GlobalFoundries Tag Archive

  • GlobalFoundries To Invest €1.1B in Dresden Expansion, Targeting One Million Wafers Annually by 2028

    GlobalFoundries To Invest €1.1B in Dresden Expansion, Targeting One Million Wafers Annually by 2028

    3 Min Read

    GlobalFoundries announced plans to invest €1.1 billion to expand manufacturing at its Dresden, Germany site, aiming to lift annual output to more than one million wafers by the end of 2028. The company says the expansion—known internally as project SPRINT—will make Dresden the largest facility of its kind in Europe, strengthening regional supply resilience and supporting fast-growing demand across automotive, IoT, defense, and critical infrastructure.

    The program is expected to receive support from the German federal government and the State of Saxony within the framework of the European Chips Act, pending EU approval anticipated later this year. In addition to capacity growth, the site will be upgraded to provide end-to-end European processes and data flows aligned with stringent semiconductor security requirements.

    German leaders welcomed the move during a visit to the Dresden campus. Chancellor Friedrich Merz called SPRINT “a commitment to Germany as an industrial and innovation location— and above all to the sovereignty of our country and Europe.” Saxony’s Minister President Michael Kretschmer said the billion-euro expansion underscores “Silicon Saxony’s” status as Europe’s leading microelectronics cluster and enhances European technological independence.

    GlobalFoundries notes that recent disruptions—particularly in automotive—have highlighted the vulnerability of global chip supply chains. Scaling Dresden is a core element of the company’s broader strategy to diversify and regionalize manufacturing, with parallel investments underway in Europe, the United States, and other regions. According to CEO Tim Breen, the expansion is designed to provide customers in critical industries with secure supply and differentiated technologies as “physical AI” applications accelerate.

    The added capacity will focus on GlobalFoundries’ specialty platforms featuring low-power operation, embedded secure memory, and advanced wireless connectivity. These technologies are central to next-generation vehicles, industrial and IoT systems, and high-reliability infrastructure. The company also expects the site to contribute to ongoing innovation in emerging compute architectures and quantum-related technologies through the next decade.

    European partners and customers emphasized the strategic impact. Leaders from Aumovio SE, Bosch, Infineon, NXP, Siemens, and SpiNNcloud pointed to stronger regional resilience, a deeper capabilities ecosystem in Saxony, and faster commercialization cycles for advanced mobility and AI hardware.

    The announcement follows GlobalFoundries’ recent participation in the “Made for Germany” initiative, which brings together companies committing long-term industrial investment in the country. Since 2009, the company has invested more than €10 billion in its Dresden operations, making it one of Germany’s largest industrial investments and a foundational asset for Europe’s semiconductor ambitions.

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  • Imec Launches 300mm GaN Power Electronics Program with Industry Leaders as Founding Partners

    Imec Launches 300mm GaN Power Electronics Program with Industry Leaders as Founding Partners

    2 Min Read

    Imec, the Belgian research and innovation hub specializing in nanoelectronics and digital technologies, has announced the launch of a new 300mm gallium nitride (GaN) open innovation program for power electronics. AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco have joined as the first partners in this initiative, which aims to accelerate the development of both low- and high-voltage GaN power devices.

    The program, part of imec’s Industrial Affiliation Program (IIAP) on GaN power electronics, focuses on advancing 300mm GaN epitaxial growth and high electron mobility transistor (HEMT) process flows. The use of larger 300mm substrates is expected to lower GaN device manufacturing costs while enabling more advanced, high-performance power electronics such as compact, energy-efficient converters for CPUs and GPUs.

    Imec’s new initiative builds on the success of 200mm GaN technology, extending its expertise to larger wafer diameters to support industrial-scale production. The move to 300mm wafers allows GaN technology to access state-of-the-art CMOS-compatible equipment, paving the way for the next generation of low-voltage p-GaN gate HEMTs for power distribution in computing and data applications.

    The program’s first phase will establish a baseline lateral p-GaN HEMT platform for low-voltage applications (100 V and beyond), using 300mm Si(111) substrates. Development work currently focuses on key process modules such as p-GaN etching and Ohmic contact formation. Later stages will target high-voltage applications above 650 V, utilizing 300mm QST engineered substrates that offer mechanical strength and bow control suitable for advanced CMOS-compatible processing.

    According to Stefaan Decoutere, fellow and program director of GaN power electronics at imec, the transition to 300mm wafers offers advantages beyond cost reduction. It enables the creation of more sophisticated GaN devices, supporting compact and efficient power solutions for applications like automotive on-board chargers, solar inverters, and power systems in telecom and AI data centers.

    Imec expects to complete installation of its full 300mm GaN processing capabilities in its cleanroom by the end of 2025. The program’s success relies on strong collaboration between partners across the value chain, combining expertise in epitaxy, process integration, design, and packaging to drive the next wave of GaN power innovation.

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  • Synopsys and GlobalFoundries Launch Global University Program to Bring Chip Design from Classroom to Tapeout

    Synopsys and GlobalFoundries Launch Global University Program to Bring Chip Design from Classroom to Tapeout

    3 Min Read

    Synopsys, Inc. and GlobalFoundries announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide. Aligned with both GFLabs’ and Synopsys Academic & Research Alliances’ (SARA) missions to advance semiconductor innovation through R&D and academic collaboration, this pilot initiative gives researchers, professors and students hands-on access to real-world chip design and manufacturing. By dramatically lowering the cost barrier to custom silicon, the program enables academic institutions to turn their design concepts into working silicon, expanding opportunities for education, research and workforce development.

    Forty universities worldwide are participating in the sponsored open-source 180MCU pilot launching this fall. Synopsys will provide comprehensive support including professional-grade electronic design automation (EDA) tools, training and design collateral leveraging the Synopsys Cloud design platform. Once designs are finalized, GF will manufacture the chips through its GlobalShuttle Multi-Project Wafer Program, which aggregates designs from multiple institutions onto a single wafer for fabrication.

    “Partnering with GlobalFoundries to bring a full ‘chip design to tapeout’ course to universities is a game changer,” said Dr. Patrick Haspel, executive director of SARA at Synopsys. “This collaboration will empower students with practical, hands-on experience using advanced tools and technologies – skills that are critical to drive innovation in the semiconductor industry. Together, we’re not just teaching design – we’re building the next generation of engineers who will shape the future of silicon.”

    As Synopsys and GF seek to evolve this workforce development initiative further, the next phase of the tapeout is focused on bringing these technologies directly into classrooms and embedding hands-on design and testing into academic course curriculum. With the goal of having students collaborate in a design class, Synopsys will provide training to professors on how to lead this course. Following a shuttle run, the second course will dive into classroom testing with chips returned for the next semester.

    “This program reflects our deep commitment to advancing semiconductor innovation and cultivating the next generation of talent,” said Bika Carter, director of external R&D at GF. “By giving students and researchers the opportunity to bring their designs from concept to silicon, we’re enriching chip design education and helping shape the future of our industry. We’re proud to partner with Synopsys to empower the talented minds driving tomorrow’s breakthroughs.”

    This design enablement collaboration is supported by Synopsys’ SARA program, which provides software, cloud environments, training and curriculum to equip students with latest technology and learning materials. The new Synopsys-GF collaboration exemplifies the SARA program’s commitment to partner on semiconductor workforce development initiatives and nurture talent pipelines worldwide. Along with providing participating universities with essential tools and cloud environment access, the SARA program will also offer comprehensive course content and training.

    The tapeout education pilot is just one aspect of GF’s University Partnership Program, which serves to close the prototyping gap in academia and expand access to new technologies to support technological innovation in the semiconductor industry. In its work with more than 80 universities, 110 professors and 600 students, the program selects projects aligned with GF’s R&D roadmap priorities to support research breakthroughs in areas including radio frequency, radar, quantum computing, silicon photonics, sensors and more.

    The combination of Synopsys and GlobalFoundries brings together industry-leading EDA design tools and advanced manufacturing, empowering academic institutions to offer students an integrated, real-world journey through the semiconductor process.

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  • GF Announced Q2 2025 Results

    GF Announced Q2 2025 Results

    2 Min Read

    GLOBALFOUNDRIES Inc. (GF) announced preliminary financial results for the second quarter ended June 30, 2025.

    Key Second Quarter Financial Highlights

    • Revenue of $1.688 billion
    • Gross margin of 24.2% and Non-IFRS gross margin of 25.2%
    • Operating margin of 11.6% and Non-IFRS operating margin of 15.3%
    • Net income of $228 million and Non-IFRS net income of $234 million
    • Diluted earnings per share of $0.41 and Non-IFRS diluted earnings per share of $0.42
    • Non-IFRS adjusted EBITDA of $585 million
    • Ending cash, cash equivalents and marketable securities of $3.9 billion
    • Net cash provided by operating activities of $431 million and Non-IFRS adjusted free cash flow of $277 million

    “In the second quarter, the GF team delivered strong financial results above the midpoints of the Non-IFRS guidance ranges for revenue and gross margin, and earnings per share exceeded the high end of the guidance range,” said Tim Breen, CEO of GF. “Continued momentum across our Automotive and Communications Infrastructure and Datacenter end markets, enabled double digit percent year-over-year revenue growth in the second quarter for both businesses. As we await a return to meaningful growth across the consumer-driven end markets, I am pleased with the steps GF is taking to broaden the long term value proposition to our customers, through the expected acquisition of MIPS, as well as establishing our China for China foundry partnership.”

    Recent Business Highlights

    • In June, GF was announced as the exclusive manufacturing partner for Continental’s newly established Advanced Electronics & Semiconductor Solutions (AESS) organization to help meet the growing demand for safe, connected autonomous vehicles. GF will serve as a trusted foundry partner to Continental, offering its manufacturing expertise, diversified global footprint, and automotive-qualified portfolio of process technologies.
    • In July, GF announced a definitive agreement to acquire MIPS, a leading supplier of AI and processor IP. This acquisition will broaden GF’s portfolio with advanced RISC-V processor IP and software tools tailored for real-time computing in automotive, industrial, and data center infrastructure applications. The acquisition will offer customers deeper and closer collaboration with GF, as well as enhanced opportunities for chip customization.
    • GF advanced its China-for-China strategy by entering into a definitive agreement with a local Chinese foundry to support GF’s customers with reliable supply in mainland China. Customers will benefit from GF’s automotive grade process technologies and manufacturing expertise, to serve their domestic Chinese demand.

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  • Continental Launches AESS and Partners with GlobalFoundries to Develop In-House Automotive Semiconductors

    Continental Launches AESS and Partners with GlobalFoundries to Develop In-House Automotive Semiconductors

    3 Min Read

    In its journey towards spinning off as the independent company Aumovio, the Continental group sector Automotive has taken a strategic step to increase resilience and ensure future success with the establishment of an Advanced Electronics & Semiconductor Solutions (AESS) organization. This new organization has been established to design and verify automotive semiconductors with a view of fulfilling internal demand. As a strategic move, GlobalFoundries (GF) has been onboarded as the manufacturing partner for this organization.

    The Automotive industry’s demand for semiconductors to enhance electronic content for Software-defined Vehicles is increasing. The global automotive semiconductor market is estimated to reach about 110 billion Euros by 2032, and therefore, it is imperative for organizations to invest in semiconductor development to be successful in the long run.

    “Continental is committed to sustainable growth and the Automotive group sector is on the right path to success. To ensure future success of the group sector, we have decided to develop semiconductors internally. The creation of this fabless semiconductor organization will strengthen Continental’s position not only by reducing geopolitical risks but also by the way of becoming more self-reliant in this field,” said Philipp von Hirschheydt, member of the Continental Executive Board and CEO of the future Aumovio.

    AESS will design and verify semiconductors internally while the production line will be established with GF to exclusively manufacture these semiconductors for the organization. GF is a leading manufacturer of essential semiconductors that the world relies on to live, work and connect. With a global manufacturing footprint across the US, Europe and Asia, GlobalFoundries delivers power-efficient, high-performance solutions for several industries including Automotive, Internet of Things, communications infrastructure, smart mobile and other high-growth markets.

    “GF is proud to support Continental and the launch of their AESS organization as we partner together to deliver advanced semiconductor solutions to meet the growing demand for software-defined vehicles,” said Niels Anderskouv, president and chief operating officer at GF. “Our silicon-proven portfolio of automotive-qualified process technologies, supported by our resilient global footprint and track record of manufacturing excellence, will enable Continental to deliver innovative solutions for the next generation of safe, connected and autonomous vehicles. We are excited to see the Automotive semiconductor supply chain continue to evolve and want to congratulate the Continental team on shaping that evolution with the establishment of this organization.”

    “In the evolving automotive landscape, it is imperative for organizations to invest in technology, particularly in essential areas like semiconductors. The formation of this new entity, in collaboration with a dependable manufacturing partner such as GlobalFoundries, will empower us to develop innovative products and solutions successfully,” said Nino Romano, CTO Continental Automotive.

    The establishment of this organization aligns with the Automotive Board’s long-term strategy to invest in technology and increase self-sufficiency. This initiative seeks to improve Automotive’s market presence and autonomy by building the capability to design and manage semiconductor production in partnership with leading semiconductor manufacturers.   

    The new organization supports the Automotive group sector in various ways. This initiative aims to establish a resilient supply chain, improve product quality, and reduce time to market. The organization has the potential to create value by generating savings and efficiencies. Additionally, it is expected to enhance the company’s cash flow through anticipated savings. 

    As part of the Operations and Technology organization, the AESS organization will help to strengthen Automotive’s position as an automobile component manufacturer. With a strong organizational structure and a streamlined setup, AESS is creating new internal development opportunities and laying the foundation for future growth in a dynamic market environment.

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  • GlobalFoundries Unveils $16 Billion U.S. Expansion to Boost AI-Driven Chip Production and Secure Domestic Supply Chains

    GlobalFoundries Unveils $16 Billion U.S. Expansion to Boost AI-Driven Chip Production and Secure Domestic Supply Chains

    5 Min Read

    GlobalFoundries announced plans to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities across its facilities in New York and Vermont. GF’s investment is a strategic response to the explosive growth in artificial intelligence, which is accelerating demand for next-generation semiconductors designed for power efficiency and high-bandwidth performance across datacenters, communications infrastructure and AI-enabled devices.

    GF is collaborating with major technology companies such as Apple, SpaceX, AMD, Qualcomm Technologies, Inc., NXP and GM, that are committed to reshoring semiconductor production to the U.S. and diversifying their global supply chains. These companies partner with GF to support their production of U.S.-made chips, underscoring GF’s role as a trusted supplier of essential semiconductors and a key enabler of supply chain security. 

    “At GlobalFoundries, we are proud to partner with pioneering technology leaders to manufacture their chips in the United States—advancing innovation while strengthening economic and supply chain resiliency,” said Tim Breen, CEO of GlobalFoundries.  “The AI revolution is driving strong, durable demand for GF’s technologies that enable tomorrow’s datacenters – including GF’s leading silicon photonics, as well as GaN for power applications. Meanwhile at the edge, GF’s proprietary FDX technology is uniquely positioned to support AI functionality with low power consumption. With all these technologies and more manufactured right here in the U.S., GF is proud to play its part in accelerating America’s semiconductor leadership.”

    “GlobalFoundries investment is a great example of the return of United States manufacturing for critical semiconductors,” said U.S. Secretary of Commerce, Howard Lutnick. “President Trump has made it a fundamental objective to bring semiconductor manufacturing home to America. Our partnership with GlobalFoundries will secure U.S. semiconductor foundry capacity and technology capabilities for future generations.”

    The rapid rise of AI in both the cloud and at the edge is driving the adoption of new technology platforms and 3D heterogeneous integration technologies. These advanced solutions are essential to meet the exponentially growing requirements for power efficiency, bandwidth density and performance. GF is uniquely positioned to lead in this space, with its 22FDX® and silicon photonics capabilities in production in New York and advanced development of differentiated GaN-based power solutions in Vermont.

    GF’s investment builds upon the company’s existing U.S. expansion plans, including more than $13 billion to expand and modernize its New York and Vermont facilities and funding for its recently launched New York Advanced Packaging and Photonics Center—the first U.S.-based facility of its kind dedicated to silicon photonics packaging. GF is committing an additional $3 billion, which includes advanced research and development initiatives focused on packaging innovation, silicon photonics and next-generation GaN technologies. In aggregate, these investments represent a $16 billion plan to strengthen U.S. semiconductor leadership and accelerate innovation in AI, aerospace, automotive and high-performance communications.

    “Today’s announcement is a direct result of President Trump’s leadership and his vision to bring back high-paying manufacturing jobs and reestablish secure, domestic supply chains for critical technologies,” said Dr. Thomas Caulfield, Executive Chairman of GlobalFoundries.  “We look forward to continuing to work with the U.S. government to help create the conditions for industry and government to work together and drive meaningful, long-term impact.”

    “GlobalFoundries has supplied semiconductors for Apple products since 2010 and we’re excited to see them expand right here in the United States. These chips are an essential part of Apple products like iPhone, and they’re a powerful example of American manufacturing leadership.”

    Tim Cook, Apple’s CEO

    “Advanced semiconductors are critical to the advanced satellite capabilities which SpaceX has been pioneering for over two decades. We are excited by the expansion of GlobalFoundries’ manufacturing base right here in the U.S., which is core to Starlink’s growth and our commitment to manufacturing in the U.S., as well as our mission to deliver high-speed internet access to millions of people around the world.”

    Gwynne Shotwell, president and COO at SpaceX

    “As a valued technology partner, we’re pleased to see GlobalFoundries deepen its commitment to U.S. manufacturing. These efforts are critical to building a secure and resilient semiconductor supply chain in the U.S. to support the next wave of innovation in our industry.” 

    Dr. Lisa Su, AMD Chair and CEO

    “As a strategic supplier of Qualcomm, GlobalFoundries shares our vision for strengthening U.S. chip production capacity. This commitment from GlobalFoundries will help secure a resilient semiconductor supply chain to support the next wave of U.S. technology innovation, especially in areas vital to enabling power efficient computing, connectivity, and edge intelligence.”

    Cristiano Amon, president and CEO of Qualcomm Incorporated

    “Deepening our partnership with GlobalFoundries aligns with NXP’s hybrid manufacturing strategy, where we work with leading foundry partners to better serve our customers’ strategic technology, capacity and resilience needs. This collaboration allows us to scale efficiently, expand production in the U.S. and continue delivering for our customers. It’s a strong step forward in building a resilient, high-performing semiconductor supply chain in the United States.”

    Kurt Sievers, chief executive officer of NXP Semiconductors

    “Semiconductors are critical to the future of vehicles, and their importance will only grow. GlobalFoundries’ investment supports our work to secure a reliable, U.S.-based chip supply—essential for delivering the safety, infotainment and features our customers expect.”

    Mark Reuss, president of General Motors

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  • GlobalFoundries Reports Q1 2025 Financial Results

    GlobalFoundries Reports Q1 2025 Financial Results

    2 Min Read

    GLOBALFOUNDRIES Inc. (GF) announced preliminary financial results for the first quarter ended March 31, 2025.

    Key First Quarter Financial Highlights

    • Revenue of $1.585 billion
    • Gross margin of 22.4% and Non-IFRS gross margin of 23.9%
    • Operating margin of 9.5% and Non-IFRS operating margin of 13.4%
    • Net income of $211 million and Non-IFRS net income of $189 million
    • Diluted earnings per share of $0.38 and Non-IFRS diluted earnings per share of $0.34
    • Non-IFRS adjusted EBITDA of $558 million
    • Ending cash, cash equivalents and marketable securities of $3.7 billion
    • Net cash provided by operating activities of $331 million and Non-IFRS adjusted free cash flow of $165 million

    “In the first quarter, the GF team delivered strong financial results at the high end of the Non-IFRS guidance ranges for revenue, gross margin, and earnings per share,” said Tim Breen, CEO of GF. “A testament to our solid execution, operational excellence, and robust design wins, our Automotive, Communications Infrastructure and Datacenter, and Home and Industrial IoT end markets grew year over year in the first quarter. From autonomous vehicles to satellite communications to optical networking, GF continues to build momentum in critical applications with robust growth prospects.”

    Recent Business Highlights

    • GF and indie Semiconductor announced a strategic partnership to develop high-performance radar systems-on-chip (SoC). Built on GF’s automotive-qualified 22FDX® platform, these solutions will target 77 GHz and 120 GHz radar applications to enable safety-critical advanced driver assistance systems with low cost, small footprint, and efficient power consumption.
    • Ayar Labs announced that the industry’s first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet will utilize GF’s monolithic photonics platform. GF’s technology uniquely enables Ayar Lab’s solution to enhance AI infrastructure performance by driving high-speed data over long distances, while reducing latency and power consumption.
    • In April, Bosch announced at Auto Shanghai the launch of its next generation single chip radar sensor, which reliably, precisely, and quickly detects objects for assisted and automated driving. As previously announced, GF continues its partnership with Bosch, enabling this high-performance, high-efficiency automotive radar technology with GF’s 22FDX platform.

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  • GlobalFoundries Announced Q4 2024 and Fiscal Year 2024 Financial Results

    GlobalFoundries Announced Q4 2024 and Fiscal Year 2024 Financial Results

    3 Min Read

    GlobalFoundries Inc. (GF) announced preliminary financial results for the fourth quarter and fiscal year ended December 31, 2024.

    Key Fourth Quarter Financial Highlights

    • Revenue of $1.830 billion
    • Gross margin of 24.5% and Non-IFRS gross margin of 25.4%
    • Operating margin of (38.3)% and Non-IFRS operating margin of 15.6%
    • Net loss of $729 million and Non-IFRS net income of $256 million
    • Diluted loss per share of $1.32 and Non-IFRS diluted earnings per share of $0.46
    • Non-IFRS adjusted EBITDA of $661 million
    • Ending cash, cash equivalents and marketable securities of $4.2 billion
    • Net cash provided by operating activities of $457 million and Non-IFRS adjusted free cash flow of $328 million

    Key Full Year 2024 Financial Highlights

    • Revenue of $6.750 billion
    • Gross margin of 24.5% and Non-IFRS gross margin of 25.3%
    • Net loss of $262 million and Non-IFRS net income $870 million
    • Diluted loss per share of $0.48 and Non-IFRS diluted earnings per share of $1.56
    • Non-IFRS adjusted EBITDA of $2.475 billion
    • Year to date net cash provided by operating activities of $1.722 billion and Non-IFRS adjusted free cash flow of $1.107 billion

    “In the fourth quarter, the GF team delivered solid financial results that exceeded the Non-IFRS midpoint of the guidance ranges we provided in our November earnings release,” said Dr. Thomas Caulfield, President and CEO of GF. “2024 presented a unique set of challenges for our industry, but thanks to our focus on operational excellence, we generated over $1 billion of Non-IFRS adjusted free cash flow. As we look to 2025, we are encouraged by our strong design win momentum across our end markets and product portfolio as we position GF for a growth year.”

    In the fourth quarter 2024, GF recorded a $935 million impairment charge on the long-lived assets relating to legacy investments in production capacity at its facility in Malta, New York. GF undertook this action pursuant to the diversification of its long-term manufacturing technology platform roadmap in Malta, which is consistent with the Company’s previously communicated technology transfer strategy needed to meet expected long-term customer demand. Since such impairment is not expected to be a recurring event, the Company believes this additional adjustment to Non-IFRS metrics better enables management and investors to make more meaningful comparisons of fourth quarter 2024 results against prior periods.

    Recent Business Highlights

    • GF announced a first-of-its-kind center for advanced packaging and test capabilities, to be developed at its Malta, New York facility. Supported by grants from New York State and the U.S. Department of Commerce, GF’s Advanced Packaging and Photonics Center will help meet the growing demand for U.S.-made essential chips used in AI, automotive, aerospace and defense, and communications applications.
    • IDEMIA and GF announced a partnership to deliver next-generation smart card technology with improved data retention, low read latency and enhanced power efficiency – saving customers cost and time. This multi-year collaboration will be 100% manufactured and tested in Europe on GF’s 28ESF3 platform, ensuring trusted providence.
    • Lightmatter announced that it will use GF’s Fotonix™ fabrication platform to develop the industry’s most robust and scalable AI interconnect solution. By integrating electronics and photonics into a single CMOS wafer, GF’s unique solution will enable the speed and efficiency needed for future AI data centers.

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  • GlobalFoundries Announced Leadership Transition to Propel Next Phase of Growth

    GlobalFoundries Announced Leadership Transition to Propel Next Phase of Growth

    5 Min Read

    GlobalFoundries announced, following a rigorous succession planning process, its Board of Directors has appointed Dr. Thomas Caulfield as Executive Chairman and Tim Breen as Chief Executive Officer. Caulfield succeeds Ahmed Yahia who will step down from the Board and his role as Chairman after more than a decade in the position. Breen, who has been with GF since 2018, and is currently Chief Operating Officer (COO), succeeds Caulfield. In addition, Niels Anderskouv, currently GF’s Chief Business Officer, has been appointed GF’s President and COO. With a strong foundation in place, this leadership transition positions GF to accelerate its next phase of growth. These changes will become effective April 28, 2025.

    “I am extremely proud of all that we have accomplished at GF,” said Yahia. “In partnership with our customers, we have built GF into a leading semiconductor manufacturer, with a differentiated technology portfolio and a truly global footprint. With a solid strategic foundation and strong execution capabilities in place, it’s the right time to take the company to the next level. In this context, the Board and Tom selected Tim as its new CEO. Tim has a clear vision for GF, a well-articulated strategy, an impeccable operational track record and a proven ability to drive business performance. The Board is also delighted that Tom will remain closely engaged with the company in his new capacity of Executive Chairman and will continue to focus on strategic industry, academia and government partnerships. Tom has been a superb leader for the company, a values-driven CEO who put the company on the path to sustained success. We are deeply grateful for his leadership over the past seven years.”

    “Following a thoughtful, multi-year succession planning process the board unanimously selected Tim to be GF’s next CEO,” said David Kerko, Lead Independent Director of the GF Board. “We are confident he is the right person to guide GF forward and are excited to work closely with him as the company continues to build on its strong momentum.”

    “I am truly honored and excited to be appointed as the next CEO of GF,” said Breen. “GF is uniquely positioned with our talented team, differentiated technology and geographically diverse manufacturing footprint to meet our global customers’ needs. I appreciate the confidence that the Board has placed in me, and I look forward to partnering with Tom and Niels to expand our portfolio, deepen our customer focus, accelerate our growth and deliver increasing value for our shareholders.”

    “Since joining GF, Tim has played a critical role as my co-pilot in shaping the strategy of the company,” said Caulfield. “In his current role as COO, Tim has made a tremendous impact integrating GF’s global operations and driving performance while accelerating our digital and sustainability transformations. As the AI wave moves from cloud to edge, GF is uniquely positioned to accelerate growth and continue to innovate, deliver and create value for all our stakeholders, and I am fully confident in Tim’s ability to lead the company into this next phase.”

    “I am also looking forward to Niels assuming an even greater responsibility for end-to-end execution of commercial strategy, product differentiation and global manufacturing,” continued Caulfield. “Since joining the team in 2023, Niels has set a clear strategy for building differentiated products, value-added services and establishing durable partnerships with our customers. Together, Tim and Niels have the vision and experience to guide the company forward.”

    “Finally, I want to express my deepest gratitude to Ahmed for his tireless efforts and exceptional leadership over the past eleven years,” said Caulfield. “His vision and dedication have been instrumental in shaping GF into the company it is today.”

    Caulfield became President and CEO of GF in 2018. During his tenure he repositioned the technology portfolio to focus on differentiated, essential chips and steered the company to sustainable profitability. In 2021, he spearheaded GF’s IPO, one of the largest semiconductor IPOs in history. Amid a global chip shortage, he focused on building resilient supply chains, investing in new manufacturing capacity and forging partnerships with key customers and governments.

    Breen oversees the company’s global operations, including the manufacturing, quality, supply chain and IT teams, based in New York. Prior to becoming COO in 2023, he served in various senior executive roles encompassing strategy, business transformation and finance as a close partner and advisor to the CEO since 2018. Prior to joining GF, Breen was a senior member of the executive team at Mubadala Investment Company where he led global projects and investments across numerous sectors from energy and industrials to consumer and life sciences, including contributing to the creation of several multi-billion-dollar companies. He has also served on the board of several public and private companies, including his current position of Chairman of NOVA Chemicals. Earlier in his career, after graduating from the London Business School, he was a partner at McKinsey & Company.

    Anderskouv joined GF as Chief Business Officer in 2023 with responsibilities for leading GF’s product and technology roadmap, business and commercial strategy as well as the company’s go-to-market execution. He brings more than 25 years of experience in engineering, manufacturing, executive management and global leadership in the semiconductor industry.

    Prior to joining GF, he served as Senior Vice President and Executive Officer at Texas Instruments, where he was responsible for the company’s multi-billion-dollar Analog Power business. Anderskouv holds a Master of Science in Electrical Engineering from the Technical University of Denmark (DTU) in Copenhagen.

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  • GlobalFoundries Joined LOT Network

    GlobalFoundries Joined LOT Network

    3 Min Read

    GlobalFoundries has joined the LOT Network, the world’s largest patent licensing platform and non-profit community of global companies committed to protecting themselves against costly litigation from patent assertion entities (PAEs). With this move, GF joins a community of more than 4,500 companies that include half of the top 20 largest U.S. patent holders, and half of the S&P Global 100 and Fortune 100.

    Semiconductors play an ever-increasing and vital role in driving innovation, enabling diverse applications across high-growth markets such as artificial intelligence, automotive, smart devices and advanced healthcare technologies. With a global footprint spanning three continents, GF is a leading innovator of differentiated essential chip technologies and has added its nearly 10,000 global patent assets in semiconductor manufacturing, test, and design to the protections of LOT Network.

    PAEs, referred to by some as “patent trolls”, are responsible for more than 87 percent of all patent litigation against the high-tech industry. Many of the patents used are acquired from the industry itself and are used by the PAEs to profit through litigation against other members of the industry.

    GF’s membership in LOT Network protects the company and minimizes litigation risk, allowing the company to focus on innovation that will drive advancements in smarter, more secure, connected and efficient devices. LOT Network membership provides a global shield, with members from 56 different countries.

    “Semiconductors are the key building blocks for so many products that the world relies on to live, work and connect. We are committed to protecting our technology and securely manufacturing the essential chips our customers, partners and industry rely on,” said Adam Noah, Chief IP Counsel at GF. “By joining the LOT Network, we are further safeguarding our business and our customers against PAE litigation, allowing us to focus on the important work of delivering world-class technology solutions. We encourage others within the semiconductor manufacturing and design ecosystem to address the PAE drain on resources by joining LOT’s protective community, which provides strength in numbers.”

    “GF is the perfect role model for a U.S.-based semiconductor supplier,” said Ken Seddon, CEO of LOT Network. “Not only are they protecting their business, but they are also protecting their customers, as all GF products now come with free immunization to over 20 percent of all US patents. GF is a semiconductor visionary for recognizing the critical role it plays in the protection not just of the semiconductor industry, but the many verticals that rely upon its technologies as well.”

    Original – GlobalFoundries

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