-
SemiQ Inc. will present its latest silicon carbide (SiC) power module developments at PCIM Europe 2026, including an expanded QSiC™ Dual3 MOSFET module family featuring new high-thermal-performance configurations with aluminum nitride (AlN) substrates and pre-applied thermal interface material (TIM).
The company will showcase its latest technologies at Alfatec’s booth (Hall 4A, Booth 110) during the exhibition, which takes place from June 9 to 11, 2026, at Messe Nürnberg in Nuremberg, Germany.
Designed to address the increasing power density and thermal management requirements of AI data centers, high-power industrial systems, solar photovoltaic installations, and electric vehicle applications, the expanded portfolio combines flexible module designs with high-efficiency silicon carbide technology.
Among the featured products will be SemiQ’s latest QSiC™ Gen3 SiC modules, which deliver a 30% reduction in both specific on-resistance (RONsp) and turn-off energy losses (EOFF) compared with previous generations. According to the company, these improvements help reduce cooling requirements and switching losses in applications such as EV charging infrastructure, energy storage systems, and industrial motor drives.
A key highlight of the exhibit will be the expanded QSiC Dual3 module family. These 1200 V half-bridge MOSFET modules are designed to support the development of high-efficiency, high-power-density power converters. The latest additions to the family incorporate aluminum nitride substrates and pre-applied thermal interface material to enhance thermal performance.
SemiQ will also display its S3 module family, which includes a 608 A half-bridge module featuring an ultra-low RDS(on) of 2.4 mΩ and a junction-to-case thermal resistance (RθJC) of only 0.07°C/W.
The company’s SOT-227 module lineup will also be featured, offering five module options with RDS(on) values of 7.4 mΩ, 14.5 mΩ, and 34 mΩ. These modules are targeted at applications including server power supplies, battery charging systems, and photovoltaic inverters.
In addition, visitors will be able to explore SemiQ’s B2T1 six-pack module family, which offers RDS(on) values ranging from 19.5 mΩ to 82 mΩ. These modules are designed to minimize parasitic effects in motor drive systems and advanced AC-DC converter applications.
The company will also present its B3 full-bridge modules, which provide current ratings of up to 120 A and RDS(on) values as low as 8.6 mΩ. These products are intended to maximize power density in high-voltage DC-DC conversion systems.
“These SiC technologies directly address the challenges faced by those implementing AI infrastructure,” said Dr. Timothy Han, President of SemiQ. “By improving efficiency and addressing the escalating power demands of datacenters across key application areas, we are expanding the potential for AI to scale sustainably.”
SemiQ’s PCIM 2026 exhibit will focus on demonstrating how its latest silicon carbide module technologies support higher efficiency, improved thermal management, and increased power density across a range of demanding applications, including AI infrastructure, renewable energy systems, industrial automation, and electric mobility.
Visitors can view the company’s latest products and speak with technical representatives at Booth 110 in Hall 4A throughout the exhibition.
Original – SemiQ
-
Wise Integration will present its latest WiseWare®-powered AC-DC demonstration platforms at PCIM Europe 2026, taking place from June 9 to 11 in Nuremberg, Germany. The company will use the event to highlight its roadmap toward distributed digital control through the next generation of its WiseGan® Digital First power integrated circuits.
As a developer of digital control technologies for wide-bandgap and gallium nitride (GaN)-based power supplies, Wise Integration is positioning digital control at the center of next-generation power conversion architectures. The company believes this approach can help address the growing demand for higher switching frequencies, increased power density, and improved efficiency across applications such as AI infrastructure, electrification, edge computing, and space systems.
The increasing power requirements of AI data centers, electrified systems, edge computing platforms, and aerospace applications are creating new challenges for power conversion. While wide-bandgap technologies such as GaN and silicon carbide (SiC) have significantly improved switching performance, traditional analog control methods are becoming increasingly limited in their ability to fully translate device-level advancements into overall system-level benefits.
Wise Integration’s WiseWare® platform combines advanced digital control algorithms with GaN and SiC power stages to enable more precise converter operation. The technology is designed to optimize switching timing, support higher-frequency operation, and improve the management of efficiency, thermal performance, and passive component size.
“By leveraging standard microcontroller hardware to manage distributed digital control, we are removing the complexity that has historically limited scalability in premium applications,” said Ghislain Kaiser, CEO of Wise Integration. “This evolution allows us to deliver a unified, intelligent power solution specifically tailored for the rigorous demands of data centers, servers, electric vehicles, and edge AI.”
At PCIM 2026, the company will demonstrate several WiseWare®-controlled AC-DC power conversion platforms, including compact 240 W and 300 W designs, as well as higher-power 1 kW and 7 kW architectures. The demonstration boards showcase the scalability of the technology across a variety of power levels and converter topologies, including totem-pole power factor correction (PFC), LLC converters, single-stage architectures, and interleaved converter designs.
Building on these platforms, Wise Integration is advancing its digital control strategy through a more distributed power conversion architecture. The company will introduce its new WI73xxx generation at PCIM, representing a significant step toward the evolution of WiseGan® into a Digital First power IC platform.
The next generation of WiseGan® devices is designed to place more intelligence directly alongside the power switch, moving critical control functions such as protection, timing management, dead-time optimization, and zero-voltage switching control closer to the GaN power stage. According to the company, this approach enables faster response times, more accurate switching behavior, and improved overall efficiency and reliability.
Wise Integration also highlighted the upcoming WiseWare 2 platform, which introduces a new capability aimed at virtualizing the PFC stage. According to Ridha Hamza, Vice President of Sales, this functionality is expected to enable power density levels that significantly exceed those currently available in the market.
“By transitioning our distributed digital control strategy entirely onto MCU hardware within the new WiseGan generation, we are embedding critical intelligence directly into the power stage,” said Hamza. “This approach not only streamlines the design process for our customers but also unlocks unprecedented performance for high-end applications like AI servers and next-generation 800 V DC architectures, proving that the future of power conversion is not just about better components, but about smarter, fully integrated digital control.”
Together, WiseWare® and WiseGan® provide an integrated platform designed to help engineers reduce passive component size, lower bill-of-materials costs, improve protection response times, and achieve higher-performance power conversion. WiseWare® delivers software-defined intelligence at the controller level, while WiseGan® progressively integrates digital functionality directly into the power stage, enabling closer coordination between power devices and control systems.
The company stated that this roadmap supports its broader vision of distributed digital control in power electronics and is intended to enable a new generation of compact, efficient, and scalable power conversion solutions for AI infrastructure, electrification, premium consumer electronics, edge computing, space applications, and other high-performance markets.
Visitors to PCIM Europe 2026 will be able to view live demonstrations of the company’s latest technologies at Booth 243 in Hall 6.
Original – Wise Integration
-
Alpha and Omega Semiconductor Limited announced that it will showcase its latest power management technologies at PCIM Expo 2026, addressing the growing power demands of AI computing, AI data centers and industrial applications.
Visitors to the AOS booth will have the opportunity to explore a range of new products designed to help engineers address increasingly complex power management challenges. The company’s latest solutions focus on maximizing system performance, improving efficiency, optimizing board space utilization and supporting evolving AI power-delivery requirements.
Among the key technologies on display will be solutions targeting AI core power, AI data center infrastructure and industrial power applications.
For AI Core Power and High-Performance Computing
AOS will present several recently introduced power management solutions developed for AI computing platforms, graphics processing units (GPUs), system-on-chip (SoC) applications and next-generation notebook computers.
Featured products include the AOZ73216QI and AOZ73104QI controllers, designed to support high-performance GPUs and SoCs deployed in AI data center environments.
The company will also highlight its latest USB Type-C Extended Power Range (EPR) 3.1 protection switches, developed to enable safe and reliable power delivery of up to 240W in next-generation USB Type-C applications. The AOZ13058DI provides overvoltage and overcurrent protection for 48V Type-C sink applications, while the AOZ15953DI delivers additional protection functions required for Type-C source applications.
For AI Data Centers
AOS continues to expand its AI data center power portfolio with a range of MOSFET, αSiC and GaN-based solutions designed to support both existing 48V/54V architectures and emerging 800V DC power distribution systems.
The company’s latest devices are designed for high-density DC-DC and AC-DC conversion, offering enhanced thermal performance, reduced switching losses and compact power solutions optimized for AI servers and accelerators.
Highlighted technologies include double-sided cooling MOSFETs, third-generation αSiC devices for high-voltage power conversion, GaN FETs supporting high-frequency and high-density power delivery, and hot-swap solutions engineered to improve system reliability and efficiency in demanding AI infrastructure environments.
For Industrial Power Applications
AOS will also showcase its brushless DC (BLDC) motor solution portfolio, which includes advanced MOSFETs, motor driver ICs and dual-core motor control microcontrollers (MCUs) for applications ranging from power tools and outdoor equipment to e-mobility systems.
The portfolio features low-loss MOSFETs combined with GTPAK™ topside-cooling technology to enhance thermal and electrical performance. Integrated 3-phase and half-bridge motor driver ICs help simplify system design while providing enhanced protection features.
Complementing these products are highly integrated dual-core MCU solutions that support both sensor-less and sensored motor control. These devices incorporate advanced field-oriented control (FOC) and pulse-width modulation (PWM) capabilities to enable efficient operation in high-performance motor drive applications.
AOS will exhibit its latest technologies at PCIM Expo 2026, taking place from June 9 to June 11, 2026, at the Nuremberg Exhibition Centre in Nuremberg, Germany. Visitors can meet the company at Booth #9-539.
Original – Alpha and Omega Semiconductor
-
Magnachip Semiconductor Corporation announced that it will present its medium-voltage (MV) MOSFET portfolio for AI servers and data center power systems at PCIM Europe 2026 in Nuremberg, Germany.
The company will highlight MOSFET solutions designed for server power supply units (PSUs), high-performance computing (HPC), industrial power systems, and solar inverters. These products target the growing need for higher power efficiency, increased power density, and improved thermal management in AI-driven infrastructure.
Magnachip’s MV MOSFET family is based on advanced Shielded-Gate Trench (SGT) technology, supporting improved current density and switching performance while enabling compact, high-temperature power designs. The devices are intended for critical power conversion stages such as synchronous rectification in AI server and HPC power architectures.
In addition to MV MOSFETs, Magnachip will showcase its broader power semiconductor portfolio, including low-voltage MOSFETs, super-junction MOSFETs, IGBTs, silicon carbide devices, and power ICs supporting applications across automotive, industrial automation, energy storage, and renewable energy systems.
Original – Magnachip Semiconductor
-
ROHM Co., Ltd. announced its participation in PCIM Expo & Conference 2026, where the company will present its latest power semiconductor technologies aimed at improving efficiency, power density, and system miniaturization across automotive, industrial, and infrastructure applications.
At booth 318 in Hall 9, ROHM will highlight a broad portfolio of silicon carbide and gallium nitride technologies designed to address increasing power requirements in electrification and AI-driven applications.
The company’s automotive demonstrations will focus on electrified powertrain technologies, including traction inverters, onboard chargers, battery disconnect systems, thermal management solutions, and embedded technologies supporting next-generation vehicle architectures.
For industrial and infrastructure applications, ROHM will showcase SiC- and GaN-based solutions targeting renewable energy systems, AI servers, data centers, and industrial power supplies. These applications continue to drive demand for higher efficiency and improved thermal performance as power requirements increase.
ROHM will also present application-oriented power modules and discrete device portfolios developed through global partnerships, demonstrating practical implementations of advanced power conversion topologies.
Original – ROHM
-
Infineon Technologies AG will showcase its broad semiconductor portfolio at PCIM Europe 2026, emphasizing future power infrastructure, AI data centers, robotics, and electromobility. The company’s demonstrations span silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies, reinforced by software, design tools, and cybersecurity capabilities.
A major focus area is future-proof power infrastructure. As AI data centers and electrified industries increase power demand, Infineon is highlighting technologies for battery energy storage systems, uninterruptible power supplies (UPS), solid-state transformers (SSTs), and solid-state circuit breakers (SSCBs). Notably, its CoolSiC™ JFET-based SSCB solutions are designed to provide microsecond-level fault isolation for next-generation DC grids.
For AI data centers, Infineon is presenting a “grid-to-core” approach that covers the complete power delivery chain. Solutions include semiconductor devices, gate drivers, microcontrollers, and sensors supporting high-voltage DC architectures, intermediate bus converters, voltage regulators, battery backup units, and intelligent protection systems. This reflects the industry’s ongoing shift toward HVDC sidecars and DC microgrid architectures required by rapidly increasing AI workloads.
In electromobility, Infineon is showcasing integrated system-level solutions for traction inverters, on-board chargers, DC-DC converters, and battery management systems. Its “One Inverter, One Infineon” concept combines multiple semiconductor technologies to optimize drivetrain efficiency, reduce system complexity, and improve space utilization. Demonstrations also include CoolSiC™, CoolGaN™, EasyPACK™ S modules, CIPOS™ Prime solutions, XENSIV™ sensors, and AURIX™ TC4xx microcontrollers.
The company is also targeting the fast-growing robotics market, demonstrating high-efficiency motor control and power management systems for industrial robots, drones, and emerging humanoid platforms. These solutions leverage CoolGaN power semiconductors, PSOC™ Control C3 microcontrollers, and XENSIV sensors to deliver compact and highly responsive control architectures.
Beyond semiconductor hardware, Infineon is emphasizing security and regulatory readiness through support for the upcoming EU Cyber Resilience Act. The company is positioning secured-by-design semiconductor solutions as a key differentiator for customers facing increasing cybersecurity and compliance requirements.
Original – Infineon Technologies
-
LATEST NEWSVishay to Showcase Power Semiconductor and Passive Solutions for Electrification at PCIM Europe 2026
May 20, 2026
2 Min ReadVishay Intertechnology will present its latest passive components, semiconductors, and reference designs at PCIM Europe 2026, focusing on technologies that support electrification, energy efficiency, and decarbonization across automotive, industrial, renewable energy, and data center applications.
The company’s exhibit will highlight a broad range of passive solutions, including advanced power resistors, shunts, capacitors, magnetics, and inductors designed to improve power density, thermal performance, and system reliability. These products target applications such as EVs, renewable energy systems, industrial drives, and AI data center power supplies.
On the semiconductor side, Vishay will showcase silicon carbide (SiC) MOSFET-based power modules and reference designs aimed at high-voltage power conversion systems for e-mobility and energy infrastructure. The company will also feature optoelectronic components, sensors, and system-level design solutions intended to accelerate development cycles and optimize system efficiency.
In addition, Vishay plans to demonstrate compact haptic feedback technologies and control software designed for rapid implementation of advanced user interface experiences.
A key highlight at the event will be a presentation on future DC-coupled EV charging architectures, focusing on efficient photovoltaic-to-EV energy transfer without the limitations associated with traditional AC coupling.
From a market perspective, Vishay’s portfolio strategy reflects increasing convergence between passive and active power technologies as system designers pursue higher efficiency and greater integration. The company is positioning itself as a broad solutions provider supporting key growth areas including electrified transportation, renewable energy, industrial automation, and AI-driven infrastructure.
Original – Vishay Intertechnology
-
Navitas Semiconductor will present its latest GaNFast™ and GeneSiC™ technologies at PCIM 2026, highlighting solutions for AI data centers, solid-state transformers (SSTs), industrial electrification, and next-generation power infrastructure.
The company’s showcase includes expanded GaN product offerings ranging from ultra-low 0.8 mΩ 100 V devices to 650 V solutions at 11 mΩ, alongside new GaNSafe™, GaNSlim™, and bidirectional GaN IC platforms. On the SiC side, Navitas is featuring 3300 V, 2300 V, and 1200 V Trench-Assisted Planar (TAP) SiC devices, including advanced SiCPAK™ press-fit modules and recently introduced 5th-generation GeneSiC MOSFETs in QDPAK and low-profile TO-247 packages.
A major focus is AI data center power architecture, particularly the transition toward 800 VDC distribution. Navitas will demonstrate a 20 kW 800 V-to-6 V power delivery board targeting 97.5% peak efficiency by eliminating the traditional 48 V intermediate bus converter stage. The company will also showcase a 10 kW 800 V-to-50 V DC-DC platform delivering 98.5% efficiency and 2.1 kW/in³ power density using its latest GaNFast devices.
For grid and energy infrastructure applications, Navitas will present multiple solid-state transformer solutions utilizing ultra-high-voltage SiC technology. These include an EPFL-developed SST cell based on 3300 V and 1200 V SiC devices and a 50 kVA bidirectional SST platform built with SiCPAK modules and Texas Instruments control technology.
In industrial electrification, the company is demonstrating GaNSense™ motor drive ICs with integrated sensing and protection functions, as well as GaNSlim™ power ICs designed to simplify high-efficiency power conversion in performance computing systems.
Original – Navitas Semiconductor
-
Efficient Power Conversion will showcase its latest Gen 7 gallium nitride (GaN) power technologies at PCIM Europe 2026, focusing on humanoid robotics, drone propulsion, compact motion systems, and AI power delivery applications.
The company’s demonstrations center on how high-frequency GaN devices enable smaller, lighter, and more efficient motion-control and power-conversion architectures. EPC’s latest integrated ePower Stage ICs, including the EPC33110 and EPC2310x families, target compact three-phase motor drives for humanoid joints, robotic arms, and drone propulsion systems. These devices support operation up to 100 V with current capability up to 35 A, delivering high switching frequency and improved power density for intelligent motion systems.
EPC will also highlight multiple low-voltage GaN FETs optimized for AI infrastructure and high-density DC-DC conversion, including:
- EPC2366 (40 V, 0.84 mΩ) for synchronous rectification,
- EPC2361 (100 V, 0.75 mΩ),
- EPC2304 and EPC2305 for isolated DC-DC conversion,
- New Gen 7 devices such as EPC2370, EPC2377, EPC2378, and EPC2375 in compact dual-cooled QFN packages.
The company will demonstrate these components across several reference platforms, including:
- Three-phase inverter boards for robotic and drone propulsion,
- High-density isolated converters for AI servers,
- Totem-pole PFC stages,
- Intermediate bus converters and synchronous buck architectures.
A major strategic theme is EPC’s positioning of low-voltage GaN as a core enabling technology for both intelligent motion systems and AI computing infrastructure. The company emphasizes that higher switching frequencies allow reductions in passive component size, system weight, and thermal complexity while improving transient response and overall efficiency.
Beyond robotics and drones, EPC will showcase how the same GaN platform supports compact electrified systems such as e-bikes and power tools, while also scaling into multi-kilowatt AI server power architectures.
Original – Efficient Power Conversion
-
Magnachip Semiconductor Corporation will present its latest power semiconductor innovations at PCIM Europe 2026 (Hall 6, Booth 337, June 9–11 in Nuremberg), highlighting its strategic expansion beyond consumer electronics into automotive, industrial, and energy applications.
At the event, Magnachip will showcase a broad portfolio including MOSFETs, IGBTs, and Power ICs, with a strong focus on motor control and power conversion solutions. The company is positioning its technologies to address growing demand across electric vehicles, industrial automation, robotics, and AI-driven infrastructure.
A key theme of the exhibition is Magnachip’s transition from its established strength in consumer electronics—where it has long supplied major global brands—toward higher-value industrial and automotive markets. This includes IGBT and module solutions for high-power applications such as solar inverters, energy storage systems (ESS), and AI servers, supported by advanced packaging technologies for improved power density and thermal performance.
The company will also emphasize its growing capabilities in motor control, including solutions for EV traction inverters and industrial drives. Collaboration with Hyundai Mobis is highlighted as a strategic step to strengthen its position in electrified mobility and inverter technologies.
From a market perspective, Magnachip’s presence at PCIM reflects a broader strategic pivot toward higher-growth, higher-margin segments within the power semiconductor industry. As demand accelerates in electrification, automation, and AI infrastructure, suppliers are increasingly diversifying beyond traditional consumer markets to capture new opportunities in industrial and automotive power systems.
With over 55 new products launched in 2025 and more than 40 additional releases planned for 2026, Magnachip is signaling an aggressive roadmap to enhance its competitiveness in the evolving power semiconductor landscape.
Original – Magnachip Semiconductor
