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Efficient Power Conversion has launched a new generation of 100 V integrated GaN power-stage ICs—EPC23108, EPC23109, EPC23110, and EPC23111—targeting high-performance, compact power systems such as humanoid robots, drones, and battery-powered platforms.
The new devices integrate high-side and low-side eGaN FETs יחד with gate drivers and level-shifting circuitry into a single thermally enhanced QFN package. This high level of integration reduces external component count, simplifies design, and improves system-level reliability while maintaining the efficiency and power density advantages of GaN technology.
The ICs support operation up to 100 V, with current capabilities of 35 A (EPC23108/23109) and 20 A (EPC23110/23111), enabling high-frequency switching for advanced motion control and power conversion applications. Design flexibility is further enhanced through configurable PWM interfaces—single-input options for simplified multi-axis systems and dual-input configurations for adaptive control schemes.
From a functionality standpoint, the devices incorporate features aimed at real-world robustness, including deterministic shutdown behavior, active gate pull-down for fault conditions, and compatibility with standard industrial logic without additional signal conditioning. Support for continuous 100% duty-cycle operation makes them well-suited for applications requiring uninterrupted conduction, such as motor drives and precision control systems.
These integrated GaN power stages are particularly relevant for emerging applications like humanoid robotics, where multiple motors per system demand compact, efficient, and scalable power solutions. By reducing design complexity and improving predictability, EPC enables faster development cycles and more reliable system performance.
From a market perspective, this launch highlights the rapid expansion of GaN into motion control and robotics—segments traditionally dominated by silicon MOSFETs. As electrification extends into automation, drones, and AI-driven robotics, integrated GaN solutions are increasingly positioned as key enablers of higher efficiency, reduced system size, and improved dynamic performance.
Original – Efficient Power Conversion
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Semilab has introduced its new WG product line, a wafer geometry monitoring solution designed to support precise dimensional analysis in semiconductor substrate manufacturing.
The WG systems utilize capacitive sensing technology, a non-contact measurement method that delivers high accuracy and reproducibility while minimizing sensitivity to surface variations. This makes the solution particularly effective across different wafer surface conditions, including sliced, lapped, and etched substrates.
The platform is designed for process control during the wafering phase, where maintaining tight geometric tolerances is critical for downstream device performance. Key measurement capabilities include thickness, bow and warp, total thickness variation (TTV), and flatness. Optional features such as non-contact resistivity measurement and film stress characterization further extend its applicability for integrated circuit manufacturers.
To accommodate different production requirements, the WG product line is available in multiple configurations—WG-2201, WG-2202, and WG-2500—offering flexibility in wafer size handling and loading options.
From a market perspective, this launch aligns with increasing demands for tighter process control in advanced semiconductor manufacturing, particularly as device scaling, heterogeneous integration, and wide-bandgap materials introduce greater sensitivity to wafer-level variations. Metrology solutions like Semilab’s WG systems play a critical role in improving yield, ensuring device reliability, and enabling consistent high-volume production.
Original – Semilab
