Efficient Power Conversion Tag Archive

  • EPC to Showcase Gen7 GaN Technology for AI Power and Intelligent Motion at PCIM Asia 2026

    EPC to Showcase Gen7 GaN Technology for AI Power and Intelligent Motion at PCIM Asia 2026

    2 Min Read

    Efficient Power Conversion (EPC) will showcase its latest Gen7 gallium nitride (GaN) power technology at PCIM Asia 2026 in Shenzhen, highlighting new devices and reference designs for AI data centers, humanoid robots, drones, motor drives, and high-density DC-DC power conversion. The company will also present live technical sessions covering emerging GaN applications and future power architectures.

    EPC’s seventh-generation eGaN® FETs are designed to deliver:

    • Ultra-low on-resistance (RDS(on))
    • Reduced switching losses
    • High-frequency operation
    • Improved thermal performance
    • Higher power density
    • Simplified system integration

    The new devices target applications requiring compact, high-performance power conversion, particularly AI infrastructure and intelligent motion systems.

    A key focus of EPC’s exhibition will be integrated GaN motor-drive ICs for robotics and electric propulsion.

    Featured products include:

    • EPC33110 three-phase integrated ePower Stage IC for humanoid robot joints and drone propulsion
    • EPC23108/09 integrated ePower Stage ICs supporting up to 100 V and 35 A
    • EPC23110/11 integrated ePower Stage ICs supporting up to 100 V and 20 A

    The devices are now in mass production and are designed to accelerate deployment of intelligent motion control systems.

    EPC will also present several new Gen7 discrete GaN transistors, including:

    DeviceVoltageRDS(on)
    EPC236640 V0.84 mΩ
    EPC237918 V0.28 mΩ
    EPC237018 V0.28 mΩ
    EPC237825 V0.41 mΩ
    EPC237740 V0.50 mΩ
    EPC2375100 V0.90 mΩ
    EPC2376150 V1.50 mΩ

    The devices target:

    • AI power supplies
    • High-density DC-DC converters
    • Robotics
    • Advanced motor drives
    • High-current synchronous rectification

    EPC will demonstrate GaN-based power conversion across the AI server power chain, including:

    • EPC91123 – 6 kW isolated 800 V-to-12.5 V ISOP LLC converter
    • EPC91134 – 11 kW isolated 400/800 V-to-50 V converter
    • A new 800 V-to-6 V, 6 kW ISOP converter making its debut at the exhibition

    The company will also showcase point-of-load (PoL) power architectures that efficiently convert 48 V and 12 V intermediate bus voltages to sub-1 V processor supply rails required by next-generation AI accelerators.

    Visitors will see GaN-based reference designs powering:

    • Humanoid robotic arms
    • Drone propulsion systems
    • Three-phase motor drives
    • High-current inverter platforms

    Featured reference designs include:

    • EPC91122
    • EPC91132
    • EPC91121
    • EPC91135
    • EPC9186HCx
    • EPC91128/29/30/31

    These demonstrations highlight the advantages of GaN in applications requiring fast transient response, lightweight designs, and high power density.

    During PCIM Asia 2026, EPC experts will present a series of technical sessions covering:

    • The future evolution of GaN technology
    • Scalable motor-control architectures for humanoid robots and drones
    • New GaN products for high-density DC-DC converters
    • Emerging AI power delivery architectures

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  • EPC to Showcase GaN Power Solutions for AI Infrastructure at Tech Taipei Power 2026

    EPC to Showcase GaN Power Solutions for AI Infrastructure at Tech Taipei Power 2026

    2 Min Read

    Efficient Power Conversion (EPC) will participate in Tech Taipei Power 2026, where the company will present its latest gallium nitride (GaN) power technologies for applications including AI data centers, industrial systems, automotive, robotics, and renewable energy. The event will bring together industry experts to discuss advances in power conversion technologies and next-generation power architectures.

    A keynote presentation by Alex Lidow, CEO of EPC, will examine emerging trends in AI data center power systems and the technologies required to support rapidly increasing computing workloads.

    The presentation will explore how eGaN® FETs and integrated GaN power solutions improve efficiency and performance across the power conversion chain, from high-voltage AC-DC conversion to point-of-load power delivery.

    At the conference, EPC will demonstrate how GaN technology delivers advantages over conventional silicon-based power devices, including:

    • Higher power conversion efficiency
    • Increased power density
    • Faster switching speeds
    • Smaller power system designs
    • Reduced energy losses

    These benefits are becoming increasingly important as AI infrastructure demands higher power levels while maintaining energy efficiency.

    EPC will highlight GaN solutions for a range of applications, including:

    • AI data centers
    • Industrial power supplies
    • Robotics
    • Electric mobility
    • Renewable energy systems
    • High-performance power conversion

    The company will also showcase its latest reference designs and discuss application-specific power system requirements with engineers and system designers attending the event.

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  • EPC Unveils Compact GaN-Based BLDC Motor Drive Reference Design for Humanoid Robots and Drones

    EPC Unveils Compact GaN-Based BLDC Motor Drive Reference Design for Humanoid Robots and Drones

    3 Min Read

    Efficient Power Conversion (EPC) has introduced the EPC91132, a compact three-phase brushless DC (BLDC) motor drive inverter reference design built around the company’s EPC33110 gallium nitride (GaN) three-phase power module. The new platform is designed to support next-generation motion control applications, including humanoid robot joints, robotic hands and wrists, and drone propulsion systems.

    The EPC91132 features an ultra-compact design with a diameter of just 23 mm, making it suitable for space-constrained motor drive applications. At the core of the reference design is the EPC33110 GaN module, which leverages EPC’s monolithic GaN integrated circuit technology. The module integrates three half-bridges, gate drivers, bootstrap circuitry, and level shifters within a compact 6 mm × 6.5 mm QFN package.

    Powered from a single 5 V supply, the EPC33110 supports operating voltages up to 80 V and offers a typical on-resistance of 11.7 mΩ. The module is compatible with both 3.3 V and 5 V logic inputs, providing flexibility for a variety of control architectures.

    As robotic and drone systems continue to demand smaller, lighter, and more efficient power electronics, GaN technology is increasingly being adopted for motor drive applications. The ability to operate at switching frequencies above 100 kHz while minimizing both conduction and switching losses enables improved efficiency, faster dynamic response, higher control bandwidth, and reduced passive component size.

    The EPC91132 supports a wide input voltage range from 10 V to 60 V DC and integrates all key functions required for a complete inverter system. These include an onboard microcontroller, regulated power supplies, DC bus voltage sensing, current sensing with integrated overcurrent protection, and a magnetic encoder for rotor position and speed control.

    The monolithic architecture of the EPC33110 eliminates the need for discrete gate drivers, significantly reducing component count while simplifying PCB design and accelerating development. The platform can be programmed through a dedicated connector and supports real-time monitoring via an RS-485 communication interface.

    To accommodate different application requirements, EPC designed the board with a flexible breakout-ring structure. When the outer ring is removed, the board maintains its 23 mm diameter, allowing direct integration into compact motor systems such as the Vertiq 23-06 drone motor platform.

    Performance testing demonstrated that the EPC33110 module can deliver continuous phase currents of up to 11 ARMS in humanoid robotic joint applications operating at 48 V and switching frequencies up to 100 kHz. In drone motor evaluations, the system exhibited strong thermal performance, with only minimal temperature rise observed under airflow generated by the propeller.

    According to EPC, the EPC91132 demonstrates how monolithic GaN integration can simplify inverter design while providing the switching speed, power density, efficiency, and thermal performance required by next-generation robotic and aerial mobility systems.

    The new reference design is intended to provide engineers with a compact and highly integrated development platform for evaluating GaN-based motor drive architectures in advanced motion-control applications.

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  • EPC Launches GaN-Based Three-Phase BLDC Motor Drive Evaluation Platforms for Next-Generation Motion Control Applications

    EPC Launches GaN-Based Three-Phase BLDC Motor Drive Evaluation Platforms for Next-Generation Motion Control Applications

    3 Min Read

    Efficient Power Conversion (EPC) has introduced four new evaluation boards—EPC91128, EPC91129, EPC91130, and EPC91131—designed to accelerate the development of next-generation three-phase brushless DC (BLDC) motor drive systems using gallium nitride (GaN) technology.

    The compact, high-performance inverter platforms are built around EPC’s integrated EPC23108, EPC23109, EPC23110, and EPC23111 ePower™ Stage ICs. The boards support input voltages ranging from 10 V to 80 V and output currents up to 29 ARMS, providing developers with a flexible platform for rapid evaluation in applications such as robotics, industrial automation, e-mobility auxiliary systems, and battery-powered equipment.

    The evaluation boards integrate key inverter functions including gate drivers, current sensing, voltage sensing, housekeeping power supplies, temperature monitoring, and protection features. This high level of integration enables engineers to quickly prototype high-efficiency motor drive systems while minimizing the need for additional external circuitry. The platforms are optimized to reduce torque ripple and acoustic noise while providing flexible dv/dt control for application-specific tuning.

    All four evaluation boards support complementary PWM and single-PWM control schemes, depending on the selected variant. They are also compatible with controller platforms from Microchip, Texas Instruments, STMicroelectronics, and Renesas, allowing developers to integrate them easily into existing motor-control development environments.

    A key feature of the EPC91128–EPC91131 platforms is their demonstrated performance in practical motor-drive testing. During validation using a 48 V DC bus and switching frequencies of up to 100 kHz, the EPC91128 and EPC91129 boards successfully drove a 3 kW BLDC motor while delivering 15 ARMS continuous phase current without a heatsink. With a heatsink and natural-convection cooling, continuous current capability increased to 20 ARMS. Under pulsed operating conditions, the boards supported peak currents of up to 29 ARMS, demonstrating the ability of the integrated ePower™ Stage IC architecture to manage demanding dynamic motor loads.

    The EPC91130 and EPC91131 variants achieved 10 ARMS continuous operation without a heatsink and 15 ARMS with heatsink assistance. Under pulsed conditions, these boards supported peak currents of up to 18 ARMS. According to EPC, the test results demonstrate that the compact GaN-based inverter platforms can sustain meaningful power levels suitable for industrial-grade motor control evaluation while maintaining thermal performance and switching efficiency at elevated switching frequencies.

    Alex Lidow, CEO of EPC, stated that the new inverter platforms are intended to make GaN technology more accessible for high-performance motor-drive applications. He noted that as designers increasingly pursue higher efficiency, faster switching frequencies, and more compact power electronics systems, the new evaluation boards can help accelerate the transition from silicon-based solutions to GaN across robotics, industrial automation, and battery-powered motion systems.

    Marco Palma, Vice President of Motor Drive Marketing and System Engineering at EPC, highlighted that the new platforms provide engineers with ready-to-use environments for evaluating the latest ePower™ Stage ICs under real motor-drive operating conditions. He added that the integrated sensing, protection, and control features allow developers to focus on system optimization rather than spending time designing the underlying power stage.

    To support product development, EPC provides complete design resources for the new evaluation boards, including schematics, bill of materials (BOM), and Gerber files.

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  • EPC Details 6 kW GaN-Based 800 VDC-to-12.5 VDC Converter for AI Data Center Power Architectures

    EPC Details 6 kW GaN-Based 800 VDC-to-12.5 VDC Converter for AI Data Center Power Architectures

    3 Min Read

    Efficient Power Conversion (EPC) has released additional information on its EPC91123 evaluation board, a 6 kW isolated converter designed to convert 800 VDC to 12.5 VDC for next-generation AI data center power architectures.

    As a contributor to the NVIDIA MGX™ AI Factory ecosystem, EPC is advancing gallium nitride (GaN)-based power conversion technologies intended to support emerging 800 VDC server architectures. The company’s solutions are designed to enable higher power density, improved efficiency, and scalable rack-level power delivery for future AI infrastructure.

    The EPC91123 enables direct conversion to 12.5 V, eliminating the need for a traditional 48 V intermediate bus stage. According to EPC, this approach improves overall system efficiency by approximately 1–2%.

    The converter is based on an input-series, output-parallel (ISOP) LLC topology and incorporates EPC’s Gen7 eGaN® devices, including the EPC2366, a 40 V device with 0.8 mΩ on-resistance in a compact 3.3 mm × 2.6 mm package, and the EPC2305, a 150 V device with 2.2 mΩ on-resistance.

    The EPC91123 achieves a peak efficiency of 98.2% and a full-load efficiency of 97%. Designed for space-constrained AI server environments, the evaluation board delivers high power density within a compact 104 mm × 47 mm × 8 mm form factor.

    “AI data centers consume tremendous amounts of power, making it critical to reduce power conversion stages to improve efficiency and power density, especially in 800 V architectures,” said Alejandro Pozo, Director of DC-DC System Engineering. “The ISOP topology is particularly well suited for high step-down-ratio power conversion, enabling improved transformer optimization and interleaved operation. It has been selected for our next 800VDC to 6VDC platform.”

    The EPC91123 forms part of EPC’s broader strategy for 800 VDC AI power delivery systems. The company is developing conversion platforms spanning 800 VDC to 48 VDC, 12 VDC, and 6 VDC to address a range of system-level requirements in AI infrastructure.

    By utilizing advanced GaN-based ISOP topologies and its latest Gen7 eGaN technology, EPC aims to provide scalable, high-density power conversion solutions that improve efficiency, reduce power distribution losses, and support next-generation accelerated computing platforms.

    “NVIDIA MGX provides a modular foundation for scalable accelerated computing. A key element of NVIDIA’s strategy for AI infrastructure is the use of 800 VDC power architecture, helping address the growing demands for efficiency and power density as AI compute scales. We are pleased to contribute to the NVIDIA MGX AI Factory ecosystem with advanced multi-level GaN-based power conversion solutions designed to support emerging 800 VDC server architectures and next-generation AI infrastructure,” said Alex Lidow, CEO and Co-founder of EPC.

    Additional information on the EPC91123 evaluation board, EPC’s Gen7 GaN technology, and the company’s portfolio of 800 VDC power conversion solutions for AI infrastructure is available from EPC.

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  • EPC Expands Global Reach Through Distribution Partnership with Mouser Electronics

    EPC Expands Global Reach Through Distribution Partnership with Mouser Electronics

    1 Min Read

    Efficient Power Conversion has announced a global distribution agreement with Mouser Electronics, expanding worldwide access to EPC’s full portfolio of enhancement-mode GaN (eGaN®) FETs and integrated circuits.

    The agreement enables Mouser customers to access EPC’s complete GaN product lineup spanning 15 V to 350 V devices, supporting applications including power converters, motor drives, e-mobility systems, robotics, and drones. EPC stated that its latest generation of GaN products delivers improved performance compared to conventional silicon MOSFETs, earlier GaN generations, and competing solutions.

    Strategically, the partnership is designed to broaden EPC’s engagement with engineers and accelerate GaN adoption by improving product accessibility and shortening design cycles. Through Mouser’s global distribution infrastructure, engineers can more easily evaluate and integrate EPC’s latest power technologies into new designs.

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  • EPC Highlights Gen 7 GaN Platform for Humanoid Robotics, Drones, and AI Power at PCIM Europe 2026

    EPC Highlights Gen 7 GaN Platform for Humanoid Robotics, Drones, and AI Power at PCIM Europe 2026

    2 Min Read

    Efficient Power Conversion will showcase its latest Gen 7 gallium nitride (GaN) power technologies at PCIM Europe 2026, focusing on humanoid robotics, drone propulsion, compact motion systems, and AI power delivery applications.

    The company’s demonstrations center on how high-frequency GaN devices enable smaller, lighter, and more efficient motion-control and power-conversion architectures. EPC’s latest integrated ePower Stage ICs, including the EPC33110 and EPC2310x families, target compact three-phase motor drives for humanoid joints, robotic arms, and drone propulsion systems. These devices support operation up to 100 V with current capability up to 35 A, delivering high switching frequency and improved power density for intelligent motion systems.

    EPC will also highlight multiple low-voltage GaN FETs optimized for AI infrastructure and high-density DC-DC conversion, including:

    • EPC2366 (40 V, 0.84 mΩ) for synchronous rectification,
    • EPC2361 (100 V, 0.75 mΩ),
    • EPC2304 and EPC2305 for isolated DC-DC conversion,
    • New Gen 7 devices such as EPC2370, EPC2377, EPC2378, and EPC2375 in compact dual-cooled QFN packages.

    The company will demonstrate these components across several reference platforms, including:

    • Three-phase inverter boards for robotic and drone propulsion,
    • High-density isolated converters for AI servers,
    • Totem-pole PFC stages,
    • Intermediate bus converters and synchronous buck architectures.

    A major strategic theme is EPC’s positioning of low-voltage GaN as a core enabling technology for both intelligent motion systems and AI computing infrastructure. The company emphasizes that higher switching frequencies allow reductions in passive component size, system weight, and thermal complexity while improving transient response and overall efficiency.

    Beyond robotics and drones, EPC will showcase how the same GaN platform supports compact electrified systems such as e-bikes and power tools, while also scaling into multi-kilowatt AI server power architectures.

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  • EPC Launches High-Power GaN Motor Drive Evaluation Boards for 5 kW Applications

    EPC Launches High-Power GaN Motor Drive Evaluation Boards for 5 kW Applications

    2 Min Read

    Efficient Power Conversion has introduced the EPC9186HC2 and EPC9186HC3 evaluation boards, expanding its portfolio of GaN-based motor drive platforms for high-power applications up to 5 kW.

    The new boards are designed as three-phase BLDC inverter platforms and target a wide range of applications including robotics, industrial automation, light electric vehicles, agricultural machinery, and high-power drones. Both platforms are built on EPC’s 100 V EPC2361 eGaN FET technology, delivering improved conduction performance and enabling higher current operation compared to previous designs.

    The EPC9186HC2 integrates two GaN devices in parallel per switch position, while the EPC9186HC3 uses three in parallel, further reducing effective on-resistance and improving efficiency at higher load conditions. The systems support phase currents up to 150 ARMS and switching frequencies up to 120 kHz, enabling high power density and fast dynamic response.

    From a performance standpoint, the use of GaN enables lower gate charge and output capacitance compared to silicon MOSFETs, resulting in faster switching, reduced losses, and smaller passive components. The boards also maintain controlled switching behavior (dv/dt ~6 V/ns), helping reduce torque ripple and acoustic noise—key requirements in precision motor control.

    The platforms integrate essential system functions including gate drivers, current sensing, voltage monitoring, and protection features, and support both sensorless and encoder-based control. Compatibility with controller ecosystems from major suppliers such as Microchip, Texas Instruments, and STMicroelectronics allows for rapid system integration.

    From a market perspective, these evaluation platforms highlight the continued expansion of GaN into motion control and electrification applications beyond power supplies. As demand grows for compact, efficient motor drives in robotics and e-mobility, GaN is increasingly positioned as a key enabler of higher switching frequencies, improved efficiency, and reduced system size.

    This launch reinforces EPC’s strategy of accelerating GaN adoption by providing system-level tools that reduce development time and enable engineers to validate next-generation inverter architectures in real-world applications.

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  • EPC Introduces 100V Integrated GaN Power-Stage ICs for Robotics and Motion Systems

    EPC Introduces 100V Integrated GaN Power-Stage ICs for Robotics and Motion Systems

    2 Min Read

    Efficient Power Conversion has launched a new generation of 100 V integrated GaN power-stage ICs—EPC23108, EPC23109, EPC23110, and EPC23111—targeting high-performance, compact power systems such as humanoid robots, drones, and battery-powered platforms.

    The new devices integrate high-side and low-side eGaN FETs יחד with gate drivers and level-shifting circuitry into a single thermally enhanced QFN package. This high level of integration reduces external component count, simplifies design, and improves system-level reliability while maintaining the efficiency and power density advantages of GaN technology.

    The ICs support operation up to 100 V, with current capabilities of 35 A (EPC23108/23109) and 20 A (EPC23110/23111), enabling high-frequency switching for advanced motion control and power conversion applications. Design flexibility is further enhanced through configurable PWM interfaces—single-input options for simplified multi-axis systems and dual-input configurations for adaptive control schemes.

    From a functionality standpoint, the devices incorporate features aimed at real-world robustness, including deterministic shutdown behavior, active gate pull-down for fault conditions, and compatibility with standard industrial logic without additional signal conditioning. Support for continuous 100% duty-cycle operation makes them well-suited for applications requiring uninterrupted conduction, such as motor drives and precision control systems.

    These integrated GaN power stages are particularly relevant for emerging applications like humanoid robotics, where multiple motors per system demand compact, efficient, and scalable power solutions. By reducing design complexity and improving predictability, EPC enables faster development cycles and more reliable system performance.

    From a market perspective, this launch highlights the rapid expansion of GaN into motion control and robotics—segments traditionally dominated by silicon MOSFETs. As electrification extends into automation, drones, and AI-driven robotics, integrated GaN solutions are increasingly positioned as key enablers of higher efficiency, reduced system size, and improved dynamic performance.

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  • EPC Releases Phase 18 Reliability Report Advancing GaN Lifetime Prediction Models

    EPC Releases Phase 18 Reliability Report Advancing GaN Lifetime Prediction Models

    2 Min Read

    Efficient Power Conversion has published its Phase 18 Reliability Report, introducing advanced methodologies to better predict the real-world lifetime and reliability of eGaN® power devices.

    The report focuses on bridging the gap between laboratory testing and actual operating conditions by analyzing fundamental wear-out mechanisms in GaN HEMTs and linking them to mission-specific stress profiles. It presents a quantitative framework that combines multiple stress factors—such as voltage, current, temperature, and duty cycles—to deliver more accurate lifetime estimations across diverse applications.

    A key advancement in Phase 18 is the deeper analysis of critical reliability aspects, including gate reliability in pGaN structures, overvoltage robustness, current density limits, and thermomechanical wear in both chip-scale and packaged devices. The report also evaluates performance under dynamic switching and high-frequency conditions, reflecting real application environments more closely than traditional static testing.

    In addition, EPC introduces mission-specific reliability testing, with a focus on applications such as motor drives that involve rapid current transients and variable load conditions. These tailored stress simulations demonstrate the robustness of GaN devices under realistic operating scenarios.

    From a market perspective, this report highlights a crucial industry shift: as GaN adoption accelerates, especially in AI power, motor drives, and high-frequency converters, reliability modeling becomes a key differentiator. Improved lifetime prediction reduces design risk and supports broader deployment in mission-critical systems.

    By aligning reliability analysis with real-world use cases, EPC is reinforcing confidence in GaN technology and enabling system designers to optimize performance, efficiency, and durability in next-generation power electronics.

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