Material solutions for High-Reliability Power Modules

Resonac is pleased to offer advanced products to support your development of Power Module applications.

Webinar Topic and Presenters

– Resonac’s Total Material Solutions for Emerging xEV Market Needs
Rajesh Jose Pendanam – Head of Marketing

– High Tg Molding Compound for High Reliability Power Module and Discrete
Akihiro Nozaki – Senior Engineer, Encapsulation Materials R&D Department

– Copper Sintering Pastes with High Thermal Conductivity and High Bonding Reliability
Dr. Hideo Nakako – Doctor of Engineering, Senior Researcher, Institute for Advanced Integrated Technology