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Axcelis Technologies, Inc. announced two major product launches designed to strengthen its leadership in enabling advanced power and engineered substrate devices.
The company introduced the GSD Ovation™ ES high current ion implanter, specifically developed for engineered substrate applications such as wafer splitting. Built on the proven GSD Ovation platform, the system delivers best-in-class Hydrogen and Helium implant capability, while offering unmatched flexibility and capital efficiency. It supports multiple substrate types—including SiC, LiTaO₃, and LiNbO₃—across a wide range of thicknesses and weights, and integrates advanced wafer handling, beam power, and cooling capabilities.
In parallel, Axcelis launched the Purion Power Series+™ ion implant platform, designed to improve device performance and productivity for next-generation power devices, including superjunction architectures.
The expanded product family includes the Purion H200+ SiC for high current medium energy applications, the Purion M+ SiC for medium current, and the Purion XE+ SiC and EXE+ SiC for high energy requirements. With flexibility to process multiple wafer sizes (150mm and 200mm), diverse substrate materials (SiC, Si, GaN, GaAs), and a range of implant temperatures, the platform delivers industry-leading throughput and capital efficiency.
Executives emphasized that both new platforms reflect Axcelis’ close collaboration with customers to address evolving manufacturing requirements in the power semiconductor market. Together, the GSD Ovation ES and Purion Power Series+ enhance Axcelis’ comprehensive ion implantation portfolio, positioning the company to support the industry’s transition to advanced materials and architectures that enable higher efficiency and performance in power devices.
Original – Axcelis Technologies
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Wise Integration announced the appointment of Ghislain Kaiser as its new Chief Executive Officer. Kaiser succeeds co-founder Thierry Bouchet, who will continue as Chief Technology Officer and General Manager, leading worldwide R&D and driving the company’s technological vision.
Ghislain Kaiser brings deep experience in scaling high-tech ventures and leading global semiconductor teams. In 2006, he co-founded Docea Power, a French EDA startup that introduced full-chip, system-level power and thermal modeling to address the rising challenges of energy consumption and heat in IC and platform design. Under his leadership, Docea Power became a market leader before being acquired by Intel in 2015.
At Intel, Kaiser spent the following decade in senior director roles, most recently overseeing system simulation engineering and a worldwide customer enablement organization. His work tackled the most critical challenges in designing consumer, data-center, and AI systems, from power and thermal management to overall performance optimization. He began his career at STMicroelectronics, where he held technical and leadership roles in test, product engineering, design, and architecture.
With Kaiser at the helm, Wise Integration is positioning itself to scale globally and tap into fast-growing markets such as AI-driven data centers and electric vehicles, both of which demand more efficient, compact, and digitally controlled power architectures.
“I’m thrilled to join Wise Integration and build on its success in providing customers with differentiated solutions in power electronics,” said Kaiser. “This team has created an R&D-driven culture and a strong foundation to lead the GaN power electronics transformation worldwide.”
Chairman Patrick Boulaud welcomed Kaiser’s appointment as a major milestone for the company’s evolution from a CEA-Leti spinout into a global force in GaN and digital power management innovation. Co-founder Thierry Bouchet added that with WiseGan® devices and WiseWare® digital control, the company has already built a strong foundation in consumer markets. The next step, he emphasized, is scaling innovations to deliver unmatched efficiency and power density to AI servers, data centers, and automotive systems.
Company Highlights (2020–2025)
- Spun out from CEA-Leti in 2020 using the institute’s GaN-on-silicon R&D platform
- Developed proprietary WiseGan® IC and WiseWare® microcontroller
- Launched fully digital controller WiseWare® 1.1
- Opened a design center in Canada and established an Asian subsidiary in Hong Kong
Original – Wise Integration
