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Vishay Intertechnology, Inc. announced that the company’s facility in Borgaro Torinese, Italy, has been approved for inclusion in “Silicon Valley 8.0 in Piemonte for a Green and Smart Mobility” (SVINBO 8.0), a funded project submitted to the European Union (NGEU) and the Italian government. Funding for the grant will be provided through the NGEU M1C2 – 5.2 program targeting productivity and value chains for microelectronics and semiconductors.
In cooperation with the Polytechnic of Turin, SVINBO 8.0 consists of an investment project aimed at the production of a new family of semiconductors for the EV / HEV market, in addition to an R&D project aimed at developing new diode chips for e-mobility and new power modules. In addition to strengthening production and technology, the inclusion of Vishay in SVINBO 8.0 will have strategic impacts on the microelectronic supply chain, improving competitive positioning in the territory.
Original – Vishay Intertechnology
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Infineon Technologies AG provides its 600 V CoolMOS™ 8 high-voltage superjunction (SJ) MOSFET product family to LITEON, a leader in power management solutions, for superior efficiency and reliability in server applications. The 600 V CoolMOS 8 offers an all-in-one solution that improves LITEON’s new generation technology for existing and upcoming server application designs.
Infineon’s newest CoolMOS 8 at 600 V is leading the way in high-voltage superjunction MOSFET technology, setting the standard for both technology and price performance on a global scale. The technology increases the overall performance of systems, while also playing a crucial role in reducing carbon emissions in various applications, including chargers and adapters, solar and energy storage systems, EV charging infrastructure, and uninterruptible power supplies (UPS) for example.
The 600 V CoolMOS 8 SJ is designed to provide high efficiency and reliability, which aligns perfectly with LITEON’s and Infineon’s commitment to advancing performance and total-cost-of-ownership for server applications. Additionally, the .XT interconnect technology being a key feature of CoolMOS 8 makes the new generation a perfect fit for conventional and AI servers. The advanced interconnect technology offers industry leading thermal dissipation capabilities and improves electrical performance by reducing parasitic inductance and resistance. The CoolMOS 8 SJ MOSFETs have an 18 percent lower gate charge compared to previous MOSFET models and the quickest turn-off time in the market. Their thermal performance has been improved by 14 to 42 percent.
“Our CoolMOS 8 SJ MOSFETs achieve first-class power density and efficiency, which is essential for high-performance server applications,” said Richard Kuncic, Head of Power Systems at Infineon. “The all-in-one solution provided by the CoolMOS 8 product family simplifies our portfolio, making the selection process easier whilst reducing design-in efforts.”
“LITEON is excited to leverage Infineon’s CoolMOS 8 family in our next-generation server designs,” said John Chang, General Manager, Cloud Infrastructure Platform & Solution SBG, LITEON. “The superior efficiency and reliability of the 600 V CoolMOS 8 SJ underscores our commitment to delivering cutting-edge technology and energy-efficient solutions to our customers.”
The 600 V CoolMOS 8 SJ MOSFETs series is an “all in MOSFET” technology addressing industrial and consumer applications. Thanks to its integrated fast body diode, it enables usage of one MOSFET family across all main topologies in the targeted markets. It enables cost attractive Si-based solutions enhancing Infineon’s high-voltage wide band gap (WBG) offerings. The MOSFETs are available in SMD-QDPAK, TOLL and ThinTOLL-8×8 packages.
Samples of the 600 V CoolMOS 8 SJ MOSFETs are now available. More information is available at www.infineon.com/coolmos8. Learn more about the benefits of Infineon’s 600 V CoolMOS 8 SJ MOSFETs in the whitepaper here.
Original – Infineon Technologies
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For Siltronic AG Q1 2025 continued to be characterized by ongoing weak demand for wafers, resulting in a sales decline of around 4 percent compared to Q4 2024, mainly due to slightly negative product mix and price effects.
“The start of the year was within expectations. However, visibility remains limited on when our customers’ inventories will recover and thus demand for wafers will increase. Added to this are uncertainties due to the tightening of American tariff policies and the corresponding countermeasures. The impacts on end-markets and FX rates are not yet foreseeable. However, we do not currently expect any significant direct impact of tariff policies on Siltronic,” commented Dr. Michael Heckmeier, CEO of Siltronic AG, on the development.
Siltronic achieved sales of EUR 345.8 million in Q1 2025, a decrease of 4.1 percent compared to Q4 2024. This development was within expectations and was mainly due to slightly negative product mix and price effects. The average FX rate of the Euro to the US dollar in Q1 2025 was 1.05 (Q4 2024: 1.07), which slightly supported sales.
Cost of sales decreased by 1.4 percent compared to the previous quarter. Due to the disproportionate decline compared to sales, the gross margin decreased from 18.2 percent (Q4 2024) to 15.9 percent (Q1 2025).
Operating expenses for selling, general administration, research and development increased slightly by EUR 1.5 million compared to the previous quarter. FX effects reported in the balance of other operating income and expenses amounted to EUR -2.5 million compared to EUR -0.4 million in Q4 2024.
As a result, EBITDA for Q1 2025 was EUR 78.3 million, below the level of the previous quarter (Q4 2024: EUR 93.0 million). The EBITDA margin decreased from 25.8 percent to 22.6 percent.
These effects were also reflected in the development of EBIT, which decreased from EUR 27.4 million in Q4 2024 to EUR 14.9 million in Q1 2025.
Income tax expense decreased significantly to EUR 3.2 million (Q4 2024: EUR 20.6 million), but the tax rate remained at an elevated level (Q1 2025: 43 percent, Q4 2024: 109 percent).
The result for the period was EUR 4.3 million compared to EUR -1.6 million in Q4 2024. Of this amount, EUR 2.4 million is attributable to Siltronic AG shareholders, with earnings per share of EUR 0.08 (Q4 2024: EUR -0.08).
With equity of EUR 2,179.2 million on March 31, 2025 and an equity ratio of 43.8 percent (December 31, 2024: 43.6 percent) Siltronic continues to have a good balance sheet quality.
The decrease in trade payables mainly related to investments that were already accounted for in 2024 and were due for payment in Q1 2025.
The reduction in cash flow from operating activities compared to the previous quarter is mainly due to the already described EBITDA decline and based on working capital effects related to the reporting date.
In the quarter under review, Siltronic made net payments for capital expenditure including intangible assets of EUR 139.1 million. As expected, payments for capex including intangible assets significantly exceeded additions to the statement of financial position (Q1 2025: EUR 96.5 million). The payments and additions mainly related to the new fab in Singapore.
As a result, both free cash flow at EUR -81.8 million (Q4 2024: EUR 1.1 million) and net cash flow at EUR -74.2 million (Q4 2024: EUR 20.7 million) were negative in Q1 2025. Consequently, net financial debt increased from EUR 733.5 million at the end of 2024 to EUR 819.1 million as of March 31, 2025.
Siltronic is convinced of a significantly increasing medium- and long-term demand for silicon wafers driven by megatrends and is ready to participate in this growth. However, 2025 will continue to be characterized by elevated inventory levels at customers and the associated volume shifts.
The company now expects H1 2025 to be in the mid to high single-digit percentage range below H2 2024. Overall, the sales guidance for the full year 2025 remains unchanged, although it is not yet possible to estimate the impact of American tariff policies and the corresponding countermeasures on expected end-market growth and FX rates for the remainder of the year (assumption for guidance: EUR/USD 1.08).
Additionally, Siltronic AG refines its guidance for the EBITDA margin due to expected negative price effects outside of long-term agreements and adverse product mix developments to 21 to 25 percent. Expectations for the development of capex including intangible assets, depreciation, EBIT, and net cash flow for 2025 remain unchanged.
Original – Siltronic
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NOVOSENSE Microelectronics will present its latest portfolio of automotive and industrial solutions at PCIM Europe 2025, taking place from May 6 to 8 in Nuremberg, Germany. NOVOSENSE will present new product introductions and live demonstrations that address key challenges in modern automotive design, including system integration, power efficiency, functional safety, and electromagnetic compatibility.
As vehicles become increasingly electrified and software-defined, engineers face mounting demands for compact, efficient, and intelligent components that can operate reliably under harsh conditions. NOVOSENSE’s growing portfolio of automotive-grade ICs reflects this shift, with a focus on sensing, isolation, and drive capabilities tailored to emerging system architectures.
Among the highlights at PCIM 2025 is the European debut of the NSDA6934-Q1, a Class D audio amplifier designed for next-generation in-vehicle infotainment. With ultra-low EMI, integrated diagnostics, and robust thermal performance, this device is engineered to meet the high-fidelity and low-noise requirements of premium audio systems. A live demonstration using amplifier boards and speakers will allow visitors to hear its performance first-hand.
Also on display will be the NSLxxxxx series of linear LED drivers, designed for automotive lighting applications. As vehicle lighting evolves to support both functional and aesthetic roles, these drivers offer efficient, low-noise operation with flexible current regulation. Supporting applications from headlamps to ambient lighting strips, the series meets stringent thermal and electrical performance standards required in automotive environments.
Moving inside the vehicle for improved interior lighting control, the NSUC1500-Q1 ambient lighting driver SoC integrates LIN communication, MCU, and driver functionality into a single chip. It enables dynamic lighting sequences and personalization features. The ability to streamline system architecture while enabling programmability and diagnostics makes it particularly attractive for OEMs focused on space savings and system complexity reduction.
The NSE34/35xxx series of high-side switches optimized for power distribution units and smart fuse applications, integrating protection features such as over-temperature, over-current, and open-load detection. In addition, the NSHT30-Q1 temperature and humidity sensor offers accurate measurements with fast response times and high reliability, supporting climate control systems and in-cabin monitoring functions for improved occupant comfort and safety.
The NOVOSENSE booth will also feature a suite of products for New Energy Vehicle (NEV) applications such as battery management systems (BMS), on-board chargers (OBC), DC-DC converters, and traction inverters. A major highlight will be the new third-generation automotive grade NSI83xx series of digital isolators, which address signal integrity and safety requirements with industry-leading EMI performance, high CMTI, low power consumption, and multiple channel options.
Rounding out the NEV range of products are the NSM201x-P current sensors, delivering precise current measurement for electric vehicle platforms, and the NSI67x0 series of isolated gate drivers, designed to support IGBT and SiC-based power stages in traction inverters and motor control.
PCIM Europe stands as the foremost international exhibition and conference encompassing power electronics, intelligent motion, renewable energy, and energy management. Since its inception in 1979, the event has served as the convergence point for industry specialists and academics, unveiling cutting-edge trends and innovations. This event effectively showcases the complete value chain, spanning from components, drive control, and packaging to the ultimate intelligent system solutions.
Visit NOVOSENSE at PCIM 2025 (Hall 4A, Booth 119) to see all of the above products and more in person.
Original – NOVOSENSE Microelectronics
