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Texas Instruments Incorporated reported fourth quarter revenue of $4.42 billion, net income of $1.16 billion, and earnings per share of $1.27, which included a $0.06 reduction not reflected in the original guidance. Management noted revenue decreased 7% sequentially and increased 10% year over year, with cash flow from operations over the trailing 12 months at $7.2 billion and free cash flow at $2.9 billion. Over the past year, TI invested $3.9 billion in R&D and SG&A, $4.6 billion in capital expenditures, and returned $6.5 billion to owners.
Q4 2025 vs. Q4 2024
- Revenue: $4.423B vs. $4.007B (+10%)
- Operating profit: $1.473B vs. $1.377B (+7%)
- Net income: $1.163B vs. $1.205B (-3%)
- EPS: $1.27 vs. $1.30 (-2%)
Cash generation (trailing 12 months, Q4 2025 vs. Q4 2024)
- Cash flow from operations: $7.153B vs. $6.318B (+13%)
- Free cash flow: $2.938B vs. $1.498B (+96%)
- Free cash flow as a % of revenue: 16.6% vs. 9.6%
Cash returned (trailing 12 months, Q4 2025 vs. Q4 2024)
- Dividends paid: $4.999B vs. $4.795B (+4%)
- Stock repurchases: $1.477B vs. $0.929B (+59%)
- Total cash returned: $6.476B vs. $5.724B (+13%)
Outlook
- Q1 2026 revenue expected in the range of $4.32B to $4.68B
- Q1 2026 EPS expected between $1.22 and $1.48
Free cash flow is defined as cash flow from operations less capital expenditures, plus proceeds from U.S. CHIPS and Science Act incentives.
Original – Texas Instruments
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Texas Instruments (TI) announced the start of production at its newest 300 mm semiconductor fab in Sherman, TX, just three and a half years after breaking ground. TI leaders joined local and state officials to mark the opening of SM1, a state-of-the-art facility that will ramp in line with customer demand and ultimately produce tens of millions of chips daily for smartphones, automotive systems, medical devices, industrial robots, smart appliances and data centers.
As the largest foundational semiconductor manufacturer in the U.S., TI supplies analog and embedded processing devices that are essential to nearly every modern electronic system. Expanding the company’s 300 mm manufacturing footprint strengthens supply assurance and long-term capacity. By owning and controlling manufacturing, process technology and packaging, TI gains greater control over delivery and resilience for customers in any environment.
“The start of production at our newest wafer fab in Sherman, TX represents what TI does best: owning every part of the manufacturing process to deliver the foundational semiconductors that are vital for nearly every type of electronic system,” said Haviv Ilan, president and CEO of Texas Instruments. “As the largest analog and embedded processing semiconductor manufacturer in the U.S., TI is uniquely positioned to provide dependable 300 mm semiconductor manufacturing capacity at scale. We’re proud to have called North Texas home for nearly a century, and excited about how TI technology will enable the technological breakthroughs of the future.”
TI’s Sherman mega-site is planned for up to four connected wafer fabs, to be constructed and equipped as market demand warrants. At full build-out, the site is expected to support as many as 3,000 direct jobs, along with thousands more in supporting industries. The Sherman investment forms part of TI’s broader plan to invest more than $60 billion across seven fabs in Texas and Utah—positioned as the largest commitment to foundational semiconductor manufacturing in U.S. history. With 15 manufacturing sites worldwide, TI’s internal operations leverage decades of proven manufacturing expertise to provide greater supply-chain control and dependable delivery for customers.
Original – Texas Instruments
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Texas Instruments (TI) has announced the opening of its newest state-of-the-art assembly and test facility, TIEM2, located in Melaka, Malaysia. This latest investment marks a significant milestone in TI’s long-term strategy to expand internal manufacturing capacity and strengthen supply chain resilience.
The new six-level factory spans more than 900,000 square feet and is now fully operational. Connected to TI’s existing assembly and test factory in Melaka, the combined facilities now provide more than 1.4 million square feet of manufacturing space dedicated to transforming processed semiconductor wafers into finished chips. The factory is designed to bump, probe, assemble, and test billions of analog and embedded chips annually for a wide range of applications, including automotive systems, smartphones, industrial automation, and data centers.
Representing a potential investment of up to MYR 5 billion, the TIEM2 facility is expected to support up to 500 local jobs once fully ramped. The factory is part of TI’s broader initiative to bring 90 percent of its assembly and test operations in-house by 2030, reinforcing its long-standing commitment to internal manufacturing and operational control.
To mark the official opening, TI hosted Melaka Chief Minister Datuk Seri Utama Ab Rauf Yusoh and other dignitaries for a tour of the site.
“Texas Instruments’ investment in Melaka is a strong endorsement of our state’s potential,” said Datuk Seri Utama Ab Rauf Yusoh. “When fully operational, this facility will generate hundreds of new high-quality jobs and contribute significantly to Melaka’s industrial and technological growth.”Subbah Rao, vice president and country managing director for Texas Instruments Malaysia, added:
“For more than 50 years, TI has built its presence in Malaysia, and this new factory underscores the talent and expertise of our team here. Our Melaka expansion strengthens our internal manufacturing capabilities, enabling us to reliably deliver products to our customers when and where they need them.”TI has a global footprint of 15 manufacturing sites, including wafer fabs, assembly and test factories, and bump and probe operations. The addition of this new facility enhances TI’s manufacturing ecosystem in Malaysia, complementing existing operations in both Melaka and Kuala Lumpur and enabling greater scalability and operational efficiency.
TIEM2 was also designed with sustainability in mind and is on track to achieve Leadership in Energy and Environmental Design (LEED) Gold certification. Advanced factory equipment helps minimize energy, water, and waste consumption per chip, aligning with TI’s commitment to responsible manufacturing practices.
With this expansion, TI continues to build on its decades-long legacy in Malaysia, advancing innovation and supporting customer demand across global markets.
Original – Texas Instruments
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Texas Instruments (TI) has announced its financial results for the third quarter, reporting revenue of $4.74 billion, net income of $1.36 billion, and earnings per share (EPS) of $1.48. The EPS included a 10-cent reduction that was not part of the company’s initial guidance.
TI President and CEO Haviv Ilan highlighted that the company achieved a 7 percent sequential increase in revenue and a 14 percent rise compared to the same period last year, with growth recorded across all end markets.
Ilan emphasized that cash flow from operations over the past 12 months reached $6.9 billion, reflecting the strength of the company’s business model, its broad product portfolio, and the efficiency gains from 300mm manufacturing. Free cash flow for the same period totaled $2.4 billion.
During the last year, TI invested $3.9 billion in research and development as well as selling, general, and administrative expenses. The company also allocated $4.8 billion to capital expenditures and returned $6.6 billion to shareholders through dividends and stock repurchases.
Looking ahead, TI expects fourth-quarter revenue to range between $4.22 billion and $4.58 billion, with projected earnings per share between $1.13 and $1.39.
Original – Texas Instruments
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Texas Instruments has announced that its board of directors has elected President and Chief Executive Officer Haviv Ilan to assume the additional role of chairman, effective January 2026. Ilan will succeed Rich Templeton, who is set to retire at the end of 2025, concluding a remarkable 45-year career with the company.
Ilan, who joined TI in 1999, has served as president and CEO since 2023 and has been a member of the company’s board since 2021. Over his 26-year career at TI, he has held key leadership positions across the analog and embedded processing businesses, as well as serving as chief operating officer before becoming CEO.
“Rich leaves an incredible legacy at TI and across the semiconductor industry,” said Janet Clark, lead director of TI’s board and chair of the audit committee. “He has been a transformative leader whose vision, passion, and wisdom have shaped TI into the great company it is today. This transition is well planned, and the company is in an excellent position operationally, financially, and strategically. Haviv’s appointment as chairman reflects his proven leadership and the board’s confidence in his ability to continue strengthening TI for the long term.”
Reflecting on the announcement, Ilan expressed gratitude for Templeton’s leadership and lasting influence. “On behalf of our entire company, I want to thank Rich for his steadfast dedication and contributions to TI. His leadership has been instrumental in driving our success and inspiring a generation of leaders. I am honored to carry his legacy forward as we continue executing our strategy, reinforcing our competitive strengths, and creating long-term value.”
Templeton’s retirement marks the close of an era at TI. Under his leadership, the company solidified its position as a global leader in analog and embedded semiconductors, achieved record growth, and maintained a strong culture of innovation and operational excellence.
The planned transition ensures continuity in leadership as TI continues to focus on long-term strategic growth and strengthening its position in the global semiconductor industry.
Original – Texas Instruments
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Texas Instruments (TI) has introduced a new suite of power-management technologies and design resources to address the increasing energy demands of artificial intelligence (AI) data centers. The announcement was made ahead of the Open Compute Project (OCP) Global Summit in San Jose, California, where TI will showcase its latest innovations supporting the industry’s transition from 12 V and 48 V power systems to high-efficiency 800 VDC architectures.
As AI workloads grow and IT rack power approaches the megawatt scale, TI is collaborating with NVIDIA to develop advanced power-management devices optimized for the emerging 800 VDC data center standard. These new solutions aim to deliver higher efficiency, improved power density, and scalable energy conversion for next-generation AI computing infrastructure.
Among the highlights of TI’s announcement are several key resources and reference designs:
- White paper: “Power delivery trade-offs when preparing for the next wave of AI computing growth.” The paper explores design strategies for high-efficiency, high-density power delivery systems, emphasizing the technical benefits and challenges of adopting 800 VDC architectures.
- 30 kW AI server power-supply reference design: A dual-stage design featuring a three-phase, three-level flying capacitor PFC converter paired with dual delta-delta three-phase LLC converters. The system can be configured for a single 800 V output or split supplies to meet demanding AI workloads.
- Dual-phase smart power stage (CSD965203B): Delivers up to 100 A per phase and offers the highest peak power density in its class, allowing designers to scale power delivery efficiently across compact PCBs.
- Dual-phase smart power module (CSDM65295): Provides up to 180 A of peak output current in a 9 mm × 10 mm × 5 mm package, integrating two inductors and supporting trans-inductor voltage regulation for superior thermal and electrical performance.
- GaN intermediate bus converter (LMM104RM0): Offers up to 1.6 kW of output power with over 97.5 percent conversion efficiency in a compact quarter-brick form factor, supporting high light-load performance and active current sharing between modules.
According to Chris Suchoski, Sector General Manager for Data Centers at TI, the evolution of AI data centers requires scalable and efficient power infrastructures. “With the growth of AI, data centers are evolving from simple server rooms to highly sophisticated power infrastructure hubs,” he said. “Scalable power infrastructure and higher power efficiency are essential to meet these demands and drive future innovation. With TI devices, designers can build next-generation solutions that enable the transition to 800 VDC.”
TI’s participation at the OCP Global Summit will include live demonstrations, technical sessions, and presentations exploring advanced data center power architectures. The company continues to position itself as a key technology partner in developing efficient, reliable, and scalable power solutions that support the ongoing transformation of AI data centers worldwide.
Original – Texas Instruments
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Texas Instruments Incorporated reported second quarter revenue of $4.45 billion, net income of $1.30 billion and earnings per share of $1.41. Earnings per share included a 2-cent benefit that was not in the company’s original guidance.
Regarding the company’s performance and returns to shareholders, Haviv Ilan, TI’s president and CEO, made the following comments:
- “Revenue increased 9% sequentially, led by continued broad recovery in industrial, and 16% from the same quarter a year ago.
- “Our cash flow from operations of $6.4 billion for the trailing 12 months again underscored the strength of our business model, the quality of our product portfolio and the benefit of 300mm production. Free cash flow for the same period was $1.8 billion.
- “Over the past 12 months we invested $3.9 billion in R&D and SG&A, invested $4.9 billion in capital expenditures and returned $6.7 billion to owners.
- “TI’s third quarter outlook is for revenue in the range of $4.45 billion to $4.80 billion and earnings per share between $1.36 and $1.60, which does not include changes related to recently enacted U.S. tax legislation.”
Original – Texas Instruments
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Texas Instruments received the prestigious “Operational Excellence” award at the annual Volkswagen Group Award 2025 in Wolfsburg, Germany. The recognition highlights TI’s resilient semiconductor supply strategies and forward-looking investments in production capabilities.
Today’s vehicles rely on thousands of semiconductors that power essential functions from engine control to advanced safety and infotainment. TI’s automotive-qualified semiconductors not only help automakers create safer vehicle systems, but provide the advanced capabilities and scalability needed to meet current and future design requirements.
With more than 30 models planned in 2025 across multiple regions, brands and platforms, Volkswagen Group highlighted the importance of a dependable supply of foundational semiconductors to design the next generation of safer, smarter vehicles. The company emphasized its close collaboration with strategic semiconductor partners like TI to ensure greater efficiency and reliability.
“TI’s technological strength and broad automotive portfolio, paired with our dependable, long-term supply is helping drive the next generation of vehicle innovation,” said Stefan Bruder, president of Texas Instruments Europe. “We are proud to work alongside Volkswagen Group to help create smarter, safer automotive systems with more advanced capabilities and features than ever before.”
Volkswagen Group leverages TI’s product, technology and system-level expertise to shape the transformation of the automotive industry. TI supplies Volkswagen Group with analog and embedded processing products for their next-generation automotive systems, including microcontrollers, processors, power management and interface devices and DLP® digital micromirror devices.
Original – Texas Instruments
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Texas Instruments announced its plans to invest more than $60 billion across seven U.S. semiconductor fabs, making this the largest investment in foundational semiconductor manufacturing in U.S. history. Working with the Trump administration and building on the company’s nearly 100-year legacy, TI is expanding its U.S. manufacturing capacity to supply the growing need for semiconductors that will advance critical innovations from vehicles to smartphones to data centers. Combined, TI’s new manufacturing mega-sites in Texas and Utah will support more than 60,000 U.S. jobs.
“TI is building dependable, low-cost 300mm capacity at scale to deliver the analog and embedded processing chips that are vital for nearly every type of electronic system,” said Haviv Ilan, president and CEO of Texas Instruments. “Leading U.S. companies such as Apple, Ford, Medtronic, NVIDIA and SpaceX rely on TI’s world-class technology and manufacturing expertise, and we are honored to work alongside them and the U.S. government to unleash what’s next in American innovation.”
“For nearly a century, Texas Instruments has been a bedrock American company driving innovation in technology and manufacturing,” said U.S. Secretary of Commerce, Howard Lutnick. “President Trump has made it a priority to increase semiconductor manufacturing in America – including these foundational semiconductors that go into the electronics that people use every day. Our partnership with TI will support U.S. chip manufacturing for decades to come.”
Unleashing what’s next in American innovation
Today, TI is the largest foundational semiconductor manufacturer in the U.S., producing analog and embedded processing chips that are critical for smartphones, vehicles, data centers, satellites and nearly every other electronic device. In order to meet the steadily growing demand for these essential chips, TI is building on its legacy of technology leadership and expanding its U.S. manufacturing presence to help its customers pioneer the next wave of technological breakthroughs.
Igniting intelligence with Apple
“Texas Instruments’ American-made chips help bring Apple products to life, and together, we’ll continue to create opportunity, drive innovation, and invest in the future of advanced manufacturing across the U.S.,” said Apple’s CEO Tim Cook.
Fueling the future with Ford
Ford and TI are working to strengthen American manufacturing, combining Ford’s automotive expertise with TI’s semiconductor technology to help drive innovation and secure a robust, domestic supply chain for the future of mobility. “At Ford, 80% of the vehicles we sell in the U.S. are assembled in the U.S., and we are proud to stand with technology leaders like TI that continue to invest in manufacturing in the U.S.,” said Jim Farley, President and CEO of Ford Motor Company.
Connecting patient care with Medtronic
Medtronic and TI are partnering to improve lives when it matters most. “At Medtronic, our life-saving medical technologies rely on semiconductors to deliver precision, performance, and innovation at scale,” said Geoff Martha, Medtronic chairman and CEO. “Texas Instruments has been a vital partner – especially during the global chip shortages – helping us maintain supply continuity and accelerate the development of breakthrough therapies. We’re proud to leverage TI’s U.S.-manufactured semiconductors as we work to transform healthcare and improve outcomes for patients around the world.”
Advancing AI with NVIDIA
NVIDIA is partnering with TI to unleash the next generation of artificial intelligence architectures. “NVIDIA and TI share the goal to revitalize U.S. manufacturing by building more of the infrastructure for AI factories here in the U.S.,” said Jensen Huang, founder and CEO of NVIDIA. “We look forward to continuing our collaboration with TI by developing products for advanced AI infrastructure.”
Securing high-speed satellite internet with SpaceX
SpaceX is increasingly leveraging TI’s high-speed process technology to connect its Starlink satellite internet service with TI’s latest 300mm SiGe technology manufactured in Sherman, Texas. “Our fundamental mission is to revolutionize global connectivity and eliminate the digital divide. Core to this mission is constantly pushing the boundaries of what is possible,” said Gwynne Shotwell, president and COO of SpaceX. “SpaceX is manufacturing tens of thousands of Starlink kits a day – all right here in the U.S. – and we are making huge investments in PCB manufacturing and silicon packaging to expand even further. TI’s U.S.-made semiconductors are crucial for securing a U.S. supply chain for our products, and their advanced silicon manufacturing capabilities provide the performance and reliability needed to help us meet the growing demand for high-speed internet all around the world.”
Backed by the strength of TI’s U.S. manufacturing presence
TI is a driving force behind the return and expansion of semiconductor manufacturing in the U.S. The company’s more than $60 billion investment in U.S. manufacturing includes building and ramping seven, large-scale, connected fabs. Combined, these fabs across three manufacturing mega-sites in Texas and Utah will manufacture hundreds of millions of U.S.-made chips daily that will ignite a bold new chapter in American innovation.
- Sherman, Texas: SM1, TI’s first new fab in Sherman will begin initial production this year, just three years after breaking ground. Construction is also complete on the exterior shell of SM2, TI’s second new fab in Sherman. Incremental investment plans include two additional fabs, SM3 and SM4, to support future demand.
- Richardson, Texas: TI’s second fab in Richardson, RFAB2, continues to ramp to full production and builds on the company’s legacy of introducing the world’s first 300mm analog fab, RFAB1, in 2011.
- Lehi, Utah: TI is ramping LFAB1, the company’s first 300mm wafer fab in Lehi. Construction is also well underway on LFAB2, TI’s second Lehi fab that will connect to LFAB1.
Original – Texas Instruments
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Texas Instruments (TI) announced it is working with NVIDIA in the development of power management and sensing technologies for 800V high-voltage direct current (HVDC) power distribution systems for data center servers. The new power architecture paves the way for more scalable and reliable next-generation AI data centers.
With the growth of AI, the power required per data center rack is predicted to increase from 100kW today to more than 1MW in the near future. To power a 1MW rack, today’s 48V distribution system would require almost 450lbs of copper, making it physically impossible for a 48V system to scale power delivery to support computing needs in the long term.
The new 800V high-voltage DC power-distribution architecture will provide the power density and conversion efficiency that future AI processors require, while minimizing the growth of the power supply’s size, weight and complexity. This 800V architecture will enable engineers to scale power-efficient racks as data-center demand evolves.
“A paradigm shift is happening right in front of our eyes,” said Jeffrey Morroni, director of power management research and development at Kilby Labs and a TI Fellow. “AI data centers are pushing the limits of power to previously unimaginable levels. A few years ago, we faced 48V infrastructures as the next big challenge. Today, TI’s expertise in power conversion combined with NVIDIA’s AI expertise is enabling 800V high-voltage DC architectures to support the unprecedented demand for AI computing.”
“Semiconductor power systems are an important factor in enabling high-performance AI infrastructure,” said Gabriele Gorla, VP of System Engineering of NVIDIA. “NVIDIA is teaming with suppliers to develop an 800V high-voltage DC architecture that will efficiently support the next generation of powerful, large-scale AI data centers.”
Original – Texas Instruments
