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LATEST NEWS2 Min Read
The Semiconductor Industry Association (SIA) announced Texas Instruments Chairman of the Board Rich Templeton has been elected Chair of the SIA Board of Directors and Western Digital CEO David Goeckeler has been elected SIA Vice Chair. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“It is a great pleasure to welcome our new leadership team for the year ahead, Rich Templeton of Texas Instruments and David Goeckeler of Western Digital,” said John Neuffer, SIA President and CEO. “Rich is extremely knowledgeable about the challenges we face as an industry and how we can overcome them, and David is a seasoned industry veteran and a highly effective champion for SIA’s priorities. Together, they will make an outstanding team as leaders of the SIA Board of Directors in 2024.
Templeton became Chairman of Texas Instruments in April 2008 and was President and CEO from May 2004 through March 2023. From April 2000 through April 2004, Templeton was Chief Operating Officer of TI. He was Executive Vice President of the company and President of TI’s semiconductor business from June 1996 through April 2004.
As CEO, Templeton maintained the company’s strategic investments in R&D and manufacturing, while expanding the size of the sales and applications engineering team to better serve TI customers. Under his leadership, TI emerged stronger, with better technological and product positions in both its core businesses. Templeton joined the company in 1980 after earning a B.S. in electrical engineering from Union College in New York.
“Semiconductor technology is making the world smarter, greener, more efficient, and better connected, and effective government policies are needed to help the industry continue to grow and innovate,” said Templeton. “I look forward to working alongside my colleagues on the SIA Board to advocate for industry priorities in Washington and capitals around the world.”
Since joining Western Digital in March 2020, Goeckeler has focused on the company’s transformation as the leading data storage producer in the industry. Before becoming CEO, he was Executive Vice President and General Manager of Cisco’s Networking and Security Business, with responsibility for more than $34 billion of the company’s global technology franchise.
He led a worldwide team of more than 25,000 engineers and oversaw Cisco’s networking and security strategy and market acceleration, including development operations for the company’s expansive technology portfolio and strategic acquisitions.
Original – Semiconductor Industry Association
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Texas Instruments Incorporated (TI) reported third quarter revenue of $4.53 billion, net income of $1.71 billion and earnings per share of $1.85. Earnings per share included a 5-cent benefit for items that were not in the company’s original guidance.
Regarding the company’s performance and returns to shareholders, Haviv Ilan, TI’s president and CEO, made the following comments:
- “Revenue was flat sequentially and decreased 14% from the same quarter a year ago. During the quarter, automotive growth continued and industrial weakness broadened.
- “Our cash flow from operations of $6.5 billion for the trailing 12 months again underscored the strength of our business model, the quality of our product portfolio and the benefit of 300-mm production. Free cash flow for the same period was $1.6 billion.
- “Over the past 12 months we invested $3.7 billion in R&D and SG&A, invested $4.9 billion in capital expenditures and returned $5.6 billion to owners.
- “TI’s fourth quarter outlook is for revenue in the range of $3.93 billion to $4.27 billion and earnings per share between $1.35 and $1.57. We continue to expect our 2023 effective tax rate to be about 13% to 14%.”
Original – Texas Instruments
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LATEST NEWS2 Min Read
Texas Instruments announced its new 300-mm semiconductor wafer fabrication plant in Richardson, Texas, RFAB2, achieved LEED (Leadership in Energy and Environmental Design) Gold certification under version 4 (v4). This designation makes RFAB2 the first wafer fab in the United States and the fourth in the world to achieve this more stringent certification from the U.S. Green Building Council (USGBC) for the sustainable design, construction and operation of high-performance green buildings.
“One of TI’s ambitions is to be a company that our employees are personally proud to be a part of and would want as our neighbor,” said Brian Dunlap, vice president, 300-mm Wafer Fab Manufacturing Operations at Texas Instruments. “We are proud that RFAB2 has achieved LEED Gold v4 certification, underscoring TI’s long-standing commitment to operate in a socially thoughtful and environmentally responsible manner.”
RFAB2, which is TI’s fourth LEED-certified manufacturing plant, was designed to reduce water and electricity usage. In fact, the new fab’s design, construction and operation are expected to achieve significant efficiencies, including saving 750 million gallons of potable water and almost 80,000 megawatt-hours of energy annually. The factory was also constructed using responsibly sourced materials and was designed and built in a way that fosters a healthy work environment.
“What makes this LEED Gold designation impressive is that Texas Instruments achieved this high standard developed for office buildings in a semiconductor manufacturing plant,” said Jill Kurtz, director of Building Sciences at Page, who consulted TI in the certification process. “By prioritizing sustainability and transparency, TI is delivering real impact in water and energy savings, leading the way in their industry and helping USGBC continue toward its goal of green buildings for everyone within this generation.”
The LEED Gold v4 certification solidifies TI’s dedication to responsible, sustainable manufacturing, including multi-year goals and programs focused on conserving natural resources, reducing energy consumption and mitigating environmental impact. To learn more about TI’s commitment to sustainability, download the company’s latest Corporate Citizenship Report.
Original – Texas Instruments