • Toyoda Gosei’s GaN Power Device Development Adopted in Japanese Ministry of the Environment CO2 Reduction Project
  • Wolfspeed Opened the World’s Largest 200mm Silicon Carbide Fab
  • PCIM Europe 2022. Face-to-face Again
Power semiconductors weekly Vol 66
  • Mitsubishi Electric to Ship Samples of 2.0kV IGBT Module for Industrial Use
  • PANJIT Semiconductor Introduces New 650V and 1200V SiC Schottky Barrier Diodes
  • Infineon Introduced New IPM Series CIPOS™ Tiny IM323-L6G
  • Teledyne LeCroy Develops the Most Accurate Measurement System for GaN and SiC Semiconductor Analysis
  • TankeBlue Semiconductor to Raise Funds through IPO
  • Navitas Semiconductor at 2022 International Conference on Compound Semiconductor Manufacturing Technology
  • Wolfspeed Webinar: Speed Up Silicon Carbide Adoption with Useful Power Module Reference Designs
Power semiconductors weekly Vol 65
  • Infineon Extends CoolSiC™ M1H Technology Portfolio with 1200 V SiC MOSFETs
  • Leapers Semiconductor to Introduce HPD Series SiC MOSFET Power Modules for Automotive Application
  • SanRex Launches Discrete 1200V Voltage SiC MOSFETs
  • BorgWarner Receives U.S. Department of Energy Award for DC Fast Charger
  • Infineon to Expand Existing Backend Operations in Indonesia
  • SEMICON Southeast Asia 2022 to Focus on Semiconductor Supply Chain Sustainability and Resilience
Power semiconductors weekly Vol 64
  • Toshiba Expands Super Junction MOSFETs with Four Additional 650V Devices
  • EPC Introduces 350V GaN Power Transistor
  • ASM Unveils Expansion in Singapore to Meet Global Demand for Advanced Semiconductors
  • Hyundai Motor Group Honors Infineon for Supply Competence and Strategic Cooperation
  • Shenzhen Stock Exchange Suspends IPO Review of BYD Semiconductor
  • Power&Beyond Web Conference: High Performance GaN Devices for High Volume Applications
  • Yole Développement Webcast: SiC Evolution. Cars Drive a Multi-billion Dollar Business
Power semiconductors weekly Vol 63
  • Toshiba Releases 150V N-channel Power MOSFET
  • Odyssey Semiconductor Announces Technology Development Milestones
  • Showa Denko Launches Mass Production of 6-inch SiC Single Crystal Wafers
  • SEMIKRON and Danfoss Silicon Power Join Forces
  • Nexperia Launches New Dallas Design Center
  • SEMIKRON Webinar: Power Module Reliability – Power Cycling
  • Wolfspeed Webinar: Enabling Industrial Motor Drive and Motion with Silicon Carbide
Power semiconductors weekly Vol 62
  • Infineon Presents Optimized CoolSiC™ MOSFETs 650 V in D²PAK
  • Microchip Unveils Industry-Leading 3.3 kV Silicon Carbide Power Devices
  • ROHM Starts Production of 150V GaN HEMTs
  • New SBD & MOSFET Packages from Wolfspeed Slash Size, Increase Power Density
  • NXP and Hitachi Energy Collaborate on Power Module to Accelerate Silicon Carbide Adoption in E-mobility
  • Navitas Announces World’s First 20-Year Warranty for GaN ICs
  • Power Integrations Unveils New Office Facility in Switzerland
Power semiconductors weekly Vol 61
  • GE announces Digi-Key as Channel Partner for Silicon Carbide Power Modules
  • Toyoda Gosei Succeeds in Making Larger GaN Substrates for Next-Generation Power Devices
  • SK Siltron to Spend $845 million on New 300mm Wafer Plant
  • SEMIKRON Foundation and ECPE Honour Awards
  • Wolfspeed Adds to Global Operations Leadership Team to Support Rapid Company Growth
  • Infineon’s Industrial Wide-Bandgap Developer Forum
  • Wolfspeed Webinar: Silicon Carbide TOLL MOSFETs Enable High Efficiency and High Power Density in 3.6-kW Totem-Pole PFC
2022_03_Power semiconductors weekly Vol 60
  • Lucid Air – EV AC Charging ‘Powered By ROHM’
  • Alpha and Omega Semiconductor Releases 600V Super Junction MOSFETs
  • Teledyne e2v HiRel Unveils Two Space-Screened Versions of GaN HEMTs
  • Infineon’s IPOSIM Now Offers Lifetime Estimation Simulations
  • Soitec to Expand its Manufacturing Footprint in Bernin with SiC
  • II-VI Incorporated Accelerates Investment in Silicon Carbide Substrate and Epitaxial Wafer Manufacturing
  • Infineon Webinar: Automated Lifetime Estimation of Power Semiconductors
Power semiconductors weekly Vol 59
  • Infineon Presents New Automotive 750 V EDT2 IGBTs
  • Toshiba’s New Generation Super Junction Power MOSFET “DTMOSVI Series”
  • FormFactor Introduces High-Power Semiconductor Wafer Probing System
  • InventChip Sets Up Strategic Fund Solely Invested by EV Maker Xiaopeng
  • EIB Releases €600 million Loan to STMicroelectronics
  • onsemi Divests Wafer Manufacturing Sites as Part of Fab-Liter Strategy
  • GaN Power Devices and Applications
2022_03_Power semiconductors weekly Vol 58
  • Infineon presents EiceDRIVER™ F3 Enhanced
  • Vishay Intertechnology Introduced 600 V E Series MOSFETs
  • Transphorm to Demonstrate 99% Efficiency Power Switching with a 1200 Volt GaN Power Transistor
  • Bosch to Invest on Extending Semiconductor Production in Reutlingen
  • Dr. John Palmour Elected to the National Academy of Engineering
  • Vishay Intertechnology Announces CEO Retirement and Succession Plan
  • Taiwan Semiconductor Webinar: Rectifier Diode Technology Evolution
2022_02_Power semiconductors weekly Vol 57
  • Mitsubishi Electric to Launch “SLIMDIP-X” Power Semiconductor Module
  • Cambridge GaN Devices to Develop GaN Power Transistors and ICs
  • GlobalWafers Italian Subsidiary Launches 300mm Expansion Plan
  • Infineon Invests €2 billion In a New Malaysia Frontend Fab
  • SEMIKRON Secures Billion Euro Contract with German Automotive Manufacturer
  • PowerAmerica’s Annual Meeting 2022
  • Wolfspeed Webinar: Silicon Carbide Solutions for Energy Storage Systems
2022_02_Power semiconductors weekly Vol 56
  • Mitsubishi Electric to Launch Half-Bridge Driver HVIC with BSD Function
  • Vishay Intertechnology N-Channel MOSFETs Deliver Best in Class RDS(ON)
  • Dual High-Side Switches from STMicroelectronics Add Extra Flexibility for Driving Capacitive Loads
  • European Chips Act
  • Toshiba Group Technology Strategy
  • GlobalWafers Capacity Expansion
  • Nexperia – Five Years of Independence
2022_02_Power semiconductors weekly Vol 55
  • Dual Gate Drivers Optimize and Simplify SiC and IGBT Switching Circuits
  • Power Integrations Introduces High-Voltage Switcher ICs with 1700 V SiC MOSFET
  • II-VI Qualifies 1200 V SiC MOSFET Platform to Automotive Standards and Expands Relationship with GE
  • STMicroelectronics to Double Investments to Meet High Chip Demand
  • Toshiba to Expand Power Semiconductor Production Capacity with 300-millimeter Wafer Fabrication Facility
  • Wolfspeed Webinar: Silicon Carbide Discrete MOSFETs Push Higher Power in EV Fast Charging
2022_02_Power semiconductors weekly Vol 54
  • Toshiba Launched New 1200/1700 V Silicon Carbide MOSFET Modules
  • Fuji Electric Makes an Investment in Production of SiC Power Semiconductors
  • IVWorks Acquires Saint-Gabain’s GaN Wafer Business
  • Wolfspeed Is to Open a Tech Hub in Belfast
  • GAC and CRRC Times Electric Set Up Qinglin Semiconductor
  • SEMIKRON Webinar: Increase Development Speed with SEMIKRON Application Samples
2022_01_Power semiconductors weekly Vol 53
  • Magnachip Launches New Generation of High-Voltage 600V SJ MOSFETs
  • USI Plans to Mass-Produce IGBT and SiC Power Modules for Electric Vehicle Inverters in 2022
  • Toshiba Established a New High Voltage Laboratory in Germany
  • Mitsubishi Electric to Expand Power Semiconductors Production
  • WeEn Semiconductors Launches Global Operation Center in Shanghai
  • Join Bodo’s WBG Expert Talk
  • Wolfspeed Webinar: Silicon Carbide Scale and Scalability Enabling Fast DC Charging
2022_01_Power semiconductors weekly Vol 52
  • Toshiba Expands Power MOSFETs Lineup
  • VINcoNPC X12 Engineered to Up Power & Efficiency
  • Infineon’s New OptiMOS™ Power MOSFET
  • SkyWater and Applied Novel Devices Enable Breakthrough with New Class of Silicon Power MOSFET
  • A*STAR’s Institute of Microelectronics and Soitec to Develop Next-Generation Silicon Carbide Semiconductors
  • TANAKA Denshi Kogyo to Strengthen Its Capacity of Aluminum Bonding Wires for Power Semiconductors
  • Diodes Incorporated and Sentec Set Up DiodSent JV
Power semiconductors weekly Special Volume 3 SiC and GaN
  • Bodo’s Wide Bandgap Event
  • PowerUP Expo


Power semiconductors weekly Vol 51
  • Ruttonsha International Rectifier to Buy Visicon Power
  • Status of the Power Electronics Industry 2021
  • Status of the Power Module Packaging Industry 2021
  • SiC Transistor Comparison 2021
  • ExpoElectronica 2022 is Scheduled for April
Power semiconductors weekly Vol 50
  • BYD Launches 1,200 V Power Device Driver Chip
  • Wuxi Leapers Semiconductor Launches E0 Series SiC Power Module
  • hofer powertrain and VisIC Technologies Develop 3-Level 800V GaN Inverter
  • LX Semicon Acquires LG Innotek SiC Asset
  • BYD Starts Buying IGBT Modules from Other Suppliers
  • Marching-Power Technology Closes 500 million Yuan Series C Round GaN Chipmaker
  • CorEnergy Semiconductor Completes Series C Financing to Expand Production
Power semiconductors weekly Vol 49
  • Update on ROHM Solution Simulator: New Thermal Analysis Function
  • STMicroelectronics Introduces First PowerGaN Products
  • alpitronic Selects Infineon’s Easypack™ Coolsic™ Modules and Eicedriver™ X3 Drivers for Its 50 kw Hypercharger
  • Nexperia Uses AIXTRON Equipment as It Enters the SiC Market
  • Wuxi Leapers Semiconductor Co., Ltd. Completed 100 million yuan of A-Round Financing
  • STMicroelectronics and Politecnico di Milano Expand Semiconductor R&D Infrastructure
  • AspenCore Releases Guide to Silicon Carbide: Enabling a Smart Energy Future
Power semiconductors weekly Vol 48
  • onsemi Launches High-Performance, Low Power-Loss SUPERFET V Family of MOSFETs
  • Toshiba’s New Press Pack IEGT Contributes to Size Reduction and Higher Efficiency of Industrial Equipment
  • STMicroelectronics Releases New Silicon-Carbide Devices
  • CISSOID & Silicon Mobility Announce a Partnership on SiC Inverters for Electric Vehicles
  • Microchip to Provide SiC MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design
  • Bosch Gives Go-Ahead for Volume Production of Silicon Carbide Chips
  • onsemi Webinar: How SiC is Shifting the Future of EV
Power semiconductors weekly Vol 47
  • Deeper Integration at Higher Power
  • Alpha and Omega Semiconductor Releases 600V Low Ohmic and Fast Body Diode αMOS5™ Super Junction MOSFETs Family
  • Vitesco Technologies Enters into Strategic Partnership with GaN Systems Alongside a Minority Investment
  • Soitec Acquires NOVASiC and Announces Strategic Partnership with Mersen to Develop New Silicon Carbide Substrates
  • A*STAR’s Institute of Microelectronics and STMicroelectronics Team Up on SiC R&D for the EV Market and Industrial Applications
  • BorgWarner Suzhou Celebrates Phase II Ground Breaking, Enhancing R&D and Production Capabilities
  • WeEn Technology Answers the Call for Higher Efficiency
Power semiconductors weekly Vol 46
  • Toshiba Integrates a High-performance Driver IC for Controlling Next-generation Power Semiconductors into a Single Chip
  • GaN Systems and USI Form Strategic Partnership to Accelerate GaN Adoption in Electric Vehicles
  • Aehr Test Systems Joins PowerAmerica Institute to Support Advancing SiC and GaN Technologies
  • WIN Semiconductors and NYCU Established a Joint Technology Innovation Center
  • Supervisory Board Appoints Jochen Hanebeck as Successor to Dr. Reinhard Ploss as CEO of Infineon
  • PowerUP EXPO 2021
  • Microchip Webinar: Applications of Silicon Carbide in Vehicle Electrification
Power semiconductors weekly Vol 45
  • Alpha and Omega Semiconductor Introduces 80V Power MOSFET
  • Fuji Electric Launches the 2nd-Generation Discrete SiC-SBD Series
  • Infineon Significantly Improves Technology with OptiMOS™ 6 100 V
  • ROHM Recognized as a Preferred Supplier of SiC Power Solutions by UAES
  • Texas Instruments to Build New 300-mm Semiconductor Wafer Fabrication Plants
  • DuPont Announced Acquisition of Rogers Corporation
  • Semikron Webinar: Reduced Thermal Resistance with Latest Phase Change TIM
Power semiconductors weekly Vol 44
  • Nexperia Introduced High-Performance Silicon Carbide Diodes
  • Diodes Incorporated Target EV Applications with New High Current Rated TOLL MOSFETs
  • Bosch to Create European Supply Chain for Silicon Carbide Semiconductors
  • Geely to Begin Mass-Production of Its Silicon Carbide Power Modules
  • II-VI Incorporated to Supply Silicon Carbide Substrates for Power Electronics
  • Toshiba Announced Strategic Reorganization
Power semiconductors weekly Vol 43
  • SemiQ Launches New 1200V SiC MOSFET
  • DENSO Provides SiC Power Semiconductors
  • Semiconductor Power Electronics Center Developed a Novel and Cost-Effective 3.6kV/400A SiC HB IPM Based on the Austin SuperMOS
  • BorgWarner Receives U.S. Department of Energy Award for High Power-Dense Inverter
  • KEC Invests 20 billion Won to Take the ‘Second Leap’
  • Qorvo® Acquires United Silicon Carbide (UnitedSiC)
Power semiconductors weekly Vol 42
  • Vincotech’s flowANPFC and flow3xANPFC for More Efficient DC EV Charging
  • B-TRAN™ will be Evaluated Against IGBTs and SiC Power Devices
  • Zhenghai Group and ROHM to Establish a Joint Venture in SiC Power Module Business
  • Bosch to Invest More Than 400 Million Euros in Its Semiconductor Fabs in 2022
  • Siltronic Breaks Ground for a New Fab in Singapore
  • SK Hynix to Acquire Local Chip Contract Manufacturer for $492 Million
  • Bodo’s Wide Bandgap Event Goes Online on November 30
Power semiconductors weekly Vol 41
  • Wolfspeed and ZINSIGHT Enhance Efficiency with Silicon Carbide
  • centrotherm to Cooperate with TRANSFORM
  • Littelfuse to Acquire Carling Technologies
  • Transphorm Appoints Cindi Moreland to Board of Directors
  • PINK Webinar: Sintering Basics and the Benefits of PINK Sintering Systems
Power semiconductors weekly Vol 40
  • STMicroelectronics New MDmesh™ K6 800V STPOWER MOSFETs
  • ROHM’s Latest Generation of Dual MOSFETs
  • Epitaxy Equipment Market Trends
  • Infineon and EBV Elektronik Webinar: High Power UPS with CoolSiC™
  • Semikron Webinar: Gate Driver Principles, Considerations and Selection Process
2021_10_Power semiconductors weekly Vol 39
  • New Infineon EasyPACK™ 2B EDT2 Power Module
  • New Way of Detecting Transistor Defects
  • $18M NSF Grant to Build National Semiconductor Fabrication Facility
  • General Motors and Wolfspeed Forge Strategic Supplier Agreement
  • Navitas Shenzhen Expands 300% to Support Extraordinary China Revenue Growth and Accelerate High-Power GaN Applications
Power semiconductors weekly Vol 38
  • Toshiba’s New Simulation Technology Shortens Verification Times for Automotive Semiconductors by about 90%
  • High-Voltage GaN-on-Silicon HEMT Reaches 300mm
  • Showa Denko Concludes Long-Term Contract to Supply SiC Epitaxial Wafers for Toshiba
  • SUMCO Announced Issuance of New Shares to Support Production of Silicon Wafers
  • II-VI Incorporated Wins Excellent Partner Awards from Sumitomo
  • Keysight Technologies, National Central University Optical Sciences Center, Establish Third-generation Semiconductor R&D and Test Open Laboratory
  • Automotive Semiconductor Trends 2021
Power semiconductors weekly Vol 37
  • VINcoSIM – New Online Simulation Environment from Vincotech
  • UnitedSiC Announced Industry-Best 6mohm SiC FET
  • GaN Systems Signed Semiconductor Capacity Agreement with BMW
  • Cree | Wolfspeed to Transfer to the New York Stock Exchange
  • Grand Capping Ceremony of Ferrotec(Jiangsu)Power Semiconductor Research Institute
  • Silicon MOSFET Market and Technology Trends 2021
  • International Conference on Integrated Power Electronics Systems and Solutions
Power semiconductors weekly Vol 36
  • Hitachi Develops Highly Flexible Design Technology Based on Physical Model of TED-MOS SiC Power Device
  • Tandem Diodes for Faster Switching
  • Showa Denko Concludes Long-Term Contract to Supply SiC Epitaxial Wafers for ROHM
  • Global Fab Equipment Spending Forecast to Reach $100B in 2022
  • Hangzhou Semiconductor Wafer Has Successfully Completed Financing
  • Vincotech Webinar: Design Challenges and Solutions for 1,500 V PV Inverter Systems
  • Infineon Webinar: Power Semiconductor Solutions for Propulsion and Auxiliaries in Trucks, Delivery Vehicles and Buses
Power semiconductors weekly Vol 35
  • Infineon Enhances 1200 V EconoDUAL™ 3 Portfolio with IGBT7 Featuring New Current Ratings
  • Power Integrations Introduces New SCALE-iFlex Gate Drivers
  • New Applied Materials Technologies Help Silicon Carbide Chipmakers Accelerate the Transition to 200mm Wafers
  • BYD Semiconductor Moves Forward
  • Infineon Celebrates the Official Start of Production in Their Brand New 300-Millimeter Wafer Chip Factory
  • Nexperia Launches ‘Power Live’ Virtual Conference
  • Semikron Webinar: Efficient Green Hydrogen Production with Power Electronic Stacks
2021_09_Power semiconductors weekly Vol 34
  • Infineon and Panasonic Accelerate GaN Technology Development for 650 V GaN Power Devices
  • SMIC to Build $8.87bn Shanghai Chip Plant in Challenge to TSMC
  • 5-year Plan Gives Leg Up to Chip Base Material
  • Hongwei Technology Power Semiconductors Company Went Public
  • IGBT Market and Technology Trends 2021
  • Heraeus Electronics at PCIM Asia 2021
  • Avnet Silica Webinars: Power Solutions for Vehicles and Fast Charger Applications
Power semiconductors weekly Vol 33
  • Japan’s Fuji Electric Gives $360m Boost to Power Chip Business
  • onsemi to Acquire GT Advanced Technologies
  • VisIC Technologies Raises $35M, in a Round Led by GoldenSand Capital
  • ROHM Celebrates Its 50th Anniversary in Europe: Focus on Power and Analog Solutions
  • EPE’21 ECCE Europe is Virtual but Added Value
  • Infineon Webinar: Power MOSFET Packages – Making the Right Choice for Your Application
Power semiconductors weekly Vol 32
  • Pump up the Power of Your 1500 V PV Inverters with flowANPC S3 split
  • Cree | Wolfspeed and STMicroelectronics Expand Existing 150mm Silicon Carbide Wafer Supply Agreement
  • Star Semiconductor Intends to Raise 3.5 Billion Yuan for a Number of Power Device Expansion Projects
  • II-VI to Aim at the Automotive Market with Silicon Carbide Armed with GE Patents
  • Austrian Research Project “H2Pioneer“: Green Hydrogen for the Semiconductor Industry
  • Wolfspeed Webinar: Enhancing Performance Metrics of Energy Storage Systems with SiC Modules
Power semiconductors weekly Vol 31
  • Keysight Launches Scienlab Battery Pack Test System with High Voltage Silicon Carbide Technology
  • Groundbreaking Ceremony for the Expansion of the Crystal Pulling Hall at Siltronic’s Freiberg Site
  • A College of Semiconductor Research is Established at NTHU
  • Semicon Taiwan 2021 is a Journey
  • STMicroelectronics Webinar: New SLLIMM HP Intelligent Power Module for Motor Control Applications
Power semiconductors weekly Vol 30
  • Lower Your Total Cost of Ownership with High Performance Si3N4 AMB Substrates
  • New Littelfuse 1700 V SiC Schottky Barrier Diodes Offer Faster Switching, Higher Efficiency
  • First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
  • Driving Electromobility and Energy Efficiency Forward: Infineon on Board the VW ID.4 USA Tour
  • Geely and ROHM Concluded a Strategic Partnership on SiC Power Devices
  • Space Industry Launches with GaN Systems
  • Transphorm Closes JV Transaction for Acquisition of AFSW Wafer-Fab
  • Macronix and Foxconn Sign Asset Transaction Agreement for 6-inch Wafer Fab
Power semiconductors weekly Vol 29
  • STMicroelectronics Manufactures First 200mm Silicon Carbide Wafers
  • Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Solutions Now Available at 1700V
  • ROHM’s New Hybrid IGBTs with Built-In SiC Diode
  • Mersen to Form Part of a SiC Semiconductor Supply Chain Network
  • Heraeus Electronics Joins PowerAmerica Institute
  • Mouser and ON Semiconductor Set Up Content Platform for Power Conversion Solutions
  • SEMICON Southeast Asia 2021 Goes Virtual
  • Infineon Silicon Carbide Virtual Event 2021
Power semiconductors weekly Vol. 28
  • Shanghai Tianyue Silicon Carbide Semiconductor Material Project is Published and is Expected to Start in Late July
  • Japan’s Rohm Kicks off $45m Venture Fund to Drive New Chip Tech
  • Huawei Obtains China Patent for Si IGBT
  • Infineon Webinar: Power Semiconductor Solutions for the Development of Green Hydrogen Systems
Power semiconductors weekly Special Vol. 2
  • Power Integrations
  • STMicroelectronics
  • Infineon Technologies
  • Mitsubishi Electric
  • Danfoss Silicon Power
  • Semikron
  • SanRex
  • GeneSiC
  • On Semiconductor
  • ShinDengen
  • Alpha and Omega Semiconductor
  • and many more …
Power semiconductors weekly Vol. 27
  • Semiconductor Wafer Producer SK Siltron CSS to Invest $300M in US to Boost EV Supply Chain
  • 25 Years of Silicon Carbide at ST and the New Era Ahead
  • Compound Semiconductor Quarterly Market Monitor
  • Semikron Webinar: Thermal Resistance of Power Modules
Power semiconductors weekly Vol. 26
  • Flow S3 with Advanced Die-Attach Technology
  • Zhixin Semiconductor Co., Ltd. IGBT Module Packaging and Testing Production Line was Officially Put into Operation
  • ITEC Emerges as Independent Semiconductor Equipment Manufacturer
  • ASM Expands Its Epitaxy Product Offerings with New Intrepid® ESA™
  • ST and Exagan, The New Chapter in the Gallium Nitride Story
Power semiconductors weekly Vol. 25
  • TRENCHSTOP™ 5 WR6 Family in TO-247-3-HCC Housing
  • After BYD, Another Chinese Company to Mass Produce Automotive IGBTs
  • UK’s Largest Chip Plant to Be Acquired by Chinese-Owned Firm Nexperia
  • Hitachi ABB Power Grids is Evolving to Become Hitachi Energy
  • ON Semiconductor Celebrates Being Recognized as Most Sustainable Company in the Semiconductor Industry in 2021 by World Finance
  • PCIM Asia Conference 2021 to Feature Over 50 Papers in Upcoming Edition
Power semiconductors weekly_Vol 24
  • Renault Group and STMicroelectronics Enter Strategic Cooperation on Power Electronics
  • II-VI Incorporated Introduces Heated Ion Implantation Foundry Services for 150 mm Silicon Carbide Wafers
  • Toshiba’s New Device Structure Improves SiC MOSFET High Temperature Reliability and Reduces Power Loss
  • BYD Semiconductor Bumps Prices by 5% as Global Chip Shortage Persists
  • Nagoya Institute of Technology and NGK Establish “NGK Environment Innovation Laboratory”
  • New Semiconductor Fabs to Spur Surge in Equipment Spending
  • EE Awards Asia
Power semiconductors weekly Vol. 23
  • EBV Elektronik Announces Strategic Cooperation with Infineon to Deliver Cutting-Edge Silicon Carbide Technologies
  • Infineon Cements Position as the World’s Number One Automotive Semiconductor Supplier
  • Trends in Worldwide Semiconductor Production Capacity
  • Research Collaboration in Manufacture and Performance of SiC Schottky Diodes
  • Hitachi New Facility is Being Established in the United States in Order to Collaborate and Create New Solutions with Customers
Power Semiconductors Weekly Vol 22
  • Cree and Gospower Deliver Silicon Carbide to Server Power Supply Market
  • Mitsubishi Electric to Launch T-series 2.0kV IGBT Module for Industrial Use
  • ON Semiconductor Announces New Full Silicon Carbide MOSFET Module Solutions for Charging Electric Vehicles at APEC 2021
  • Alpha and Omega Semiconductor Announces New Director Nominees
  • How to Read an IGBT Module Datasheet
Power Semiconductors Weekly Vol 21
  • Bosch Opens Chip Factory of the Future in Dresden
  • Toshiba’s Triple-Gate IGBT Power Semiconductors Cut Switching Power Losses by 40.5%
  • 5th Generation 650V SiC Schottky MPS™ Diodes for Best-in-Class Efficiency
  • G3R™ 750V SiC MOSFETs Offer Unparalleled Performance and Reliability
  • Japan Puts All Chips on the Table to Lure Semiconductor Makers
Power Semiconductors Weekly Vol 20
  • Welsh Chip Maker Newport Wafer Fab Fears Chinese Takeover by Stealth
  • SEMI: Global 200MM Fab Capacity on Pace to Meet Surging Demand, Address Chip Shortage
  • Samsung Chose Infineon for Its First MOSFET-Based Refrigerator Inverter Design
  • The 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) is Online
  • Join Wolfspeed Silicon Carbide Power Experts for a Five-Week Seminar Series
Power Semiconductors Weekly Special Edition Vol 01. PCIM Europe Digital Days 2021
  • Mitsubishi Electric
  • Semikron
  • Infineon Technologies
  • Fuji Electric
  • Hitachi ABB Power Grids
  • Dynex Semiconductor
  • Littelfuse
  • On Semiconductor
  • Wolfspeed
  • Sirectifier
  • STMicroelectroics
  • SanRex
  • Nexperia
  • ROHM Semiconductor
  • Vishay
  • WeEn Semiconductors
Power Semiconductors Weekly Vol 19
  • TSMC to Increase Auto Chip Output by 60% in 2021
  • STMicroelectronics Honored with Prestigious IEEE Milestone for Historical “Multiple Silicon Technologies on a Chip” Achievement
  • ROHM’s ‘Environmental Vision 2050’
  • Gartner Says Global Chip Shortage Expected to Persist Until Second Quarter of 2022
  • Japan to Boost Spending to Promote Local Chip Production
  • Bodo’s Expert Talk in June
Power Semiconductors Weekly Vol 18
  • China’s BYD Plans to Spin Off and List Semiconductor Unit 
  • Toshiba’s New Technology for SiC Power Modules Improves Reliability and Reduces Size 
  • The New SEMIKUBE for 3-Level Designs 
  • South Korea Vows to Build World’s Largest Semiconductor Belt 
  • ROHM and Mouser Present New eBook on Power Solutions for Next-Generation Electric Vehicles 
  • 15th International Seminar on Power Semiconductors 

Power Semiconductors Weekly Vol 17
  • Industry’s First Automotive Qualified SiC Six-Pack Power Module for EV Traction Inverters – Easy Power Upscaling with HybridPACK™ Drive CoolSiC™
  • CISSOID Expands Its SiC Intelligent Power Modules Platform
  • Imec and AIXTRON Demonstrate 200 mm GaN Epitaxy on AIX G5+ C for 1200V Applications with Breakdown in Excess of 1800V
  • On Semi Brings Silicon Carbide to Formula E Power Inverter
  • NXP Sells $2 Billion of Debt to Fund Power-Saving Semiconductors
  • Infineon Increases Supply Security for Silicon Carbide by Expanding the Supplier Base
  • Industry Alliance Crucial to SiC Advancement in Taiwan, Says Actron Chair
Power Semiconductors Weekly Vol 16
  • SEMIKRON and Silicon Mobility Announce Collaboration into a 24V to 96V Inverter Platform for Batteries Powered Vehicles up to 50KW 
  • Mitsubishi Electric to Launch New X-Series HVIGBTs and HVDIODEs 
  • Nexperia’s 650 V GaN FETs Enable 80 PLUS ® Titanium-class Power Supplies Operating at 2 kW and Above 
  • EiceDRIVER™ X3 Enhanced and X3 Compact
  • EasyPACK™ CoolSiC™ MOSFET Module Supports Fast-Switching DC-Link Voltage of 1500 V for Solar Systems and ESS Applications 
  • Yes Power Technix Supplies SiC Power Chips for Use in E-bikes 
  • JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices
  • SiC MOSFET in Solar & Energy Storage Webinar 
Power Semiconductors Weekly Vol 15
  • TSMC Supplier Expects To Equip U.S. Chip Plant In September Next Year 
  • Yes Power Technix to Receive SiC Trench MOSFET Tech 
  • Foxconn in Talks to Buy Chip Plant to Support EV Ambitions 
  • Taiwan to Launch Programs to Expand Semiconductor Workforce 
  • Construction of Cree Site Nears Completion 
  • II-VI Incorporated Inaugurates Technology and R&D Center in Shanghai 
  • Benefits of Using Silicon Carbide in Next Generation Programmable Power Test Solutions 
Power Semiconductors Weekly Vol 14
  • II-VI Incorporated Expands Silicon Carbide Manufacturing Footprint for Power Electronics in Electric Vehicles and Clean Energy Applications 
  • New LoPak module: Now for 1200 V Applications with Same Familiar Packaging 
  • IIT Hyderabad, NXP India, MeitY Join Hands to Boost Semiconductor and IP Startups 
  • TSMC Plant Hit By Power Outage – Millions Of Dollars In Damage Expected 
  • Bidirectional Topologies and Semiconductors for e-Mobility On-Board Chargers
Power Semiconductors Weekly Vol 13
  • Vishay Intertechnology World’s Best Automotive -80 V P-Channel MOSFET Increases Efficiency and Power Density 
  • China’s Wingtech Builds $2Bn EV-Geared Plant Amid Chip Shortage 
  • Boost for Semiconductor Production in Austria 
  • ROHM Semiconductor Europe Appoints New President 
  • Toshiba Gets Buyout Offer from British Private Equity Firm 
  • Push the Limits of Efficiency and Power Density for EV Charger Converters 
  • EBV Elektronik Presents: SiC/GaN Training Days 
  • APEC 2021 Conference Goes Virtual 
Power Semiconductors Weekly Vol 12
  • Renesas Says Normal Production at Fire-Hit Chip Plant to Take 100-120 Days 
  • CEO of Largest U.S. Chip Foundry Explains Why Semiconductor Shortage Could Last Through 2022 
  • How Will Chipmaker TSMC Spend $100 Billion in 3 Years? Easy 
  • China Cuts Taxes to Spur Semiconductor Expansion 
  • II-VI Wins Battle for Coherent 
  • High Efficient PFC Systems with STMicroelectronics Technology 
Power Semiconductors Weekly Vol 11
  • Achieving Industry-Leading Low Loss, Expanding the Discrete IGBT XS Series Lineup 
  • MiniSKiiP®DUAL with Advanced NEW Die-attach Technology 
  • Vitesco Technologies Wins Major Order for 800-volt Sic-Technology in Electric Vehicles 
  • South Korea Eyes Next-Generation Power Chips 
  • Semiconductor Equipment Billings Set Another Record High 
  • Show Must Go On. Live Semiconductor Events in April 
Power Semiconductors Weekly Vol 10
  • ZF Offers 800-Volt Components for Electric Vehicles
  • Power-efficient On-board Electrical System Uses Technology Developed by Siemens Mobility and Infineon
  • UnitedSiC FET-Jet Calculator
  • Nexperia and United Automotive Electronic Systems Agree Comprehensive Partnership for Gallium Nitride
  • China’s SMIC Gets Shenzhen Funds for US$2.4bn Fab
  • Japan’s Silicon Wafer Latecomers Turn to China for Expansion
  • Enabling 99.3% Efficiency in 3.6kW Totem-pole PFC Using 750V Gen 4 SiC FETs
Power Semiconductors Weekly Vol 8
  • New 650 V CoolSiC™ Hybrid Discrete for Automotive
  • Alpha and Omega Semiconductor Releases Automotive Qualified 1200V αSiC MOSFETs for Electric Vehicle Applications
  • Renesas to Purchase Dialog Semiconductors for $5.9bn
  • Power Electronics for E-Mobility 2021
  • EE Times Presents: Roadmap to Next-Gen EV & AV
  • EDA Direct and Siemens ‘Thermal Testing of High Power Density Semiconductors for Vehicle Electrification’ Webinar
Power Semiconductors Weekly Vol 9
  • Bosch Reaches Milestone on the Way to Opening New Wafer Fab in Dresden
  • Toshiba Electronic Devices & Storage Corporation Announces Major Investment in Power Devices Business
  • Toshiba Releases 650V Super Junction Power MOSFETs
  • Infineon Launched StrongIRFET™ 2 Power MOSFETs
  • Marelli Launches Proprietary Full SiC Power Module for Electric and Hybrid Traction Applications in Motorsports
  • The 2021 Technology Outlook for Silicon Carbide Semiconductors
  • Bodo’s WBG Expert Talk
Power Semiconductors Weekly Vol 7
  • Toshiba Launches Silicon Carbide MOSFET Module
  • Nexperia Announces Plans to Grow Global Production and Increase R&D Spend
  • ON Semiconductor CEO Expects Auto Chip Backlog to End by Third Quarter
  • Denso Expands Semiconductor Capacity in Malaysia
  • Infineon Says Can Meet Chip Demand with Help of New Austria Plant
  • Biden to Order EV Battery, Mineral Supply Chain Review
  • Powerex Announces New CEO
  • Power SiC – Life in The Fast Lane as SiC Penetration Accelerates – Webcast
Power semiconductors weekly Vol 6
  • GeneSiC’s New 3rd Generation SiC MOSFETs
  • ON Semiconductor’s New 650V Silicon Carbide MOSFETs
  • NXP and Infineon Plants Hit by Power Outage in Texas Storm
  • TSMC to Help Automotive Industry
  • Chipmaker Renesas Halts Ibaraki Plant Operations on Quake Checks
  • Industrial Wide-Bandgap Developer Forum
  • GaN for Appliance and Industrial Applications
  • PCIM Europe to Be Held Digitally Only from 3–7 May 2021
Power Semiconductors Weekly Vol 5
  • GaN Systems Ships 20,000,000 GaN Transistors
  • CEO Interview: The Next Generation of GaN Power ICs
  • ROHM SiC MOSFETs Solve Design Challenges for Leading Solar Energy Company Midnite Solar
  • Richardson Electronics, Ltd. Continues Expansion of Power Management Capabilities with SemiQ Third Generation SiC Diode Modules
  • Infineon Bets on Strong EV Growth
  • US Chip Industry Calls on Biden Administration to Fund Factories
  • Review of the 2020 Semiconductor Market and a Look to 2021
  • SemiSel 5: Simplify Power Semiconductor Selection
Power Semiconductors Weekly Vol 4
  • Samsung considers purchasing NXP Semiconductors, Renesas, Infineon, or Texas Instruments
  • Infineon Strives to Meet Auto Industry Demand as Supply Chains Creak
  • Infineon New 650 V CoolSiC™ Hybrid IGBT
  • Chip Shortage Disrupts General Motors to Idle Three North American Plants Next Week
  • JEDEC Wide Bandgap Power Semiconductor Committee Publishes its First Guideline for Silicon Carbide (SiC) Based Power Conversion Devices
  • PCIM Europe Will Take Place from 31 August – 2 September 2021 in Nuremberg, Germany
Power Semiconductors Weekly Vol 2
  • Fuji Electric Launches X Series IGBT
  • Vincotech’s New 1200 V Sixpack Solution for Servo Drive Applications
  • ROHM Completes New Building at Apollo Plant in Chikugo
  • Mouser Has Announced a Global Distribution Agreement with SanRex
  • Da Nang Licenses US$110 Million Semiconductor Project
  • Toshiba’s Lineup Expansion of Schottky Barrier Diodes
  • AspenCore Guide to Gallium Nitride: A New Era for Power Electronics
  • PCIM Asia relocates to Shenzhen in September 2021
Power semiconductors weekly Vol 3
  • SK Group Invests in Domestic Producer of Silicon Carbide
  • Vishay 650 V SiC Schottky Diodes
  • Japan’s Renesas Steps in to Ease Automotive Chip Shortage
  • Infineon Expands EiceDRIVER Portfolio
  • JEDEC WBG Power Semiconductor Committee Publishes New Test Method
  • Anglia Expands SiC Portfolio with UnitedSiC
  • Power Semiconductors Webinars
  • On Semiconductor and Cree Changes in Management
Power Semiconductors Weekly Vol 1
  • Denso’s new silicon carbide power semiconductors used in Toyota Mirai
  • Rohm will invest 60 billion yen to increase output of next-generation power semiconductors for
  • Automotive Chip Shortages Only Part of the Problem
  • Major China MOSFET supplier raises prices
  • 3rd Generation 650V/1200V SiC Diode Modules Released from SemiQ
  • Cree Delivers New Silicon Carbide Power Module Portfolio
  • The Infineon-Cypress Merger: What Does it Mean for the Tech Industry?