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SemiQ has opened its newest office in Taiwan. This strategic move underscores SemiQ’s commitment to providing enhanced ground support to its valued customers in the region while further solidifying its presence in the Asia-Pacific market.
As a Product Engineering and Global Sourcing Center, the new office, located near the Taiwan High Speed Rail Hsinchu Station, will serve as a vital hub, facilitating seamless interfacing with key stakeholders including Hsinchu Foundry, Miaoli Test Facility, Far East OSATs, and Taiwan Sales Office.
“Expanding our presence in Taiwan represents a significant milestone for SemiQ as we continue to strengthen our global operations and better serve our customers,” said Michael Tsang, VP, Product Engineering and Operations at SemiQ. “The opening of this office underscores our dedication to providing unparalleled support and resources to our customer base in the region.”
Mr. Tsang, a seasoned professional with extensive experience in semiconductor industry dynamics, will lead the Taiwan office. His expertise will be instrumental in managing demand, fostering partnerships, and ensuring the highest level of service delivery to SemiQ’s customers.
The strategic location of the new office near key industry players and transportation hubs will enhance SemiQ’s ability to collaborate effectively with its partners, streamline operations and expedite response times to customer needs.
“We are excited about the opportunities that the Taiwan office brings in terms of strengthening relationships with our partners and better understanding the evolving needs of the market,” added Mr. Tsang. “This expansion aligns with our vision of driving innovation and delivering value-added solutions to our customers.”
Establishing the Taiwan office complements SemiQ’s existing wafer processing facilities in the region. It underscores its commitment to providing superior SiC solutions for ultra-efficient, high-performance, and high-voltage applications.
Original – SemiQ
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Microchip Technology Incorporated announced that its Board of Directors has appointed Rich Simoncic as Chief Operating Officer. In this position, Mr. Simoncic will report to Ganesh Moorthy, who will remain President and CEO.
Rich Simoncic joined Microchip as a new college graduate in 1989 and has had progressively increasing product development, operational and business unit responsibilities. He founded the analog business at Microchip in 1998 and has been instrumental in building it to a more than $2 billion annual revenue business through a combination of organic efforts as well as acquisitions.
He was promoted to Vice President in 1995, Corporate Vice President in 2001, Senior Vice President in 2019 and Executive Vice President in 2023. He holds a Bachelor’s degree in Electrical Engineering Technology from DeVry Institute of Technology.
“Rich has expanded his role over the last few years, beyond leading our analog businesses, by assisting me with several corporate initiatives, including strategic planning, acquisitions, total system solutions, market megatrends, use of artificial intelligence within Microchip and Investor Relations activities. Going forward, Rich and I will jointly manage the worldwide Microchip enterprise so that we can apply our combined leadership capacity to engage the opportunities and challenges ahead of us,” said Ganesh Moorthy, Microchip’s President and CEO.
Original – Microchip Technology
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According to the information on the official website of the China National Intellectual Property Administration (CNIPA) on April 2, 2024, the key claims 6, 9, 10, 13, 14, 17, 18 and 22-26 of the Chinese patent titled “Enhancement mode GaN HEMT device and method for fabricating the same” (Patent No. ZL201080015388.2) owned by Efficient Power Conversion Corp (“EPC”) have been maintained valid during an invalidation procedure (case number: 4W116775), which was requested by the petitioner Innoscience (Suzhou) Technology Co., Ltd. (“Innoscience”).
As compared with products using silicon-based devices, transistors and integrated circuits using GaN-based technology are superior in terms of higher efficiency, reduced weight and lower cost. The key claims which are held valid as mentioned above cover core technologies of the design and the manufacturing process of EPC’s proprietary enhancement-mode GaN-based power semiconductor devices. By virtue of multiple innovations including such technologies, EPC has successfully brought GaN-based power devices from laboratory to market.
In May 2023, EPC filed complaints before the US Federal Court and the US International Trade Commission (ITC), asserting that Innoscience (Zhuhai) Technology Co., Ltd. and its affiliate Innoscience infringed four patents of its foundational patent portfolio, which include the US counterpart of this Chinese patent ZL201080015388.2. As part of the responses to those complaints, Innoscience filed, in September 2023, a request to invalidate the EPC’s Chinese counterpart patent ZL201080015388.2 before the CNIPA.
Pursuant to the Chinese Patent Law, Innoscience may appeal this invalidation decision before the Beijing Intellectual Property Court within three months.
Original – Efficient Power Conversion
