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To enable the next generation of solid-state power distribution systems, Infineon Technologies AG is expanding its silicon carbide (SiC) portfolio with the new CoolSiC™ JFET product family. The new devices deliver minimized conduction losses, solid turn-off capability, and high robustness, making them ideal for advanced solid-state protection and distribution.
With robust short-circuit capability, thermal stability in linear mode, and precise overvoltage control, CoolSiC JFETs enable reliable and efficient system performance in a wide range of industrial and automotive applications, including solid-state circuit breakers (SSCBs), AI data center hot-swaps, eFuses, motor soft starters, industrial safety relays, and automotive battery disconnect switches.
“With CoolSiC JFET, we are addressing the growing demand for smarter, faster, and more robust power distribution systems,” says Dr. Peter Wawer, Division President Green Industrial Power at Infineon Technologies. “This application-driven power semiconductor technology is specifically designed to provide our customers with the tools they need to solve the complex challenges in this rapidly evolving space. We are proud to introduce devices that achieve best-in-class R DS(ON), setting a new standard for SiC performance and reaffirming Infineon’s leadership in the field of wide-bandgap technology.”
The first generation of CoolSiC JFETs features ultra-low R DS(ON) starting at 1.5 mΩ (750 V BDss) and 2.3 mΩ (1200 V BDss), significantly reducing conduction losses. The bulk-channel optimized SiC JFET offers high robustness under short-circuit and avalanche failure conditions. Housed in a Q-DPAK top-side cooled package, the devices support easy paralleling and scalable current handling, enabling compact, high-power systems with flexible layout and integration options. Their predictable switching behavior under thermal stress, overload and fault conditions provides maximum long-term reliability in continuous operation.
To meet the thermal and mechanical challenges of harsh application environments, CoolSiC JFETs leverage Infineon’s advanced .XT interconnection technology with diffusion soldering. This significantly improves transient thermal impedance and robustness under pulsed and cyclic loads typical of industrial power systems. Tested and qualified under real-world operating conditions of solid-state power switches and based on the industry-standard Q-DPAK package, the devices enable quick and seamless design integration in both industrial and automotive applications.
Engineering samples of the new CoolSiC JFET family will be available later in 2025, with volume production starting in 2026. The product portfolio will be further expanded with a variety of packages and modules. The product family has been successfully demonstrated at the Infineon booth at PCIM Europe 2025 in Nuremberg. More information is available at www.infineon.com/jfet.
Original – Infineon Technologies
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Wolfspeed, Inc. announced the appointments of Paul Walsh and Mark Jensen to the Company’s Board of Directors (the “Board”). Both Mr. Walsh and Mr. Jensen will serve as members of the Audit Committee.
Tom Werner, Chairman of the Board, commented, “We are pleased to add two highly-qualified directors, Paul and Mark, to our Board. They both bring invaluable industry experience and deep expertise in accounting, finance and restructuring. Their backgrounds position them well to help the Board and Company navigate ongoing discussions with lenders and reach a comprehensive solution to address our balance sheet. We continue to make meaningful progress in these negotiations and we believe guidance from both Paul and Mark will be critical to our efforts in reaching an outcome that will support our long-term success.”
Mr. Walsh most recently served as Chief Financial Officer and Senior Vice President, Finance and Administration of Allegro Microsystems, a global designer, developer, fabless manufacturer and marketer of sensor integrated circuits (ICs) and application-specific analog power ICs, from 2014 to 2022. He previously served as Chief Financial Officer of Rocket Software and held multiple finance roles at Silicon Laboratories, earning successive promotions and ultimately serving as Senior Vice President and Chief Financial Officer. He currently serves on the boards of Kopin Corporation and Semtech Corporation.
Mr. Jensen brings an extensive background in finance and accounting, having most recently served as U.S. Managing Partner, Technology Industry, at Deloitte from 2001 to 2012. Before joining Deloitte, he held senior roles as Chief Financial Officer of Redleaf Group and Managing Partner at Arthur Andersen. Mr. Jensen currently serves on the boards of 23andMe and Lattice Semiconductor.
Wolfspeed also today announced that Stacy Smith will not stand for re-election to the Board and will leave the Board prior to the Company’s 2025 annual meeting of shareholders.
Mr. Smith commented, “I am proud of the role Wolfspeed is playing in driving innovation and energy efficiency through its leadership in silicon carbide technology. I’m grateful for my time serving on the Board of this company that is critically important to U.S. national security. Wolfspeed is in excellent hands with its new CEO, Robert Feurle, and the entire Board under Tom Werner’s tireless and capable leadership.”
Mr. Werner concluded, “On behalf of the Board, I want to thank Stacy for his dedicated service and valued contributions to Wolfspeed during his tenure, particularly during his time as Lead Independent Director. We wish him the best in all of his future endeavors.”
Original – Wolfspeed
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Infineon Technologies AG and Visteon Corporation, a global leader in automotive cockpit electronics, announced the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.
In this joint effort, Infineon and Visteon will collaborate and integrate power conversion devices based on Infineon semiconductors, with particular emphasis on wideband gap device technologies, which provide significant advantages in power conversion applications compared to silicon-based semiconductors. These devices include greater power density, efficiency and thermal performance, which contribute to improved efficiency and reduced system costs for next-generation power conversion modules for the automotive sector.
Future Visteon EV powertrain applications incorporating Infineon CoolGaN™ (Gallium Nitride) and CoolSiC™ (Silicon Carbide) devices may include battery junction boxes, DC-DC converters and on-board chargers. The resulting powertrain systems will conform to the highest efficiency, robustness and reliability.
“Working with Infineon allows us to integrate cutting-edge semiconductor technologies that are essential in improving power conversion efficiency and overall system capability of next generation electric vehicles,” said Dr. Tao Wang, Head of the Electrification Product Line of Visteon Corporation. “This collaboration will advance technologies that accelerate the transition to a more sustainable and efficient mobility ecosystem.”
“Visteon is a recognized innovator and an early adopter of new technologies, making them an ideal partner for us,” said Peter Schaefer, Chief Sales Officer Automotive, Infineon Technologies AG. “Together, we will push the boundaries of electric vehicle technology and provide superior solutions to the global automotive industry.”
Original – Infineon Technologies
