March 4, 2026 – March 5, 2026
The ECPE AQG 324 Tutorial provides comprehensive guidance on the application of the ECPE Industry Guideline AQG 324 for automotive power module qualification. The guideline is prepared and released by the ECPE Working Group “Automotive Power Module Qualification,” comprising member companies from across the automotive supply chain.
AQG 324 is based on the German automotive supply specification LV 324, originally developed by leading automotive OEMs in cooperation with representatives from the power electronics supplier industry. The guideline supports stakeholders throughout the automotive value chain by defining harmonized qualification requirements for power modules used in automotive applications.
The tests described in AQG 324 address module design and the qualification of devices at module level (assembly). The guideline does not cover the qualification of semiconductor chips themselves or manufacturing processes. The tutorial content refers primarily to Release 04.1/2025 of the AQG 324 Guideline (dated March 31, 2025). The main document focuses on power modules based on silicon (Si) power semiconductors, while silicon carbide (SiC)-based modules are covered in a dedicated annex.
Delivered by speakers from the AQG 324 Core Team, the tutorial provides practical recommendations and detailed guidance on how to perform qualification tests in accordance with AQG 324 under comparable and standardized conditions. It is designed for direct users ranging from beginners to experienced experts, including power module suppliers, automotive Tier 1 companies, as well as test service and equipment providers.
All presentations and discussions will be conducted in English.