• Renesas Electronics Adds Transphorm's GaN to Its Power Portfolio

    Renesas Electronics Adds Transphorm’s GaN to Its Power Portfolio

    3 Min Read

    Renesas Electronics Corporation and Transphorm, Inc. announced that they have entered into a definitive agreement pursuant to which a subsidiary of Renesas will acquire all outstanding shares of Transphorm’s common stock for $5.10 per share in cash, representing a premium of approximately 35% to Transphorm’s closing price on January 10, 2024, a premium of approximately 56% to the volume weighted average price over the last twelve months and a premium of approximately 78% to the volume weighted average price over the last six months.

    The transaction values Transphorm at approximately $339 million. The acquisition will provide Renesas with in-house GaN technology, a key next-generation material for power semiconductors, expanding its reach into fast-growing markets such as EVs, computing (data centers, AI, infrastructure), renewable energy, industrial power conversion and fast chargers/adapters.

    Demand for highly efficient power systems is increasing as building blocks for carbon neutrality. To address this trend, an industry-wide transition toward wide bandgap (“WBG”) materials, represented by silicon carbide (“SiC”) and GaN, is also being seen. These advanced materials allow a broader range of voltage and switching frequency than conventional silicon-based devices. To build on this momentum, Renesas has announced the establishment of an in-house SiC production line, supported by a 10 year SiC wafer supply agreement.

    Renesas now aims to further expand its WBG portfolio with Transphorm’s expertise in GaN, an emerging material that enables higher switching frequency, lower power losses, and smaller form factors. These benefits empower customers’ systems with greater efficiency, smaller and lighter composition, and lower overall cost.

    As such, demand for GaN is predicted to grow by more than 50 percent annually, according to an industry study. Renesas will implement Transphorm’s auto-qualified GaN technology to develop new enhanced power solution offerings, such as X-in-1 powertrain solutions for EVs, along with computing, energy, industrial and consumer applications.

    “Transphorm is a company uniquely led by a seasoned team rooted in GaN power and with origins from the University of California at Santa Barbara,” said Hidetoshi Shibata, CEO of Renesas. “The addition of Transphorm’s GaN technology builds on our momentum in IGBT and SiC. It will fuel and expand our power portfolio as a key pillar of growth, offering our customers the full ability to choose their optimal power solutions.”

    “Combined with Renesas’ world-wide footprint, breadth of solution offerings and customer relationships, we are excited to pave the way for industry-wide adoption of WBG materials and set the stage for significant growth.

    This transaction will also allow us to offer further expanded services to our customers and deliver significant immediate cash value to our stockholders,” said Dr. Primit Parikh, Co-founder, President and CEO of Transphorm and Dr. Umesh Mishra, Co-founder and CTO of Transphorm. “Additionally, it will provide a strong platform for our exceptional team to further Transphorm’s leading GaN technology and products.”

    The board of directors of Transphorm has unanimously approved the definitive agreement with respect to the transaction and recommended that Transphorm stockholders adopt such definitive agreement and approve the merger. Concurrently with the execution of the definitive agreement, KKR Phorm Investors L.P., which holds approximately 38.6% of Transphorm’s outstanding common stock, has entered into a customary voting agreement with Renesas to vote in favor of the transaction.

    The transaction is expected to close in the second half of calendar year 2024, subject to Transphorm stockholder approval, required regulatory clearances and the satisfaction of other customary closing conditions.

    Original – Renesas Electronics

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  • Florian Martens Appointed Global Head of Communications & Public Policy at Infineon

    Florian Martens Appointed Global Head of Communications & Public Policy at Infineon

    2 Min Read

    Florian Martens will take over as global Head of Communications & Public Policy at Infineon Technologies AG on 1 March 2024. As Executive Vice President and Chief Communications Officer, he will report to Jochen Hanebeck, CEO of Infineon. Florian Martens succeeds Bernd Hops, who has left Infineon at his own request effective 30 September 2023.

    “On its ambitious growth path, Infineon needs to communicate effectively with a wide range of stakeholders. With Florian Martens, we have found an internationally recognized communications professional for this strategic management task. We are very pleased to welcome him to our team with his extensive experience and expertise,” says Jochen Hanebeck, CEO of Infineon Technologies AG.

    Florian Martens joins from Siemens AG, where he is responsible for global Media Relations, Executive Communications and Thought Leadership activities since June 2020. Together with his team, he contributed significantly to Siemens’ new external positioning as a leading global technology company.

    “Semiconductors are the hearts and brains of our digital world. There is no more exciting and relevant industry for the digital and green transformation. Infineon is a global champion in this key industry and I am delighted to be part of this team going forward. At the same time, I would like to thank all my colleagues for a great time at Siemens,” says Florian Martens.

    Before joining Siemens, Florian Martens spent 15 years at Daimler AG, most recently as Head of Global Communications at Daimler Truck AG, the world’s largest commercial vehicle manufacturer. At Daimler, he held various management positions in Germany and abroad, including in Corporate Communications and Product Strategy at Mercedes-Benz Passenger Cars. He holds a Bachelor of Science from the University of Wisconsin (Madison USA) and a Masters of Business Administration from the Technical University of Munich.

    Original – Infineon Technologies

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