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  • Revasum Announced a Strategic Partnership with SGSS to Innovate SiC Wafer Grinding Technology 

    Revasum Announced a Strategic Partnership with SGSS to Innovate SiC Wafer Grinding Technology 

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    Revasum, Inc. announced a strategic partnership with SGSS, a global leader in high-performance materials and innovative solutions. This partnership aims to revolutionize the semiconductor industry by developing a cutting-edge line of grinding wheels specifically designed for Silicon Carbide (SiC) wafers.

    Silicon Carbide is a critical material in the production of power devices and has gained significant prominence in the semiconductor industry due to its exceptional properties. The demand for SiC wafers has been steadily growing, and achieving the highest quality wafers is paramount to meet the evolving needs of the market.

    The partnership between Revasum and SGSS represents a collaboration between two industry giants with a shared commitment to innovation and excellence. By combining Revasum’s expertise in semiconductor manufacturing equipment with SGSS’s cutting-edge abrasive materials, this alliance seeks to develop a new generation of surface finishing solutions that will set new standards for precision, efficiency, and surface quality in SiC wafer production with sustainability and environmental responsibility at the core of our collaboration.

    This partnership holds great promise for the semiconductor industry, paving the way for enhanced SiC wafer production processes that will contribute to the advancement of power electronics, electric vehicles, renewable energy, and various other technology sectors.

    Mr. Scott Jewler, CEO of Revasum, Inc., commented on the partnership, saying, “We are excited to join forces with Saint-Gobain Surface Solutions, a renowned leader in materials science and innovation. This partnership will enable us to provide our customers with cutting-edge tools and solutions to address the increasing demand for high-quality Silicon Carbide wafers.”

    Mr. Jean-Claude Lasserre, CEO Saint-Gobain Surface Solutions stated, “Our collaboration with Revasum exemplifies our commitment to delivering high-performance materials and solutions that push the boundaries of what is possible. Together, we will unlock new levels of precision and efficiency in Silicon Carbide wafer grinding with highest levels of sustainable products and solutions.”

    Both Revasum, Inc. and SGSS are eager to embark on this journey of innovation and look forward to delivering groundbreaking solutions that will shape the future of Silicon Carbide wafer manufacturing.

    Original – Revasum

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