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Magnachip Semiconductor Corporation has announced its financial results for the third quarter of 2025, delivering performance in line with guidance while executing key initiatives to improve operational efficiency and focus on its core power semiconductor business.
Consolidated revenue from continuing operations, which includes the Power Analog Solutions (PAS) and Power IC (PIC) businesses, was $45.9 million, falling near the mid-point of the company’s guidance range of $44.0 to $48.0 million. Gross profit margin from continuing operations was 18.6 percent, also within guidance, though at the low end of the 18.5 to 20.5 percent range.
Product revenue from the Communications segment showed strong momentum, growing 34 percent sequentially and 95 percent year-over-year.
Recent operational and strategic highlights include:
- Execution of several cost-reduction initiatives, including a headcount reduction program, which are expected to generate approximately $2.5 million in annualized savings
- A revised investment plan for the Gumi fab upgrade, reducing capital expenditures by over 50 percent compared to the previously forecasted $65 to $70 million over the next two years
- Introduction of 30 new-generation PAS products in the first nine months of 2025, with plans to launch at least 20 more in the fourth quarter
- Signing of a strategic agreement with Hyundai Mobis to expand Magnachip’s industrial business through co-developed IGBT technology
Camillo Martino, Chief Executive Officer of Magnachip, stated:
“Our top priority is to stabilize our financial position and establish a solid foundation for business recovery. At the same time, we have restructured our go-to-market organization and are revitalizing our product portfolio to enhance our competitiveness, particularly in China. In the first three quarters of 2025, we launched 30 new-generation products, compared to only two during the same period in 2024. We currently plan to launch at least another 20 by year-end, bringing our total for 2025 to at least 50, compared to just four in all of 2024.”He added, “We recognize that we are entering a challenging period ahead as we right-size into a pure-play power products company. However, we believe that we are moving in the right direction and are committed to exploring all strategic options to position Magnachip for success.”
Original – Magnachip Semiconductor
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Micro Commercial Components (MCC) has announced the launch of the MCG018N06LHE3, a 60 V N-Channel MOSFET designed to address the challenges of energy efficiency, thermal performance, and space limitations in high-power automotive and industrial applications.
Engineered with an ultra-low on-resistance of just 18 mΩ (typical), the MCG018N06LHE3 significantly reduces conduction losses, supporting improved system efficiency and lower power dissipation. Housed in a thermally optimized PDFN3333 package (3.3 mm x 3.3 mm), the device provides strong thermal performance, enabling reliable operation even in compact, high-density circuit designs.
This MOSFET incorporates a high-density cell structure and is fully AEC-Q101 qualified, ensuring dependable operation in demanding environments. Its thermal design supports extended device longevity and stability under high current and elevated temperatures, meeting the rigorous standards required in automotive and industrial systems.
The MCG018N06LHE3 is ideal for applications such as automotive LED lighting, EV traction inverters, DC-DC converters, solenoid controls, and other power-switching functions where reliability, size, and thermal management are critical. Its compact footprint allows engineers to minimize board space without compromising electrical performance or long-term reliability.
Key features:
- AEC-Q101 qualified for automotive-grade reliability
- Ultra-low on-resistance of 18 mΩ (typical) for reduced conduction losses
- High-density cell design enhances efficiency and current handling
- PDFN3333 package optimized for thermal performance
- Compact 3.3 mm x 3.3 mm footprint ideal for space-constrained designs
- Supports high-current switching with minimal power loss
- Compatible with automated surface-mount assembly
With its robust electrical performance and compact form factor, the MCG018N06LHE3 enables designers to build more efficient, reliable, and thermally optimized power solutions for the next generation of automotive and industrial electronics.
Original – Micro Commercial Components
