Thermal Engineering of Power Electronic Systems Part 2: Thermal Management and Reliability

This two-day advanced tutorial, organized by ECPE (European Center for Power Electronics), focuses on the thermal design, management, and reliability of power electronic systems. With an emphasis on power modules and converter platforms, the program bridges theory and practice to address critical aspects of thermal behavior and lifetime prediction in modern power electronics.

Main Topics:

• Fundamentals of heat transfer and loss calculation

• Thermal network and finite element simulation methods

• Thermal impedance measurement techniques

• Cooling system design and integration

• Thermo-mechanical stress analysis and reliability modeling

• Power cycling, lifetime estimation, and mission profile-based evaluation

• Failure mechanisms at device and package level

Why Attend:

• Gain deep technical knowledge essential for reliable thermal design in power electronics

• Learn practical simulation and measurement techniques using industry-standard tools

• Understand failure modes and design margins critical to next-generation systems

• Network with leading experts and engineers from academia and industry

• Strengthen your capabilities in system-level thermal reliability for Si and WBG-based technologies