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YES (Yield Engineering Systems) announced the appointment of Rezwan Lateef as Chief Executive Officer. Lateef previously served as President and has been a key driver of the company’s growth, global expansion, and product innovation in recent years.
The transition comes as the company surpasses a key revenue milestone and enters its next phase of scaling with top-tier semiconductor and AI computing customers. Rama Alapati, who has served as CEO since 2021, will move into a consulting role to support Lateef during the transition and ensure organizational continuity.
“Rama has played an instrumental role in elevating YES from a promising technology company into a recognized leader in Advanced Packaging,” said Rezwan Lateef. “His commitment and leadership have been central to our transformation. I am grateful for his partnership, and I am pleased that he will continue to support me during this transition.”
Under Lateef’s leadership, YES will focus on deepening relationships with industry leaders and advancing solutions for the rapidly growing AI and High-Performance Computing markets. Strategic priorities include accelerating new systems for next-generation packaging architectures and expanding the company’s portfolio to help customers meet escalating performance and throughput demands.
“We are very bullish and remain highly confident in the future of YES,” said Nety Krishna, Senior Managing Director, representing KCK, the company’s primary investor. “The company has invested heavily in product development and is well positioned at key customers in the rapidly expanding segment of Advanced Packaging. This leadership transition reflects our long-term commitment to supporting YES through its next stage of growth.”
“YES has an exceptional team, an expanding global footprint, and a clear technology roadmap aligned with the needs of our customers,” Lateef added. “I look forward to leading this next chapter as we continue to scale, innovate, and increase the value we deliver to the industry.”
Original – Yield Engineering Systems
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Yield Engineering Systems, Inc. (YES) announced that Michael Daly has joined the company as its Senior Vice President and General Manager of Wet Processing Systems.
Mr. Daly assumes overall responsibility for enhancing the market share and profitability of YES’s rapidly growing Wet Processing business unit and will manage its existing product lines as well as new product development. Mr. Daly has extensive experience in high-tech & wide band gap semiconductors, with executive-level assignments at Wolfspeed/Cree, Global Foundries, SunEdison Semiconductors, and National Semiconductor.
“Michael is a seasoned, operations-driven executive with tremendous experience in delivering cutting-edge technology in High-Volume Manufacturing Semiconductor environments and is a consummate professional delivering outstanding results,” said Rama Alapati, CEO of YES. “His immense understanding of customer needs and continuous improvement — combined with his impressive history of managing global operations, engineering, manufacturing, and product development for growth — will serve YES well as we continue to deliver the highest-value solutions for our key accounts and global customer base.”
Michael holds a Bachelor Of Science in Applied Chemistry from the University of Strathclyde in Glasgow, Scotland.
Original – Yield Engineering Systems
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Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor, life sciences, and “More-than-Moore” applications, had sold multiple Wet Processing Systems to a premier Silicon Carbide (SiC) materials manufacturer. The adoption of SiC Wide Band Gap (WBG) semiconductors continues to grow with demand driven by Electric Vehicle (EV) production and charging infrastructure, power supply systems, and Photovoltaic (PV) inverters.
The YES TersOnus™ wet solution continues to gain momentum in the SiC market. YES’ highly flexible and custom-configured systems have superior temperature uniformity complimented by ultra-low particle performance. These systems can address 150mm and 200mm Silicon Carbide processes without process downtime or line changes.
“Silicon carbide materials manufacturers are seeking technology partners that provide specific solutions to their roadmap challenges. TersOnus™ for post epitaxial & chemical mechanical polishing (CMP) wet cleaning addresses these specific needs by providing unparalleled process efficacy, automated handling capabilities, and adaptable system configurations with significant Cost of Ownership advantages. This multi-tool order validates YES’ efforts to serve our SiC customers and allow them to go to market quickly with proven HVM solutions.” said Dragan Cekic, VP of Strategic Sales for YES,
“YES has a rich history of providing highly automated, customer-configured wet processing technology. YES is excited about our involvement in the rapidly growing global market for SiC devices. This order confirms our solutions’ value proposition for the broader SiC ecosystem,” said Kevin Trompak, Vice President of Business Development for YES. “YES is committed to supporting the development of SiC solutions by investing in an Advanced Technology Center in Chandler, Arizona, which officially opened July 27th this year.”
Original – Yield Engineering Systems
