Toshiba Electronic Devices & Storage Corporation has introduced the XPMR7404PB, a 40 V N-channel power MOSFET for automotive applications including inverters, semiconductor relays, load switches, and motor drives. The device features the company’s new SOP Advance(EWF) package, which is designed to reduce conduction losses, improve thermal performance, and simplify automated manufacturing inspection.

The XPMR7404PB incorporates a post-less package structure that connects the MOSFET die to the external leads using a copper clip, reducing current path resistance and increasing current-carrying capability. A source-coupled design connects the source terminal to the underside of the package, increasing the PCB contact area to lower package resistance and improve heat dissipation.

According to Toshiba, the new package reduces package resistance by approximately 54% compared with the previous SOP Advance(WF) design. The XPMR7404PB also achieves approximately a 6% reduction in drain-source on-resistance (RDS(on)) and a 33% reduction in channel-to-case thermal impedance (Zth(ch-c)) compared with the existing XPHR7904PS MOSFET, improving efficiency and reducing operating temperatures.

The package incorporates a wettable flank structure that enhances solder joint visibility, enabling more reliable automated visual inspection (AVI) during PCB assembly.

The MOSFET is qualified to the AEC-Q101 automotive reliability standard and is intended for automotive power electronics requiring high current capability and efficient thermal management.

Toshiba also disclosed two additional SOP Advance(EWF) MOSFETs currently under development, the XPMR5904PB and XPMR8504PB, which will expand the product family.

Key specifications include:

  • 40 V drain-source voltage (VDSS)
  • 160 A continuous drain current
  • 480 A pulsed drain current
  • Maximum RDS(on) of 0.74 mΩ at VGS = 10 V
  • Maximum RDS(on) of 1.28 mΩ at VGS = 6 V
  • Maximum channel-to-case thermal impedance of 0.59°C/W
  • Maximum channel temperature of 175°C
  • SOP Advance(EWF) package with wettable flank structure
  • AEC-Q101 qualified for automotive applications

Original – Toshiba