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Vincotech is returning to PCIM, the world’s leading power electronics expo and conference to showcase its latest technologies and innovations, including GaN and many more products for Motion Control, Renewable and Power Supply use cases. In keeping with this year’s expo slogan “Empowering your ideas,” the company’s application-specific capabilities will be on prominent display.
Highly anticipated, PCIM Europe event is sure to draw thousands of visitors, and Vincotech is thrilled to be back. “Our fair booth will feature all kinds of new tech, and we can’t wait to show customers and prospects how our solutions benefit their business. Hot topics, innovations, donations – expect all that and more”, says Edoardo Guiotto, VP Sales and Marketing.
This year’s big talking point is the company’s commitment to application-specific solutions enabled by a wide range of industrystandard and proprietary housings, multi-source chipsets, expedited time-to-market, and early sample availability. Highlights include a solution for SEW-EURODRIVE, showcased with a station displayed at the booth.
- One spotlight will be on GaN, a cutting-edge technology that has the industry abuzz. Vincotech, which is driving advances on this front, is going to demonstrate the potential, benefits, and applications of GaN in power modules.
- Innovations in motor control applications will also figure prominently. Reliability and performance packed into a small footprint – that’s what sophisticated motor control use cases need. Highly integrated and engineered to support complex electrical and thermal designs, Vincotech’s embedded drive solutions meet these demands. For Industrial drives the tandem diode solutions are available for SixPack, Twin SixPack and PIM topologies including custom and industry standard power module housings.
- Renewables are on the rise. Built on decades of experience in solar, Vincotech’s extensive portfolio of PV & ESS solutions is second to none. Residential, industrial, commercial – every use case and power range is well-covered.
- Leading the way in power supply, Vincotech offers outstanding power module solutions. Highlights in DC fast charging include a built-to-boost 3-phase resonant converter, the fastPACK 1 GaN 2-in-1 featuring advanced Wide Bandgap (WBG) tech, and many ultra-compact, integrated solutions and low inductive modules. Enhancing the performance of Uninterruptible Power Supplies (UPS), Vincotech has a wide range of solutions from 20 kW – 250 kW power.
Like in previous years, Vincotech teams up with Plan International Germany, bringing an exciting VR experience to the event. Visitors can challenge themselves by flying over the mountains in virtual reality, while knowing their participation supports a greater good. Vincotech will match all flights with a donation, targeting a Plan International project for teenagers in Ecuador.
Vincotech’s PCIM presentations at a glance:
Tuesday, June 11
11:15 Exhibitor forum
David Chilachava: NEW fastPACK 1 GaN – The Best Utilization of GaN Technology Benefits in an Industrial Power Module PackageWednesday, June 12
11:20 Bodo’s panel discussion on “SiC Wide Bandgap Design, the Future of Power”)
Evangelos Theodossiu: SiC power module design: Why does it matter?
14:30 Conference, Room: München 2
A joint presentation with Siemens: Optimizing a Power Module for Electrical and Thermal Performance and Symmetry Using EDA ToolsThursday June 13
11:15 Conference poster sessions
Tiago Jappe: Power Module Solutions with Improved Reliability for Elevator Drive Applications
14:35 Exhibitor forum
Matthias Tauer: flow E3 Full SiC Power Module with Direct Pressed Substrate for Superior Thermal Performance and ReliabilityOriginal – Vincotech
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Vincotech introduced a GaN-based power module which provides an effective solution for highly efficient power conversion in isolated DC/DC converters or DC/AC inverter stages. It offers a 2-in-1 solution, and can be utilized either as a 10mOhm H-Bridge or 5mOhm half-bridge.
The module features E-mode GaN HEMTs chip technology, promoting high efficiency and power density, and is available in an industry-standard package with low stray loop inductance. It is compatible with external gate drives, offering engineers high design flexibility.
Main benefits
- Highest design flexibility with external gate driver, enabling slew rate control for low EMC
- Low voltage overshoots due to integrated snubber capacitors
- High power density and small footprint for soft switching above 500kHz
- Kelvin source pin and low inductive gate loop for clean switching behavior
Applications
- DC fast charger
- Solar inverter
- UPS
Original – Vincotech
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Semikron Danfoss and Vincotech announced the renewal of their cooperation agreement for power semiconductor module packaging. The two enterprise’s alliance, dating back to 2003, has been extended to further strengthen MiniSKiiP packaging technology.
This move underscores Semikron Danfoss and Vincotech’s commitment to advancing MiniSKiiP and delivering cutting-edge solutions that meet the needs of the power electronics industry.
“The partnership with Vincotech is key to ensuring the safe supply of our number one motor drive module MiniSKiiP to our customers,” said Peter Sontheimer, Senior Vice President Industry Division at Semikron Danfoss. “We strongly believe that this type of arrangement is beneficial to the long-term health of the power electronics supply chain.”
Multiple source options for the package to further mitigate the supply chain risk, as well as standards-compliant design, are just a few of the benefits of this renewed cooperation agreement. Engineered for easy assembly and featuring service-friendly spring contacts, MiniSKiiP’s unique hardware has earned an excellent reputation for efficiency and performance in general purpose and servo motor drives.
“We are delighted to be renewing our partnership with Semikron Danfoss for the MiniSKiiP package technology,” said Edoardo Guiotto, VP Sales & Marketing at Vincotech. “This agreement reaffirms our dedication to deliver premium products to our customers and drive innovation and advances in power electronics.”
Semikron Danfoss and Vincotech are now set to take MiniSKiiP’s reliability and standardization to the next level. Customers can look forward this technology bringing even greater robustness, versatility, and compatibility to their products.
Original – Semikron Danfoss
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Efficiency is a big deal for heat pumps and HVAC systems that require higher power from a smaller footprint. The new Vincotech power module 1200V PIM+PFC resolves that contradiction by taking efficiency to a whole other level. Featuring a 3-phase ANPFC and an inverter stage, it enables your engineers to design more deeply integrated systems that drive costs down.
Main Benefits
- All-in-one solution: 3-phase PFC with inverter stage in a compact flow1 housing allows for more compact designs and higher power density
- AN-PFC with SiC MOSFETs and SiC diodes for up to 200 kHz: remarkably efficient topology brings down system costs
- Thin Al2O3 substrate facilitates overall thermal design
- Inverter stage featuring SiC MOSFETs for high-frequency switching
- Integrated thermal sensor simplifies temperature measurement
Applications
- Embedded Drives
- HVAC, Heatpumps
Original – Vincotech
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Engineered for maximum power density, this half-bridge module can serve to construct excellent H-bridges and sixpacks. Far higher current handling, enhanced power loss dissipation, greater scalability than a solution with a single-module footprint – the flowDUAL delivers all this and more.
In combination with VINcoPress and advanced die-attach technology, this new baseplate-less module from Vincotech is your first choice for a wide range of high-power use cases where utmost efficiency and reliability are top priorities.
Main benefits
- Outstanding, ≥99% conversion efficiency brings down overall costs
- Low stray inductance and symmetrical chip layout enable higher switching frequency and lower system costs
- Greater supply chain security with
– the new flow E3 industry standard-compatible housing (CTI >600)
– the latest multi-sourced SiC devices - Excellent thermal performance with VINcoPress technology to decrease junction temperature and increase lifetime
- Pre-applied PC-TIM rated for 150°C helps reduce production cost
Applications
- Industrial drives
- Embedded drives
- EV Chargers
- Solar
- UPS
Original – Vincotech
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Designing state-of-the-art heat pumps and HVAC systems is not easy. Finding a way to overcome demands, such as giving more power in a smaller footprint requires a lot from a power module.
Vincotech’s new 1200 V PIM+PFC is the answer. Its integrated three-phase ANPFC and inverter stage resolve contradiction to boost efficiency and cut systems costs. More compact designs at higher power ranges is not a problem any more.
Samples are available through our usual channels.
Main benefits
- All-in-one solution: 3-phase PFC with inverter stage in a compact flow1 housing allows for more compact designs and higher power density
- High efficient AN-PFC topology with SiC diodes for switching frequencies up to 150 kHz reduces systems costs
- High speed IGBT’s in the inverter stage for high switching frequency operation
- Thin Al2O3 substrate eases the system’s thermal design
- Integrated thermal sensor simplifies temperature measurement
Applications
- Embedded drives
- Industrial drives
Original – Vincotech
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The new Vincotech 1200 V flowCSPFC S3 SiC module featuring current-synthesizing PFC (CS-PFC) topology based on the constant power control, strikes the best balance between performance and system cost to benefit your business.
The first module of this new product family is well suited for a DC fast charger PFC converter stage up to 35kW power, a “sweet spot” for building scalable DC charger units on a modular approach.
Main benefits
- Current-synthesizing PFC slashes module costs by > 25% with conversion efficiencyranging as high as >99%
- System costs come down with fewer and smaller inductors on the PCB
- No large electrolytic DC-link capacitors for even more system-level savings
- Pinout is ready for bidirectional applications and optimized for easy PCB routing
- High power density for compact designs and fast charging
Applications
- EV fast charger
- UPS
- ESS
Original – Vincotech
