flowDUAL Tag Archive

  • Vincotech Introduced New flowDUAL E3 SiC

    Vincotech Introduced New flowDUAL E3 SiC

    1 Min Read

    Engineered for maximum power density, this half-bridge module can serve to construct excellent H-bridges and sixpacks. Far higher current handling, enhanced power loss dissipation, greater scalability than a solution with a single-module footprint – the flowDUAL delivers all this and more. 

    In combination with VINcoPress and advanced die-attach technology, this new baseplate-less module from Vincotech is your first choice for a wide range of high-power use cases where utmost efficiency and reliability are top priorities.

    Main benefits

    • Outstanding, ≥99% conversion efficiency brings down overall costs
    • Low stray inductance and symmetrical chip layout enable higher switching frequency and lower system costs
    • Greater supply chain security with
      – the new flow E3 industry standard-compatible housing (CTI >600)
      – the latest multi-sourced SiC devices
    • Excellent thermal performance with VINcoPress technology to decrease junction temperature and increase lifetime
    • Pre-applied PC-TIM rated for 150°C helps reduce production cost


    • Industrial drives
    • Embedded drives
    • EV Chargers
    • Solar
    • UPS

    Original – Vincotech

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