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ROHM Co., Ltd. and Suchi Semicon Pvt. Ltd. have announced a strategic partnership to strengthen semiconductor manufacturing capabilities in India and support growing demand from both domestic and global markets.
The collaboration combines ROHM’s expertise in semiconductor device technology and global market presence with Suchi Semicon’s manufacturing capabilities and operational execution. Together, the companies aim to build a scalable and reliable manufacturing framework aligned with evolving industry requirements.
The partnership aligns with India’s “Make in India” initiative to expand domestic semiconductor production while maintaining global manufacturing standards. By establishing local capabilities, the companies aim to enhance supply chain resilience and provide trusted manufacturing solutions for customers.
As part of the collaboration, ROHM is evaluating the outsourcing of back-end processes for power semiconductor devices and integrated circuits to Suchi Semicon.
Key elements of the initiative include:
- Technical evaluations for manufacturing readiness
- Potential mass production shipments starting in 2026
- Development of an early-stage semiconductor manufacturing framework in India
The companies also plan to share a roadmap to expand the range of locally manufactured semiconductor packages, gradually broadening the scope of production activities.
Beyond manufacturing, the partnership will also focus on business development and market engagement. Both companies recognize increasing demand for locally manufactured semiconductors in India, particularly across industries such as automotive, industrial electronics, and energy systems.
To address this opportunity, ROHM and Suchi Semicon plan to:
- Conduct joint marketing initiatives leveraging Suchi Semicon’s local market expertise
- Expand collaboration into additional semiconductor ecosystem activities
- Explore new business opportunities aligned with India’s growing electronics sector
The companies emphasized that the alliance is intended to evolve into a long-term strategic partnership, supporting the sustainable growth of India’s semiconductor industry while strengthening global supply chains.
Original – ROHM
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ROHM Co., Ltd. has announced plans to integrate its proprietary GaN power device development and manufacturing technologies with process technology from TSMC, establishing an end-to-end GaN production system within the ROHM Group.
Under a newly signed license agreement, TSMC’s GaN process technology will be transferred to ROHM’s Hamamatsu facility, enabling the company to strengthen its supply capabilities in response to rapidly growing demand for GaN in applications such as AI servers and electric vehicles (EVs).
Gallium nitride (GaN) power devices offer superior high-voltage and high-frequency performance, enabling higher efficiency and reduced system size. While already widely adopted in consumer applications such as AC adapters, GaN is increasingly being used in high-voltage systems including:
- Power units for AI servers
- On-board chargers (OBCs) for EVs
Demand in these segments is expected to accelerate further as electrification and AI infrastructure continue to expand.
ROHM has been active in GaN development for years. The company established mass production of 150V GaN devices at ROHM Hamamatsu in March 2022. In the mid-power range, ROHM strengthened its supply structure through external collaborations — with TSMC as a key partner.
Key milestones in the collaboration include:
- Adoption of a 650V GaN process from TSMC beginning in 2023
- A December 2024 partnership agreement focused on automotive GaN
The newly announced technology integration represents a deeper evolution of this collaboration.
ROHM aims to complete the technology transfer and establish the new production system in 2027, positioning the company to meet expanding demand in AI server and automotive applications.
Upon completion of the transfer, ROHM and TSMC will amicably conclude their automotive GaN partnership. However, both companies stated they will continue working together to advance higher-efficiency and more compact power supply systems.
By bringing GaN production capabilities fully in-house while leveraging TSMC’s advanced process technology, ROHM is strengthening its long-term competitiveness in next-generation power semiconductors.
Original – ROHM
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ROHM has expanded its portfolio of 40 V and 60 V low-voltage MOSFETs for automotive applications by introducing new devices in the HPLF5060 package (4.9 mm × 6.0 mm). The MOSFETs target use cases such as main inverter control circuits, electric pumps and LED headlight systems, where compact size and robust mounting are increasingly important.
Automotive low-voltage MOSFET designs have been moving toward smaller footprints, including 5060-size packages and even more compact options. ROHM noted that this miniaturization can create mounting reliability challenges, particularly with narrow terminal spacing and leadless package structures.
To address these constraints, the HPLF5060 package combines a reduced footprint compared with the widely used TO-252 package (6.6 mm × 10.0 mm) with improved board-mount reliability through the use of gull-wing leads. ROHM also highlighted copper clip junction technology, which supports high-current operation and is intended to meet the demands of automotive environments.
Mass production of the new HPLF5060-based products began in November 2025, with a sample price of $3.5 per unit (excluding tax). ROHM said online sales have started and that the products are available through distributors including DigiKey and Farnell.
Looking ahead, ROHM plans to further broaden its package options. Mass production of a smaller DFN3333 (3.3 mm × 3.3 mm) package featuring wettable flank technology is scheduled to begin around February 2026. The company also said it has started development of a TOLG (TO-Leaded with Gull-wing) package (9.9 mm × 11.7 mm) aimed at extending its lineup of higher-power, high-reliability package solutions.
Original – ROHM
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ROHM reported solid improvement in financial performance for the nine months ended December 31, 2025, reflecting higher sales, structural cost reforms, and strengthening demand in automotive, industrial, and data-center-related markets.
Key Financial Highlights (9M FY2025):
- Net sales: ¥369.5 billion, up 7.2% year-on-year
- Operating profit: ¥9.7 billion (vs. operating loss of ¥11.1 billion a year earlier)
- Ordinary profit: ¥15.1 billion
- Profit attributable to owners: ¥14.8 billion
- EBITDA: ¥51.3 billion, up 1.6% YoY
- Equity ratio: 63.8%, up from 61.7% at FY2024 year-end
Business Drivers:
- Automotive: Continued growth, particularly in xEV-related and power semiconductor products
- Industrial & Consumer: Recovery supported by inventory normalization and strong demand in amusement, factory automation, and server markets
- Data centers & AI: Rising investment driving demand for power devices
- SiC power devices: Sales momentum improving, though temporary quality-assurance costs weighed on near-term profitability
Cash Flow & Financial Position:
- Operating cash flow: ¥71.3 billion
- Net cash at period end: ¥300.9 billion
- Reduced capital intensity and disciplined cost controls supported balance-sheet strength
Accounting Change Impact:
- Transition to straight-line depreciation reduced depreciation expense and boosted operating and ordinary profit for the period
Revised Full-Year FY2026 Outlook (ending March 31, 2026):
- Net sales: ¥480.0 billion (+7.0% YoY)
- Operating profit: ¥6.0 billion
- Ordinary profit: ¥11.0 billion
- Profit attributable to owners: ¥10.0 billion
- Improvement expected as temporary SiC quality-related costs subside
Strategic Focus:
ROHM continues executing its “MOVING FORWARD to 2028” mid-term plan, emphasizing:- Structural reforms and manufacturing optimization
- Portfolio reshaping toward automotive, power, and SiC technologies
- Profitability improvement and resilience against market volatility
Overall, ROHM’s results signal a clear earnings recovery trajectory, with automotive electrification, AI-driven infrastructure, and disciplined cost management positioning the company for improved profitability in FY2026 and beyond.
Original – ROHM
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ROHM Co., Ltd. and Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, announced a strategic partnership to manufacture semiconductors in India for both domestic and global markets. The collaboration leverages each company’s strengths to expand business opportunities and deepen ties between the Japanese and Indian semiconductor ecosystems.
As an initial focus, the partners will establish a manufacturing framework for power semiconductors in India by combining ROHM’s device technologies with Tata Electronics’ advanced backend capabilities. By integrating sales channels and networks, the partnership aims to unlock new opportunities in the Indian market and deliver higher-value solutions to a broad customer base.
As the first step, Tata Electronics will assemble and test ROHM’s India-designed automotive-grade Nch 100 V, 300 A Si MOSFET in a TOLL package, with mass production shipments targeted for next year. The companies will also explore co-development of high-value packaging technologies and will jointly market products manufactured through the collaboration.
The partnership embodies the Government of India’s “Make in India” vision and the philosophy of “Designed in India, Manufactured in India.” By building an end-to-end ecosystem that includes design, development and manufacturing within India, the ROHM–Tata partnership enhances Domestic Value Addition and supports a stable supply of products optimized for local market needs, with global reach.
“Tata Electronics is deeply committed to pioneering a thriving semiconductor industry in India. We are excited to partner with ROHM, a global leader in semiconductor solutions. With a strong legacy of quality and reliability across products for a broad range of markets, ROHM brings deep domain expertise to this partnership. Through our semiconductor assembly and test facilities, Tata Electronics will deliver advanced chip packaging services to support ROHM in creating products tailored for Indian and global markets. This partnership will go a long way in bringing in trust and resilience in the global semiconductor supply chain while also expanding our respective business opportunities,” said Dr. Randhir Thakur, CEO & MD, Tata Electronics.
“We are delighted to collaborate with Tata Electronics, a leading Indian corporate group with advanced packaging capabilities. Through this partnership, we aim to expand our lineup of packaged products manufactured in India and help build a sustainable, region-based supply chain network. We are confident that this collaboration will enable us to meet the growing demand from Indian customers seeking domestically produced semiconductors. We also envision supplying jointly manufactured products to the global market,” said Dr. Kazuhide Ino, Member of the Board, Managing Executive Officer, ROHM Co., Ltd.
Original – ROHM
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Rutronik Elektronische Bauelemente GmbH and ROHM Semiconductor are marking 30 years of partnership, highlighting a long-standing alliance that has helped shape Europe’s electronics distribution landscape.
Founded in 1973 and owner-managed in Ispringen, Germany, Rutronik has grown into one of Europe’s leading component distributors with a strong presence across Europe and Asia. The company provides an extensive sales footprint for ROHM and holds platinum partner status. ROHM ranks as the second-largest supplier within Rutronik’s power devices business.
Over three decades, the companies have built a relationship grounded in trust and common objectives. Rutronik’s comprehensive promotion of ROHM’s portfolio—including LSI products, wide bandgap technologies, and advanced power solutions—has supported ROHM’s expansion in key markets such as automotive and industrial.
“ROHM is a strategic partner for us,” said Thomas Rudel, CEO at Rutronik. “Our collaboration has been instrumental in delivering cutting-edge solutions to our customers. We see tremendous potential in expanding our joint business, especially in high-growth areas such as WBG and power electronics.”
ROHM signaled its intent to further deepen the relationship, citing Rutronik’s technical expertise, market reach, and proactive sales approach. “Rutronik’s dedication to our products and their deep understanding of the market have made them an invaluable partner,” said Toshimitsu Suzuki, Group General Manager, International Sales at ROHM. “We look forward to continuing our journey together and exploring new opportunities for growth.”
“In the European electronics distribution landscape, Rutronik’s significance is unparalleled,” added Wolfram Harnack, President of ROHM Semiconductor Europe. “We are excited to continue our journey together—exploring new opportunities for growth and innovation in this dynamic region.”
As they celebrate this milestone, Rutronik and ROHM reaffirm their commitment to innovation, customer success, and mutual growth—setting the stage for continued expansion and collaboration.
Original – ROHM
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ROHM has commenced mass production of its SCT40xxDLL series silicon carbide (SiC) MOSFETs in TO-Leadless (TOLL) packages, offering a significant 39% improvement in thermal performance compared to conventional TO-263-7L packages with equivalent voltage ratings and on-resistance. The new series is designed to meet the growing demand for compact, high-power components in applications such as AI server power supplies and energy storage systems (ESS), where power density and miniaturization are increasingly critical.
As modern industrial and consumer equipment evolves, applications such as compact photovoltaic (PV) inverters and high-efficiency server systems face dual requirements: increasing power capability and reduced system size. This is especially true for power factor correction (PFC) circuits in slim-profile “pizza box” server power supplies, where discrete semiconductors must conform to strict thickness constraints of 4 mm or less.
ROHM’s SCT40xxDLL series responds to these requirements with a compact 2.3 mm low-profile form factor—approximately 50% thinner than traditional equivalents—and a reduced component footprint by about 26%. The series also distinguishes itself with a rated drain-source voltage of up to 750 V, surpassing the standard 650 V found in many TOLL package MOSFETs. This higher voltage rating contributes to increased surge voltage tolerance, lower gate resistance requirements, and reduced switching losses.
The SCT40xxDLL lineup includes six models with typical on-resistance values ranging from 13 mΩ to 65 mΩ. Maximum current ratings span up to 120 A, depending on the device, making them suitable for a wide range of high-performance power conversion systems. Mass production began in September 2025.
SCT40xxDLL Series Overview:
Part Number VDSS Max (V) RDS(on) Typ (mΩ) ID Max (A) PD Max (W) Storage Temp (°C) SCT4013DLL 750 13 120 405 -40 to +175 SCT4020DLL 750 20 80 277 -40 to +175 SCT4026DLL 750 26 61 214 -40 to +175 SCT4036DLL 750 36 46 164 -40 to +175 SCT4045DLL 750 45 37 133 -40 to +175 SCT4065DLL 750 65 26 100 -40 to +175 These devices are suitable for use in:
- Industrial power supplies for AI servers and data centers
- Photovoltaic inverters and ESS
- General-purpose consumer power supply applications
ROHM also provides simulation models for all six variants via its official website to assist engineers with rapid circuit evaluation and design. The SCT40xxDLL series is available through authorized distributors.
Original – ROHM
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ROHM has introduced the RS7P200BM, a 100V N-channel power MOSFET in a compact DFN5060-8S (5.0mm × 6.0mm) package. Designed for hot-swap applications and battery protection in 48V systems, the device is suitable for AI server power circuits and industrial equipment requiring efficient power management.
Key Specifications:
- Drain-Source Voltage (VDS): 100 V
- On-Resistance (RDS(on)): 4.0 mΩ (VGS = 10 V, ID = 50 A, Ta = 25°C)
- Safe Operating Area (SOA):
- 7.5 A @ 10 ms pulse width (VDS = 48 V)
- 25 A @ 1 ms pulse width (VDS = 48 V)
- Package: DFN5060-8S (5.0mm × 6.0mm)
The RS7P200BM is engineered to handle inrush currents and transient overload conditions in 48V hot-swap environments. Its wide SOA and low RDS(on) provide thermal and electrical efficiency for compact, high-density server designs.
Applications:
- 48V hot-swap circuits in AI servers and data centers
- Battery-powered industrial systems such as AGVs and forklifts
- UPS and backup power systems
- Robotics, fan motors, and power tools in 48V industrial domains
This release supports the industry’s trend toward 48V systems, aiming to improve power density, energy efficiency, and thermal performance in power electronics.
Original – ROHM
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ROHM Co., Ltd. has announced that its EcoGaN™ power stage IC has been adopted in the AC adapter developed by Delta Electronics for MSI’s high-performance products, including gaming laptops. The collaboration brings together ROHM’s advanced GaN technology and Delta’s expertise in power supply design to deliver compact, energy-efficient power adapters tailored for demanding computing environments.
The AC adapter features ROHM’s BM3G005MUV-LB, a high-speed switching power stage IC with low ON resistance. Integrated into Delta’s latest adapter design, this solution achieves significant size reduction and energy savings compared to traditional silicon-based adapters, while maintaining high power output and performance stability under heavy loads—an essential requirement for gaming laptops equipped with powerful GPUs and CPUs.
As power demands rise in gaming and edge computing devices, GaN technology is gaining prominence due to its ability to improve efficiency and reduce system size. ROHM’s EcoGaN™ power stage IC integrates a 650V GaN HEMT, gate driver, protection circuitry, and peripheral components into a single compact package. This simplifies the design process and enables maximum GaN HEMT performance by directly replacing conventional silicon MOSFETs.
“The combination of Delta’s state-of-the-art power supply solutions and ROHM’s EcoGaN™ power stage IC has enabled high power delivery, optimal energy efficiency, and miniaturization in this AC adapter for gaming laptops,” said Red Lin, General Manager of the Edge Computing Power Business Unit at Delta Electronics, Inc. “We are proud that this solution has been adopted in MSI’s products, a globally recognized brand.”
Satoru Nate, Division Manager of the Power GaN Solution & Product Development Division at ROHM Co., Ltd., added, “Delta Electronics and ROHM have long collaborated in the field of power systems. This successful adoption reflects the strength of combining Delta’s design capabilities with ROHM’s device innovation. We aim to continue contributing to the miniaturization and efficiency of power systems across gaming, servers, industrial, and automotive applications.”
The integration of ROHM’s EcoGaN™ technology into consumer-grade power solutions marks a significant step in advancing the adoption of GaN devices in compact, high-efficiency applications.
Original – ROHM
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ROHM Semiconductor is celebrating three decades of collaboration with Micronetics, marking a significant milestone in one of its longest-standing and most successful distribution partnerships in Europe. This 30-year relationship highlights a shared commitment to innovation, reliability, and customer satisfaction — values that have driven mutual growth and enduring success.
Founded in 1979, Micronetics is a leading German distributor of electronic components, serving customers across Europe with a portfolio of more than 40,000 active, passive, and electromechanical components. With over 18,000 items available from stock, the company ensures exceptional product availability, backed by a modern logistics center and ISO 9001:2015-certified quality management system.
Micronetics has been a key distributor of ROHM products for decades, maintaining one of the largest inventories of ROHM components in the region. This strong stocking strategy has played a vital role in ensuring high product availability and short lead times for customers, strengthening ROHM’s position in the German market.
“Our prosperous partnership with ROHM has always been built on shared values: quality, innovation, reliability, and above all, mutual trust,” said Angela Kleiter, CEO of Micronetics.
“Micronetics has been a cornerstone of our distribution network in Germany,” added Wolfram Harnack, President of ROHM Semiconductor Europe. “Their technical expertise, customer dedication, and proactive stocking strategy have made them an invaluable partner. We are proud to celebrate this 30-year journey together and look forward to many more years of shared success.”
Over the years, ROHM has consistently ranked among the top semiconductor suppliers at Micronetics by sales, reflecting the strength of the partnership and the continued demand for ROHM’s high-quality components.
As both companies celebrate this important anniversary, ROHM and Micronetics reaffirm their joint commitment to delivering superior semiconductor technologies, reliable supply, and excellent customer service to support innovation across Europe’s electronics industry.
Original – ROHM
