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LATEST NEWS3 Min Read
Alpha and Omega Semiconductor Limited announced it will exhibit and demonstrate the advancements it has made in delivering application-specific power semiconductor, power IC and module solutions at PCIM 2025. Attendees will learn about the company’s groundbreaking power management product innovations that solve critical design challenges in multiple strategic markets and match key application specifications. The AOS products highlighted at PCIM will include:
Booth highlights
- Automotive and Industrial: AOS is introducing its AEC-Q101 qualified Generation 3 1200V SiC MOSFET technology that will provide a 20-30 percent loss improvement compared to the already leading Gen 2 technology. This performance enhancement will not come with a penalty to robustness as the Gen3 technology has improved ruggedness, including full HV-H3TRB compliance for harsh environment applications. These new MOSFETs expand the existing automotive-qualified 650V, 750V, 1200V, and 1700V SiC MOSFETs in through-hole and surface mount/topside cooled packages. The 1200V Gen3 SiC MOSFETs will initially be available from 15mohm to 40mohm in TO247-4L packages with production starting May 2025.
- Intelligent Power Modules, Mega IPM-7: AOS has integrated its latest G2 IGBT and high-voltage gate driver into the world’s most compact package design, delivering mega power of up to 100W for motor control applications. The portfolio covers 600V / (1A-3A) in various package options (Mega IPM-7D, IPM-7DT, IPM-7E) that are ideal solutions for various design requirements.
- Motor Drive ICs: AOS will announce a new range of 60V and 100V driver ICs for power tools, outdoor garden equipment, and e-mobility applications, including a 100V half-bridge driver IC, a 100V 3-phase driver IC, and a 60V 3-phase driver IC. These products all support 100 percent duty cycle operation. Plus, demo boards using AOS’ motor driver IC and AlphaSGT™ MOSFETs (30V-150V) will be featured.
- eFuse: AOS’ Hot Swap Controllers and Power MOSFET combined into a single eFuse package. The eFuse can improve the system’s reliability by isolating the load from the main power rails in case of a fault condition. AOS will announce its latest 12V/60A eFuse products in May 2025.
- State-of-the-art Packaging: AOS’ highly efficient 25V-150V MOSFETs are available in advanced packaging, including a double-sided cooling DFN 5×6 that delivers industry-leading thermal resistance. Also available are two robust packages, LFPAK 5×6 package and the GLPAK™, which features gull-wing leads for enhanced board reliability and larger copper clips that significantly improve current carrying capability. In addition, the GTPAK™ is a topside cooling package designed with a large exposed pad for more efficient heat transfer.
Original – Alpha and Omega Semiconductor
- Automotive and Industrial: AOS is introducing its AEC-Q101 qualified Generation 3 1200V SiC MOSFET technology that will provide a 20-30 percent loss improvement compared to the already leading Gen 2 technology. This performance enhancement will not come with a penalty to robustness as the Gen3 technology has improved ruggedness, including full HV-H3TRB compliance for harsh environment applications. These new MOSFETs expand the existing automotive-qualified 650V, 750V, 1200V, and 1700V SiC MOSFETs in through-hole and surface mount/topside cooled packages. The 1200V Gen3 SiC MOSFETs will initially be available from 15mohm to 40mohm in TO247-4L packages with production starting May 2025.
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FINANCIAL RESULTS / LATEST NEWS1 Min Read
Renesas Electronics Corporation announced its financial results for the first quarter ended March 31, 2025.
Key Highlights:
- Revenue: 366.7 billion yen (approximately $2.37 billion), representing a 1.7% year-over-year increase.
- Gross Margin: 57.8%, maintaining strong profitability levels.
- Operating Income: 96.9 billion yen (approx. $627 million), a 6.4% increase year-over-year.
- Net Income: 70.5 billion yen (approx. $455 million), up 5.8% compared to Q1 2024.
Company’s focus on enhancing profitability and maintaining operational discipline allowed it to deliver a resilient performance despite mixed demand conditions in key end markets, including automotive and industrial sectors.
Strategic Progress: Renesas continues its investment in innovation and strategic initiatives:
- Advancements in power management, analog, and microcontroller products.
- Strengthening leadership in automotive solutions, including ADAS and electrification.
- Expanding its reach into the industrial automation and energy sectors.
Outlook for Q2 2025:
- Revenue Guidance: Approximately 380 billion yen.
- Gross Margin Forecast: Around 58.0%.
Renesas remains committed to navigating global economic uncertainty through cost optimization, diversified product offerings, and a strong focus on next-generation technologies.
Original – Renesas Electronics
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STMicroelectronics has announced its financial results for the first quarter of 2025, reflecting both the challenges of a shifting market and the company’s strategic transformation efforts.
Key Highlights:
- Net Revenues: $2.52 billion, down 27.3% year-over-year
- Gross Margin: 33.4%
- Operating Income: $3 million
- Net Income: $56 million, representing an 89.1% drop compared to Q1 2024
CEO Jean-Marc Chery acknowledged that while Q1 revenues aligned with expectations, the decline was mainly attributed to lower performance in the Automotive and Industrial sectors, partially offset by stronger results in Personal Electronics.
Despite the decline, ST’s book-to-bill ratio improved, particularly within Automotive and Industrial, signaling stronger order intake compared to shipments.
Looking Ahead:
- ST expects Q2 2025 net revenues of approximately $2.71 billion, a sequential growth of 7.7%.
- Gross margin is forecasted to remain steady at around 33.4%, impacted by unused capacity charges.
- The company is maintaining its 2025 net CapEx target between $2.0 billion and $2.3 billion to support its manufacturing reshaping initiatives.
Strategic Initiatives: STMicroelectronics is pushing forward with its company-wide restructuring program, aiming to reshape its manufacturing footprint and resize its global cost base. The program targets annual cost savings in the high triple-digit million-dollar range by the end of 2027.
Chery emphasized that ST views Q1 2025 as the bottom of the cycle and is focused on innovation, manufacturing efficiency, and cost control to navigate the uncertain global environment.
Segment Performance:
- Analog, Power & Discrete, MEMS and Sensors (APMS): Revenues down 28% YoY
- Power and Discrete Products (P&D): Revenues fell 37.1% YoY, operating margin turned negative
- Embedded Processing (EMP): Revenues declined 29.1% YoY
- RF & Optical Communications (RF&OC): Revenues down 19.2% YoY
Financial Strength:
- Free cash flow turned positive at $30 million, compared to a negative $134 million a year ago.
- Net financial position remained robust at $3.08 billion.
Original – STMicroelectronics