Infineon Technologies AG has unveiled EasyPACK™ S, a new compact power module and packaging concept developed to address growing demand for higher power density in space-constrained applications. Introduced at PCIM Europe 2026, the new platform is designed for applications such as electric vehicle onboard chargers and power supplies for AI data centers, where compact size, thermal performance, and efficiency are critical requirements.
EasyPACK S features a package height of just 5.6 mm and a footprint of approximately 33 × 36 mm², enabling significant system miniaturization while maintaining reliable thermal performance and reduced electromagnetic interference (EMI). The first modules in the new package family integrate Infineon’s CoolSiC™ MOSFET 1200 V Generation 2 technology, as well as 1200 V IGBT4 and IGBT7 devices.
The new module platform has been qualified according to the latest industrial and automotive standards. By incorporating Infineon’s .XT interconnection technology, EasyPACK S delivers enhanced reliability and extended operational lifetime. An integrated direct bonded copper (DBC) substrate provides stable thermal characteristics and uniform temperature distribution across the module.
Infineon has also implemented a new plastic material and silicone gel, allowing the modules to support continuous operating junction temperatures of up to Tvj(op) = 175°C. In addition, PressFIT pin technology doubles current-carrying capability while simplifying PCB assembly.
The package has been engineered to support automated manufacturing processes through features such as defined gripping areas, alignment holes, and reduced pin-to-pin tolerances. These design elements help streamline production while reducing manufacturing time and cost.
EasyPACK S has been developed as a scalable platform capable of supporting future silicon carbide and gallium nitride power devices while meeting demanding lifetime and reliability requirements. The platform architecture offers flexibility across semiconductor technologies, chip configurations, topologies, and power classes, enabling designers to optimize performance and accelerate product development.
The first EasyPACK S modules incorporating CoolSiC MOSFET G2 and IGBT4 technologies are scheduled to become available in July. The products are being showcased at Infineon’s booth during PCIM Europe 2026 in Nuremberg.
Original – Infineon Technologies