Aehr Test Systems reported record quarterly bookings and a significantly strengthened backlog for the fourth quarter of fiscal 2026, driven by growing demand for wafer-level and package-level burn-in solutions used in AI processors, silicon photonics, and power semiconductors. The company also issued fiscal 2027 revenue guidance of $130 million to $150 million, representing expected year-over-year growth of approximately 160% to 200%.

For the fourth quarter ended May 29, 2026, Aehr reported:

  • Revenue: $18.8 million, up from $14.1 million a year earlier
  • GAAP net income: $1.4 million ($0.04 per diluted share), compared with a GAAP net loss of $2.9 million in the prior-year quarter
  • Non-GAAP net income: $3.6 million ($0.11 per diluted share)
  • Record bookings: $60.7 million
  • Backlog: $80.6 million at quarter-end, increasing to $100.6 million including subsequent bookings
  • Cash and equivalents: $116.5 million, up from $37.1 million at the end of the previous quarter

For the full fiscal year, Aehr reported:

  • Revenue: $50.0 million, compared with $59.0 million in fiscal 2025
  • GAAP net loss: $7.1 million
  • Non-GAAP net income: $0.9 million
  • Cash used in operating activities: $3.3 million

Aehr said demand for its FOX wafer-level burn-in (WLBI) systems continued to grow as AI chip manufacturers increasingly adopt wafer-level testing to improve reliability and reduce manufacturing costs.

The company reported:

  • A lead AI customer is expanding production capacity and transitioning burn-in from system-level testing to full wafer-level burn-in for AI accelerators.
  • Successful benchmark testing with a major supplier of AI accelerators, CPUs, and networking processors has led to plans for pilot production validation.
  • The customer has also requested evaluation of a second high-volume processor, representing an additional long-term opportunity.

Demand also increased for Aehr’s Sonoma package-level burn-in systems used in AI processor manufacturing.

According to the company:

  • Its largest hyperscale customer placed record follow-on production orders.
  • The customer plans to deploy Sonoma systems for a second AI processor with approximately twice the power consumption of the current device.
  • Additional engagements are underway with manufacturers of AI accelerators, ASICs, networking processors, automotive AI processors, and robotics chips.

Aehr reported growing demand for burn-in solutions used in silicon photonics as AI data centers increasingly adopt optical interconnects.

The company noted:

  • Its lead silicon photonics customer continues expanding production with additional system orders.
  • A second major networking equipment supplier has forecast further purchases to support next-generation hyperscale AI infrastructure.
  • Management expects silicon photonics to become a significant long-term growth market.

Aehr also highlighted improving conditions in the silicon carbide (SiC) power semiconductor market.

Recent developments include:

  • Approximately $8 million in new SiC WaferPak orders received during the past month.
  • Expanded production orders from its largest SiC customer.
  • A qualification order from one of the world’s largest automotive manufacturers for silicon carbide devices used in next-generation electric vehicles.

The company expects renewed demand for both SiC and GaN power semiconductor burn-in systems, supported by vehicle electrification and AI data center power infrastructure.

Beyond AI and power semiconductors, Aehr continues developing wafer-level burn-in solutions for future NAND flash and High Bandwidth Memory (HBM) production, working with multiple memory manufacturers as industry capacity expands.

Original – Aehr Test Systems