Axcelis Technologies has announced the successful completion of a customer evaluation of its Purion XEmax high-energy ion implanter at a leading semiconductor foundry. The system has been qualified for the production of Power Management Integrated Circuits (PMICs), supporting the development of next-generation power management devices.
The qualification reflects increasing demand for higher-energy ion implantation processes used in advanced PMIC manufacturing. According to Axcelis, the Purion XEmax is capable of delivering ion implantation energies of up to 15 MeV through its dual RF linear accelerator (LINAC) architecture and patented Boost Technology.
PMICs integrate multiple power management functions—including voltage regulation, battery charging, and thermal management—onto a single chip. They are widely used in applications ranging from consumer electronics to electric vehicles and industrial systems, where efficient power conversion and management are critical.
The Purion XEmax is part of Axcelis’ Purion XE family of high-energy ion implanters, which are designed for advanced semiconductor manufacturing. The product line includes systems optimized for standard high-energy implantation, higher-throughput production, high-volume manufacturing, power semiconductor devices, and ultra-high-energy applications.
According to the company, the Purion XE platform combines RF LINAC technology with high-energy capability, broad process flexibility, and contamination control to support advanced semiconductor fabrication.
Key features of the Purion XEmax include:
- High-energy ion implantation up to 15 MeV
- Dual RF linear accelerator (LINAC) architecture
- Patented Boost Technology
- Optimized for advanced PMIC manufacturing
- Designed for next-generation semiconductor devices requiring ultra-high-energy implantation
Original – Axcelis Technologies