JCET Group has introduced its next-generation high-density 3D power module packaging and test solution targeting AI data center applications. Based on the company’s XDPKG-3DSiP (3D System-in-Package) technology platform, the new solution combines high-density multilayer interconnects with a three-dimensional module architecture to enhance power density, energy efficiency, thermal performance, and long-term reliability in advanced computing environments.
The solution integrates power devices, passive components, interconnect structures, and thermal management pathways within a compact package footprint, providing a more efficient and stable platform for next-generation AI computing infrastructure.
JCET offers turnkey packaging and testing services covering both power management integrated circuits (PMICs) and power modules. At the wafer level, the company provides highly consistent bumping services along with specialized wafer-level processes for power management ICs and DrMOS devices. These capabilities establish the foundation for subsequent system integration and are complemented by JCET’s support for System-in-Package (SiP) module assembly and testing, enabling a streamlined transition from chip-level interconnects to complete system-level modules.
To improve power conversion efficiency, JCET has optimized package architecture, interconnect routing, parasitic characteristics, and thermal pathways. The company also incorporates advanced technologies such as copper pillar interconnects and high-density packaging techniques. These enhancements enable power modules to achieve higher energy conversion efficiency under heavy-load operating conditions, helping customers improve server efficiency while reducing the burden on power delivery and cooling systems.
Reliability is a key focus of the new solution. Through the use of ECP substrates, copper pillar interconnects, and a comprehensive lifecycle quality management framework, JCET has strengthened the mechanical robustness and electrical stability of its power modules. The solution is designed to perform under high-current-density operation, prolonged heavy-load conditions, thermal cycling, power cycling, and system-level thermal stress, supporting the stringent uptime and availability requirements of modern AI data centers.
To further increase power density, the company has adopted multilayer stacking techniques, multidimensional structural design, high thermal conductivity interface materials, top-side cooling technology, and vacuum reflow processes. These innovations enable higher integration levels and more compact module designs. Under comparable thermal and design constraints, the new solution delivers more than a 20% increase in power density compared with the previous generation of similar solutions. This improvement allows data center operators to support greater computing workloads within the same rack and board-level footprint while providing additional flexibility in AI server design.
JCET also supports customer product development through advanced co-design and simulation capabilities. By creating virtual digital prototypes and performing coupled electrical, thermal, and mechanical multiphysics simulations, the company enables early-stage optimization of power integrity, thermal performance, and structural reliability. This approach helps reduce development time while improving overall product robustness.
The company noted that demand for its high-density power management solutions has grown rapidly since 2025, particularly in markets focused on high-performance computing. JCET’s capabilities have gained recognition among leading domestic and international customers, and the company reports continued strong market momentum.
Dr. Rebecca Chen, Vice President of JCET and General Manager of the AI & Smart Industry Business Unit, said the company has built a comprehensive portfolio of packaging and test solutions for AI data centers through sustained investment in advanced packaging and system-level integration technologies. She noted that the portfolio spans computing, memory, connectivity, and power applications, strengthening JCET’s position across the AI data center value chain.
Looking ahead, JCET plans to further leverage its end-to-end capabilities in co-design, system-level integration, and testing, together with its global manufacturing network, to collaborate closely with customers and ecosystem partners worldwide in advancing power management technologies for AI data center applications.
Original – JCET