Infineon Technologies AG has introduced two new system-level power solutions designed to address the evolving requirements of artificial intelligence (AI) data centers. The company unveiled an 18 kW three-phase power supply unit (PSU) reference design optimized for 50 V rack architectures and a 30 kW three-phase interleaved T-Type power factor correction (PFC) evaluation board developed for 800 VDC or ±400 VDC rack architectures with power sidecar configurations.

The two solutions are part of Infineon’s broader AI server power delivery portfolio and are intended to help server ODMs and OEMs accelerate development while achieving higher rack power, improved efficiency, and enhanced thermal performance.

As AI workloads continue to increase GPU power consumption and drive higher rack densities, data center power infrastructures are facing growing challenges. Infineon’s new designs are aimed at addressing these demands through advanced power conversion technologies and system-level integration.

The 18 kW PSU reference design incorporates a new integrated energy buffer concept that smooths power demand from the electrical grid during AI-related peak loads, eliminating the need for a separate capacitor bank unit. According to Infineon, this approach enables more efficient use of stored energy and reduces the required capacitor volume by up to 50%, lowering both component costs and system footprint.

The 30 kW PFC evaluation board utilizes Infineon’s CoolGaN™ semiconductor technology to achieve higher power density while reducing overall system cost, targeting data center operators expanding infrastructure to support increasing AI computing requirements.

The 18 kW PSU reference design achieves a peak efficiency of 97.5% through a combination of 650 V CoolSiC™ MOSFETs, 80 V CoolGaN™ switches, EiceDRIVER™ gate drivers, and a PSOC™ microcontroller. At the core of the system is a five-level active neutral-point clamped (ANPC) PFC topology, designed to deliver high efficiency across the full load range, particularly under low-to-medium load conditions, while reducing the size of magnetic components.

Infineon states that the ANPC topology provides a 0.2% higher peak efficiency at 50% load compared to a T-Type PFC design and a 0.4% improvement over a Vienna Rectifier topology.

The design also incorporates a novel integrated planar magnetic structure that enables a compact, modular, and scalable high-frequency transformer configuration. The integrated energy buffer provides a 20-millisecond hold-up time and supports GPU electrical data peak processing (EDPP) loads of up to 180%, meeting demanding AI load transient requirements.

The PSU accepts a wide three-phase input voltage range of 311 VAC to 528 VAC, allowing compatibility with global power grid standards. Thermal management has been engineered to support operation in ambient temperatures ranging from -5°C to 45°C.

Measuring 104 mm × 710 mm × 40 mm, the PSU is designed to fit standard 19-inch rack enclosures while delivering a power density of 100 W/in³.

The 30 kW T-Type PFC evaluation board combines 650 V CoolGaN™ bidirectional switches in the back-to-back switching path with 1200 V CoolSiC™ MOSFETs in the high-voltage power stage. The system achieves a peak efficiency exceeding 99%.

Power control is managed through the programmable power control accelerator (PPCA) integrated into the PSOC™ C3 microcontroller, enabling precise current and voltage regulation with fast dynamic response. The design maintains input current total harmonic distortion (iTHD) below 5% for loads above 30% and achieves a power factor greater than 0.99 across most operating conditions.

Current measurement is performed using the XENSIV™ TLE4978 isolated magnetic Hall plus Coil current sensor, which offers a bandwidth of 9 MHz, strong common-mode transient immunity (CMTI), and high measurement accuracy. These characteristics make the solution suitable for next-generation silicon carbide and gallium nitride-based power supply systems.

The modular platform is designed for integration into a 1U full-size PSU form factor and targets high-voltage DC data center applications requiring accurate voltage regulation and effective thermal management under the dynamic operating conditions associated with AI workloads.

Both designs are optimized for use with Infineon’s AI server power delivery portfolio, which spans the complete power chain from grid connection to processor core. The portfolio includes solid-state transformers, circuit breakers, power supply units, battery backup units, intermediate bus converters, and second-stage DC conversion power modules.

By combining silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies, Infineon provides a comprehensive platform for end-to-end power architectures supporting next-generation AI server infrastructure. The solutions are backed by scalable components, design resources, and system-level support aimed at accelerating deployment of advanced AI data center power systems.

Both the 18 kW three-phase PSU reference design and the 30 kW three-phase T-Type PFC evaluation board are expected to be available for evaluation in the near future.

Original – Infineon Technologies