ROHM has launched the new DOT-247 package — a 2-in-1 SiC molded power module designed to meet the evolving demands of industrial applications such as photovoltaic (PV) inverters, uninterruptible power supplies (UPS), and semiconductor relays. Available in two topologies, half-bridge and common-source (SCZ40xxDTx, SCZ40xxKTx), the DOT-247 retains the versatility of the popular TO-247 package while offering significantly enhanced power density and design flexibility.
By combining two TO-247 packages into a single molded module, the DOT-247 accommodates larger SiC chips that were previously difficult to integrate. This structure reduces on-resistance and achieves improved thermal and electrical performance. Compared to a conventional TO-247 package, the DOT-247 lowers thermal resistance by approximately 15% and inductance by about 50%. In half-bridge configurations, this translates to 2.3 times higher power density, enabling the same power output in roughly half the volume.
The DOT-247 package is well-suited for advanced multi-level circuit topologies that are becoming more common in high-voltage PV systems, including three-level NPC, three-level T-NPC, and five-level ANPC architectures. These designs often require both half-bridge and common-source topologies, which can necessitate custom solutions when using traditional discrete SiC devices.
ROHM addresses this need by offering both topologies in standardized 2-in-1 modules, simplifying system design and integration. These modules allow engineers to reduce component count, shrink mounting area, and streamline the development of complex converter systems such as NPC circuits and DC-DC converters.
The DOT-247 SiC modules provide a compact, scalable path toward higher efficiency and miniaturization in next-generation industrial power applications.
Original – ROHM