December 2, 2025 – December 3, 2025
Bodo’s Wide Bandgap Event is a focused conference bringing together experts and innovators in wide-bandgap semiconductor technologies — particularly silicon carbide (SiC) and gallium nitride (GaN). The event is designed for engineers, designers, and decision-makers who are driving advancements in high-efficiency power electronics.
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December 2:
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Opening roundtable: “Making Wide Bandgap Designs Happen”
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Evening networking reception for informal exchange with industry peers
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December 3:
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Technical sessions with parallel tracks on SiC and GaN
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Tabletop exhibition featuring the latest in WBG products, design tools, and applications
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Live Q&A sessions with speakers and technology experts
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Who Should Attend:
Power electronics engineers, system architects, R&D professionals, and product managers involved in industrial, automotive, renewable, and data center applications — or anyone working to integrate SiC and GaN technologies into next-generation designs.
Why Attend:
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Learn directly from leading players in the WBG space
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Stay current on device innovations, packaging, thermal management, and system design
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Explore new technologies and solutions through the compact expo
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Connect with peers and suppliers in an in-depth, focused setting