Dynex Semiconductor will present new research from its R&D team at the International Conference on Integrated Power Electronics Systems (CIPS) 2026 in Dresden, Germany, highlighting advances in power module reliability, packaging technology, and predictive health monitoring for high-power electronic systems.
Two Dynex researchers will present technical papers addressing challenges that are increasingly important for next-generation applications in renewable energy, transportation, and industrial power systems.
Research presented by Dynex focuses on improving power module reliability through innovative interconnection technologies. The study investigates alternatives to conventional aluminium wire bond interconnections, which are widely used in power modules but can suffer from thermo-mechanical fatigue during repeated power cycling.
The work explores clip-based die-top interconnections made from copper and copper-molybdenum-copper materials with a low coefficient of thermal expansion. These materials help reduce thermal stress and improve current distribution across the semiconductor device.
Testing results showed significant improvements in reliability. The copper-molybdenum-copper clip approach achieved up to 10.9× longer power cycling lifetime compared with traditional wire bonding using SAC305 solder, and up to 15.4× improvement when combined with high-temperature lead-free die-attach solder.
Researchers also addressed a common challenge in power module packaging: improving die-top interconnection reliability can increase stress in the die-attach layer beneath the device. By combining the copper-molybdenum-copper clip interconnection with high-temperature lead-free solder for die attachment, the team was able to manage both reliability mechanisms effectively.
Detailed failure analysis using scanning acoustic microscopy, scanning electron microscopy, and optical microscopy confirmed stable electrical performance with minimal degradation of device characteristics during testing. The work represents more than four years of research and development and has resulted in a patent filing.
Dynex also presented developments in predictive health monitoring for power electronics. Using an online failure precursor data acquisition system, the proposed prognostic model can support predictive maintenance strategies, early failure warnings, remaining useful lifetime prediction, and monitoring of IGBT health degradation.
According to Dynex, these technologies represent an important step toward more resilient and reliable power electronic systems supporting renewable energy and other advanced electrification applications.
Original – Dynex Semiconductor