Semilab has introduced its new WG product line, a wafer geometry monitoring solution designed to support precise dimensional analysis in semiconductor substrate manufacturing.
The WG systems utilize capacitive sensing technology, a non-contact measurement method that delivers high accuracy and reproducibility while minimizing sensitivity to surface variations. This makes the solution particularly effective across different wafer surface conditions, including sliced, lapped, and etched substrates.
The platform is designed for process control during the wafering phase, where maintaining tight geometric tolerances is critical for downstream device performance. Key measurement capabilities include thickness, bow and warp, total thickness variation (TTV), and flatness. Optional features such as non-contact resistivity measurement and film stress characterization further extend its applicability for integrated circuit manufacturers.
To accommodate different production requirements, the WG product line is available in multiple configurations—WG-2201, WG-2202, and WG-2500—offering flexibility in wafer size handling and loading options.
From a market perspective, this launch aligns with increasing demands for tighter process control in advanced semiconductor manufacturing, particularly as device scaling, heterogeneous integration, and wide-bandgap materials introduce greater sensitivity to wafer-level variations. Metrology solutions like Semilab’s WG systems play a critical role in improving yield, ensuring device reliability, and enabling consistent high-volume production.
Original – Semilab