Resonac is pleased to offer advanced products to support your development of Power Module applications.
Webinar Topic and Presenters
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Event Details
Resonac is pleased to offer advanced products to support your development of Power Module applications.
Webinar Topic and Presenters
– Resonac’s Total Material Solutions for Emerging xEV Market Needs Rajesh Jose Pendanam – Head of Marketing
– High Tg Molding Compound for High Reliability Power Module and Discrete Akihiro Nozaki – Senior Engineer, Encapsulation Materials R&D Department
– Copper Sintering Pastes with High Thermal Conductivity and High Bonding Reliability Dr. Hideo Nakako – Doctor of Engineering, Senior Researcher, Institute for Advanced Integrated Technology
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Time
(Thursday) 9:00 am - 10:30 am(GMT+02:00)View in my time