ROHM Co., Ltd. announced new three-phase inverter reference designs alongside its participation at APEC 2026, reinforcing its strategy to accelerate adoption of SiC and GaN power technologies across automotive, industrial, and AI infrastructure applications.

ROHM released three reference designs—REF68005, REF68006, and REF68004—supporting three-phase inverter circuits based on its EcoSiC™ molded modules, including HSDIP20, DOT-247, and TRCDRIVE pack™. These designs target power levels up to 300 kW and are intended to reduce engineering effort in evaluation, gate driving, and thermal design, which are key barriers to broader SiC adoption. By providing ready-to-use design data, ROHM enables faster system development and easier integration of SiC modules into high-power applications such as traction inverters and industrial drives.

Complementing this, ROHM is showcasing its latest power solutions at APEC 2026 in San Antonio, highlighting advancements in both SiC and GaN technologies. The company is focusing on key growth segments including AI data centers, electric vehicles, and industrial power systems.

For AI infrastructure, ROHM is demonstrating EcoSiC™ modules in HSDIP20 and DOT-247 packages for server power supplies, as well as 650V EcoGaN™ HEMTs integrated into power solutions for high-efficiency data center applications. A joint demonstration with Tamura Corporation features gate driver modules optimized for ROHM’s SiC devices, targeting UPS systems, PV inverters, and energy storage.

In automotive applications, ROHM is emphasizing its TRCDRIVE pack™ for traction inverters, along with compact SiC modules for onboard chargers and auxiliary systems, addressing increasing demand for higher efficiency and power density in electrified powertrains.

The company is also presenting system-level demonstrations, including a three-phase BLDC motor drive platform and LogiCoA™ hybrid analog-digital power solutions, illustrating its broader push toward integrated system solutions beyond discrete devices.

From a market perspective, the combination of reference designs and live system demonstrations highlights a key industry trend: moving from component-level innovation to system-level enablement. By lowering design complexity and accelerating time-to-market, ROHM is positioning itself to capture growth in high-power applications driven by electrification and AI infrastructure.

Original – ROHM