ROHM has expanded its portfolio of 40 V and 60 V low-voltage MOSFETs for automotive applications by introducing new devices in the HPLF5060 package (4.9 mm × 6.0 mm). The MOSFETs target use cases such as main inverter control circuits, electric pumps and LED headlight systems, where compact size and robust mounting are increasingly important.
Automotive low-voltage MOSFET designs have been moving toward smaller footprints, including 5060-size packages and even more compact options. ROHM noted that this miniaturization can create mounting reliability challenges, particularly with narrow terminal spacing and leadless package structures.
To address these constraints, the HPLF5060 package combines a reduced footprint compared with the widely used TO-252 package (6.6 mm × 10.0 mm) with improved board-mount reliability through the use of gull-wing leads. ROHM also highlighted copper clip junction technology, which supports high-current operation and is intended to meet the demands of automotive environments.
Mass production of the new HPLF5060-based products began in November 2025, with a sample price of $3.5 per unit (excluding tax). ROHM said online sales have started and that the products are available through distributors including DigiKey and Farnell.
Looking ahead, ROHM plans to further broaden its package options. Mass production of a smaller DFN3333 (3.3 mm × 3.3 mm) package featuring wettable flank technology is scheduled to begin around February 2026. The company also said it has started development of a TOLG (TO-Leaded with Gull-wing) package (9.9 mm × 11.7 mm) aimed at extending its lineup of higher-power, high-reliability package solutions.
Original – ROHM