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Navitas Semiconductor announced the 2023 Investor Day, to be held at the company’s new headquarters, on Tuesday 12th December, 2023.
Meeting highlights include:
- Four major new GaN/SiC technology platforms and five focus markets, including new GaNSafe technology, positioned to revolutionize AI-based data centers, EV, and renewable applications.
- Invited customer presentations, with leading-edge applications enabled by Navitas.
- $1B+ customer pipeline & what this means to Navitas growth trajectory, with a preview of 2024 forecast and long-term targets.
- Navitas’ unique, detailed view on the past, present and future of power electronics as we look to “Electrify Our World” (guided tour, and management small-group meetings).
For in-person attendance or participation virtually via live-stream, please contact ir@navitassemi.com
Original – Navitas Semiconductor
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Infineon Technologies AG has taken over as head and coordinator of the broad-scope European research project EECONE (European ECOsystem for greeN Electronics), intended to make electronics in Europe more sustainable. The objective is to investigate the corresponding technologies along the entire value chain, from design, manufacture and use all the way to recycling. EECONE is one of the Key Digital Technologies research projects supported by the European Union as a Joint Undertaking. 49 partners are participating in the project, which has a volume of approximately 35 million euros total costs. The project is being funded by the European Union and the national governments of the participating companies with around 20 million euros.
“Electronics are fundamental to improving the sustainability of many applications. But this is not sufficient, electronics themselves have to become greener,” says Constanze Hufenbecher, Infineon Management Board member and Chief Digital Transformation Officer. “Infineon is pleased to take on the lead role in the research project EECONE in order to advance the circular economy together with our partners along the value chain. The only way to achieve sustainability from design and use and all the way to recycling is by working together.”
EECONE is aligned with the 6R concept (Reduce, Reliability, Repair, Reuse, Refurbish, Recycle); the amount of materials required by electronics is to be reduced, electronics are to be made more reliable, easier to fix and use again, and easier to recondition and to recycle. The project will investigate a total of ten application examples from the widest possible variety of fields in terms of developing green electronics. The applications are from the areas Automotive, Consumer Electronics, Health, Information and Communication Technologies, Aviation and Agriculture.
Focus points are for example reducing the amount of material used by making circuit boards thinner or smaller, or improving sustainability by introducing materials which are easier to separate during recycling. Facilitating the replacement of not only circuit boards but also of semiconductors is to make it easier to repair devices. The technologies involved could also make it possible to reuse and recycle electronic components. The project will in addition develop technologies which for example generate and store their own power in IoT devices.
New, ecologically friendly materials are to make it easier to recycle lithium-ion batteries. Artificial Intelligence will be used to prolong the service lives of electronic equipment, while tools for more sustainable electronic design, including comprehensive impact assessments for the use of electronics, are to be developed as well. EECONE also covers the use, dissemination and standardization of electronics and will train specialists in handling electronic refuse.
The EECONE research project has a planned duration of three years. It will establish decisive foundations for the sustainable development, manufacturing and use of electronics in Europe. The on-site inaugural event of the project will be held in Toulouse on 20 and 21 September 2023.
The 49 EECONE Research Project Partners
- 4Mod Technology (FR)
- Acorde Technologies Sag (ES)
- Agencia Estatal Consejo superior de Investigaciones cientificas (ES)
- Aniah SAS (FR)
- Arcelik A.S. (TR)
- Atea Sverige AG (SE)
- AT&S – Austria Technologie & Systemtechnik (AT)
- Centre national de la Recherche scientifique (FR)
- Charokopeio Panepstimio (EL)
- Commissariat a l’Energie atomique et aux Energies alternatives (FR)
- Dassault Systemes (FR)
- Design and Reuse (FR)
- EcoDC AG (SE)
- Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V. (DE)
- Get electronique (FR)
- Infineon Technologies AG (DE)
- Institut mikroelektronickych Aplikaci SRO (CZ)
- Institut polytechnique de Grenoble (FR)
- Interactive fully electrical Vehicles SRL (IT)
- Interuniversitair Microelectronica Centrum (BE)
- Leonardo – Societa per Azioni (IT)
- Luna Geber Engineering SRL (IT)
- Melsen Tech A/S (DK)
- Nerosubianco SRL (IT)
- Orbotech Ltd. (IL)
- Ozyegin Universitesi (TR)
- Premo, S.L. (ES)
- Research Institutes of Sweden AB (SE)
- Robert Bosch GmbH (DE)
- Siec Badawcza Lukasiewecz – Instytut Mikroelektronik i Fotoniki (PL)
- Silicon Austria Labs GmbH (AT)
- Smartsol SIA (LV)
- Soitec SA (FR)
- STMicroelectronics SAS (FR)
- Synano BV (NL)
- Technicka Univerzita v Liberci (CZ)
- Technische Hochschule Deggendorf (DE)
- Tecnologias Servicios telematicos y Sistemas SA (ES)
- Teknologisk Institut (DK)
- Tetradis (FR)
- Thales dis France SAS (FR)
- Università degli Studi di Perugia (IT)
- Université catholique de Louvain (BE)
- Université Grenoble Alpes (FR)
- Ustav teorie informace a Automatzizace AV CR VVI (CZ)
- Vitesco Technologies France (FR)
- Weeecycling (FR)
Associated Partners
- Centre Suisse d’Electronique et de Microtechnique SA – Recherche et Developpement (CH)
- Swiss Vault Systems GmbH (CH)
Original – Infineon Technologies
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The U.S. Department of Defense (DoD) has awarded GlobalFoundries (GF) a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.
With an initial award of $17.3 million this month and an overall 10-year spending ceiling of $3.1 billion, the new contract provides the DoD and its contractors with access to GF’s semiconductor technologies manufactured at its U.S. facilities. These GF facilities are DoD-accredited to the highest security level, Trusted Supplier Category 1A, which implements proven stringent security measures to protect sensitive information and manufacture chips with the highest levels of integrity to ensure they are uncompromised.
In addition to secure chip manufacturing for DoD systems used on land, air, sea, and in space, the new contract provides the DoD and its contractors with access to GF’s robust design ecosystem, IP libraries, early-access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing. The contract was awarded through the DoD’s Defense Microelectronics Activity (DMEA) Trusted Access Program Office (TAPO).
“GF is proud to begin this new chapter of our decades-long partnership with the U.S government, and to continue serving as the leading supplier of securely manufactured essential chips for the U.S. aerospace and defense industry,” said Mike Cadigan, chief corporate and government affairs officer at GF. “This partnership provides DoD programs with ‘front-door access’ to advanced technologies in a way that is scalable and highly efficient. For this work, GF is accredited to provide the right level of security required for each program, from GF’s industry leading GF Shield protections, to strictly export controlled handling (e.g. ITAR), to the highest level of accredited microelectronics manufacturing security on the planet, Trusted Category 1A.”
This new contract is the third sequential 10-year contract of its kind between the DoD and the Trusted Foundry business team at GF and is the latest milestone in the longstanding partnership between the department and the company.
Original – GlobalFoundries
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NXP Semiconductors N.V. has been honored by three automotive partners. The company has collected supplier awards from DENSO and Hyundai Motor Group for its outstanding efforts in helping to ensure supply capacity, continuity and excellent customer service, as well as an innovation award from BMW Group for its digital car key solution.
“Successfully navigating the auto industry’s complex supply chain landscape to deliver true innovation our customers need can only be achieved through close collaboration with semiconductor manufacturers, Tier 1s and OEMs. We are extremely proud to be honored by BMW Group for our innovative UWB based digital car key solution, and by both DENSO and Hyundai Motor Group for NXP’s steadfast commitment to meeting our customer’s needs. Our teams work tirelessly to develop breakthrough technologies and foster collaborative customer relationships that enable NXP to deliver strategic long-term forecasts and expand capacity where needed, despite challenging conditions.”
Ron Martino, Executive Vice President, Global Sales at NXP
DENSO’s Business Partner of the Year Awards are given to companies that demonstrate a shared commitment to outstanding performance, exceptional quality, sustainability, diversity and inclusion, and advancing mobility. DENSO’s Gold Award for Special Achievements recognizes NXP’s outstanding efforts to ensure business continuity despite difficult supply conditions while maintaining strong customer service levels.
“This past year has been defined by an urgent need to adapt and evolve for emerging mobility trends, from electrification to connectivity and much more. All of our partners, but especially award recipients, have been crucial in helping us navigate such changes and deliver for our customers – quickly, sustainably and with enhanced value.”
Mike Winkler, vice president of the North America Purchasing Group at DENSO
In April, NXP received the prestigious 2022 Global Supplier of the Year award from Hyundai Motor Group, making NXP one of the first semiconductor vendors to receive such recognition. The award highlights the significance of the strong collaboration between semiconductor suppliers and auto OEMs from a supply and supply assurance viewpoint. It also recognizes NXP’s outstanding local team support and engagement in Korea.
In collaboration with Continental Automotive GmbH Regensburg, NXP was also awarded the BMW Group Supplier Innovation Award for the company’s innovative digital car key solution that leverages Ultra-Wideband technology. The digital key enables drivers to unlock their cars securely with their smartphones without needing a physical car key.
Original – NXP Semiconductors
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CDIL Semiconductors (Continental Device India Pvt. Ltd.), India’s first semiconductor chips and components manufacturer, will be adding new semiconductor packaging lines via the Government of India and MeitY’s SPECS scheme. With the new lines, CDIL aims to increase its annual capacity by 100 million units. The company initiated the first phase of this production with a surface mount packaging line of 50 million devices that will be inaugurated on September 28th, 2023 by Shri Rajeev Chandrasekhar Ji, Hon’ble Union Minister of State for Electronics and Information Technology & Skill Development and Entrepreneurship.
With 59 years of legacy, CDIL today is a semiconductor and electronics service provider to a worldwide customer base across Consumer, Industrial, Defence, Aerospace and Automotive. The company has many industry leaders as long term customers spread throughout the world including USA, UK, Germany, China, Hong Kong, Japan, South Korea, South Africa, and Egypt.
Commenting on the expansion of the product lines, Prithvideep Singh, General Manager, CDIL Semiconductors said, “In line with our steadfast commitment to innovation and market diversification, CDIL Semiconductors has strategically positioned itself to meet the burgeoning demands of the industry especially the power electronics, automotive, and defence sectors, both within India and on a global scale. As we reflect upon this progress, we recognize that this is only the beginning. The groundwork has been established and will stand as a pivotal cornerstone for the company’s future endeavours.”
CDIL has established an advanced high reliability (HiRel) and testing laboratory located at Mohali in addition to its NABL Accredited facility in Delhi. The HiRel laboratory is a crucial part of qualifying CDIL’s devices for stringent sectors like Automotive, Defence, and Aerospace.
Being the 1st Indian semiconductor company to obtain the IS/ISO 9002 and IATF 16949 quality system certifications, CDIL was the first to introduce India to silicon semiconductor technology in 1964. Currently, it produces a comprehensive range of discrete semiconductor devices including Transistors, Diodes, Rectifiers, Schottky Diodes, Thyristors, Voltage Regulators, Transient Voltage Suppressors and MOSFETS, with specialities in power Semiconductors, and high-reliability components.
Original – CDIL Semiconductors
