October 9, 2025
The Application Manual Power Semiconductors 3rd revised edition is here – fully updated for today’s practice with revised and expanded content and practical insights.
With over 500 pages, it explains semiconductor fundamentals alongside advanced power module packaging and reliability topics. It addresses real-world challenges, including component choice, gate driving, thermal management, and PCB layout optimization.
Please join on October 9 at 16:00 CEST to explore what’s new in this essential resource for engineers and technicians – presented firsthand by one of the manual’s authors.
Key Take-Aways:
- What’s new in the world of power semiconductor and module technology?
- Tools and guidance to optimize component selection and system design
- Best practices for thermal management and protection