Axcelis Technologies, Inc. announced two major product launches designed to strengthen its leadership in enabling advanced power and engineered substrate devices.
The company introduced the GSD Ovation™ ES high current ion implanter, specifically developed for engineered substrate applications such as wafer splitting. Built on the proven GSD Ovation platform, the system delivers best-in-class Hydrogen and Helium implant capability, while offering unmatched flexibility and capital efficiency. It supports multiple substrate types—including SiC, LiTaO₃, and LiNbO₃—across a wide range of thicknesses and weights, and integrates advanced wafer handling, beam power, and cooling capabilities.
In parallel, Axcelis launched the Purion Power Series+™ ion implant platform, designed to improve device performance and productivity for next-generation power devices, including superjunction architectures.
The expanded product family includes the Purion H200+ SiC for high current medium energy applications, the Purion M+ SiC for medium current, and the Purion XE+ SiC and EXE+ SiC for high energy requirements. With flexibility to process multiple wafer sizes (150mm and 200mm), diverse substrate materials (SiC, Si, GaN, GaAs), and a range of implant temperatures, the platform delivers industry-leading throughput and capital efficiency.
Executives emphasized that both new platforms reflect Axcelis’ close collaboration with customers to address evolving manufacturing requirements in the power semiconductor market. Together, the GSD Ovation ES and Purion Power Series+ enhance Axcelis’ comprehensive ion implantation portfolio, positioning the company to support the industry’s transition to advanced materials and architectures that enable higher efficiency and performance in power devices.
Original – Axcelis Technologies