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GlobalFoundries (GF) and Renesas Electronics Corporation announced an expanded strategic collaboration through a multi-billion-dollar manufacturing partnership that broadens Renesas’ access to GF’s differentiated technology platforms. The companies said the agreement is designed to support more secure, resilient supply chains and aligns with U.S. priorities to reinforce domestic semiconductor production for economic and national security.
With vehicles becoming more intelligent and electrified and factories increasingly automated, both companies emphasized that dependable semiconductor supply is now mission-critical. Chips used for functions such as radar-based advanced driver assistance, battery management in EVs and secure connectivity in industrial IoT systems require consistent availability and high reliability. GF’s manufacturing footprint across the U.S., Europe and Asia is positioned to provide supply assurance and flexibility for these markets.
Under the expanded partnership, Renesas will gain broader access to GF’s portfolio, including FDX™ (FD-SOI), BCD and feature-rich CMOS technologies with non-volatile memory features, supporting products such as SoCs, power devices and MCUs. The companies said tape-outs under the expanded collaboration are on track to begin in mid-2026.
The agreement is expected to start with manufacturing in the U.S. and extend across GF’s global network, including sites in Germany and Singapore, as well as through GF’s manufacturing partnership in China. Renesas and GF also said they are evaluating the option of porting select GF process technologies into Renesas’ inhouse fabs in Japan to further strengthen manufacturing resilience and support future capacity needs.
“This partnership strengthens a proven relationship and underscores GF’s role as a trusted partner for essential semiconductor technologies,” said Tim Breen, CEO of GlobalFoundries. He pointed to the rapid evolution of automotive electronics and the growing importance of semiconductors in systems such as advanced driver assistance, battery management and secure connectivity, areas where GF’s differentiated platforms are designed to deliver performance and efficiency under demanding conditions.
“Access to a broader range of GF technologies gives us the flexibility and supply assurance our customers need,” said Hidetoshi Shibata, CEO of Renesas. He added that the expanded partnership is intended to provide stable, long-term supply while maintaining high quality and reliability, as demand accelerates for electrification, connectivity and rising compute requirements driven by AI applications.
GF noted that with the expanded partnership, it now manufactures semiconductors used by the top three automotive MCU manufacturers globally. The companies positioned the collaboration as timely support for the automotive shift toward software-defined vehicles, electrification and advanced safety systems, all of which depend on a secure and resilient semiconductor supply chain.
Original – GlobalFoundries
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Axcelis Technologies, Inc. reported financial results for the fourth quarter and full year ended December 31, 2025, highlighting quarterly performance that exceeded the company’s outlook and another record quarter in Customer Support, Installations & Services (CS&I).
For the fourth quarter, Axcelis reported revenue of $238 million. GAAP gross margin was 47.0%, while non-GAAP gross margin was 47.3%. GAAP operating margin came in at 15.2%, with non-GAAP operating margin at 21.1%. GAAP diluted earnings per share were $1.10, and non-GAAP diluted EPS were $1.49.
President and CEO Russell Low said Axcelis “exited 2025 on a strong note,” pointing to fourth-quarter results that exceeded expectations and a record quarter of CS&I revenue. He attributed CS&I performance to the company’s expanding installed base and its focus on upgrades and service contracts. Low added that Axcelis continues to operate with discipline as customers navigate mixed demand conditions in Power and General Mature markets, while demand trends in the Memory market are showing improvement, which the company expects to continue into 2026.
Low also said the company remains focused on completing its pending merger with Veeco Instruments and reiterated confidence in the strategic rationale for the combination. He noted that the combined company is expected to be better positioned to benefit from long-term growth drivers including AI, electrification and next-generation device architectures, leveraging complementary portfolios and teams.
Executive Vice President and CFO Jamie Coogan said the company’s fourth-quarter execution included record CS&I performance and gross margins that came in above expectations, supported by operational discipline, favorable mix and the strength of Axcelis’ aftermarket strategy. For the full year, Coogan highlighted double-digit CS&I growth, gross margin expansion and more than $100 million of free cash flow, while continuing investment in innovation and returning more than $120 million of capital to shareholders.
Original – Axcelis Technologies
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Navitas Semiconductor announced the launch of its 5th-generation GeneSiC technology platform, built around a new high-voltage silicon carbide Trench-Assisted Planar (TAP) MOSFET architecture. The company said the platform will underpin an industry-leading 1200 V MOSFET family and complements its 4th-generation GeneSiC ultra-high-voltage portfolio at 2300 V and 3300 V, targeting applications such as AI data centers, grid and energy infrastructure, and industrial electrification.
According to Navitas, the 5th-generation platform uses its most compact TAP architecture to combine planar-gate ruggedness with improved performance enabled by a trench structure in the source region. The design focus is to raise efficiency while supporting long-term reliability in high-voltage power conversion.
Navitas said the new 1200 V technology delivers a 35% improvement in the RDS,ON × QGD figure of merit versus the prior-generation 1200 V platform, reducing switching losses and enabling cooler operation and higher switching frequencies. High-speed switching performance is further supported by an approximately 25% improvement in the QGD/QGS ratio. Combined with a stable high threshold voltage specification (VGS,TH ≥ 3 V), the company positions the platform as more immune to parasitic turn-on in high-noise environments.
The 5th-generation technology also targets dynamic performance through an optimized RDS(ON) × EOSS characteristic and adds “Soft Body-Diode” technology intended to improve commutation behavior and reduce electromagnetic interference (EMI) in fast-switching power stages.
For reliability, Navitas said this generation is qualified to an “AEC-Plus” grade for long-term stability in demanding infrastructure applications. The company highlighted extended stress testing for static high-temperature, high-voltage conditions, dynamic reliability tests intended to reflect fast-switching mission profiles, and a focus on threshold voltage stability over prolonged switching stress. Navitas also cited extreme gate oxide reliability, with an extrapolated gate-oxide failure time exceeding 1 million years at operating VGS of 18 V and 175°C, and enhanced cosmic ray robustness aimed at lowering FIT rates for high-uptime environments. Navitas noted that “AEC-Plus” indicates parts exceeding AEC-Q101 and JEDEC standards for reliability testing based on Navitas test results.
“Our customers are redefining the boundaries of power conversion in AI data centers and energy infrastructure, and Navitas is marching along with them in every step of the way,” said Paul Wheeler, VP & GM of Navitas’ SiC Business Unit. “Significant technological improvements in our 5th generation GeneSiC technology underscore Navitas’ commitment to delivering industry-leading performance and reliability in silicon carbide MOSFETs.”
Navitas said a white paper on Trench-Assisted Planar technology is available from the company, and that additional 5th-generation GeneSiC product announcements are expected in the coming months.
Original – Navitas Semiconductor
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SemiQ Inc. has signed a distribution agreement with NAC Semi (NAC Group, Inc.), a global electronic component design services and distribution company.
The partnership is aimed at accelerating adoption of SemiQ’s SiC technology across North American markets, giving engineers more direct access to SemiQ’s power modules, MOSFETs and Schottky diodes, along with application-focused support.
Electrification trends in industrial and automotive systems, combined with rising efficiency requirements in data centers and other high-power segments, are driving increased demand for SiC-based power electronics. SemiQ said its rugged, reliable portfolio aligns well with NAC Semi’s focus areas including power conversion, EV platforms and industrial electrification.
“Partnering with NAC Semi significantly strengthens our ability to support our global customer base as they design next-generation power systems,” said Timothy Han, President of SemiQ. “NAC’s deep technical expertise, FAE support, and focus on demand creation align perfectly with SemiQ’s high-performance, reliable silicon carbide technologies for electrification, energy efficiency, and high-voltage applications.”
NAC Semi positions itself between catalog distributors and large fulfillment players by emphasizing demand-creation services, including dedicated Field Applications Engineer (FAE) support. By adding SemiQ to its line card, NAC Semi expands its ability to support SiC designs across applications such as EV charging stations, solar inverters and high-voltage power supplies.
“SemiQ’s reputation for high-quality, reliable SiC devices perfectly complements our existing power semiconductor offerings,” said Channing Applegarth, Vice President at NAC Semi. “Adding these MOSFETs and modules to our line card gives our customers a more complete SiC solution to accelerate innovation in these vital and fast-growing high-power markets.”
Original – SemiQ
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Siltronic AG has issued its financial guidance for 2026 via an ad hoc announcement, warning of another challenging year marked by exchange rate headwinds and continued price pressure outside existing long-term agreements.
The Executive Board expects sales in 2026 to decline in the mid-single-digit % range compared with the preliminary 2025 figure of €1,347 million, with a subdued start to the year. The outlook is based on an assumed EUR/USD exchange rate of 1.18, compared with 1.13 in 2025.
On a comparable basis — excluding exchange rate effects and the closure of the SD line — revenue is expected to be roughly in line with the previous year.
While demand for 300 mm wafers is supported by AI-driven end markets, Siltronic anticipates a decline in 200 mm wafers due to intensified inventory reduction by customers in the power segment. Additionally, the full-year impact of the SD line closure will weigh on 2026 results for the first time.
“2026 will still be a challenging year, even though AI-driven end markets are clearly supporting our 300 mm volume,” said CEO Dr. Michael Heckmeier. He noted that positive developments in the memory segment have not yet fully translated into wafer demand, as customers remain capacity-constrained and inventory dynamics continue to affect downstream markets such as smartphones and PCs.
Siltronic expects its EBITDA margin to range between 20% and 24%, compared with a preliminary 23.5% in 2025.
Depreciation is projected to increase significantly in 2026 due to prior investments in the 300 mm business, reaching between €490 million and €520 million. As a result, EBIT is expected to be significantly below the 2025 preliminary figure of -€26 million.
Capital expenditures will be substantially reduced to between €180 million and €220 million, down from €369 million in 2025. However, as capex-related payments will exceed this level, net cash flow is expected to remain around the prior year’s preliminary figure of -€85 million.
Siltronic will publish its full audited Annual Report for 2025 on March 12, 2026.
Original – Siltronic
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Applied Materials, Inc. reported results for its first quarter ended January 25, 2026, highlighting strong performance driven by accelerating investments in AI computing and advanced semiconductor technologies.
Applied generated revenue of $7.01 billion in the quarter. On a GAAP basis, the company reported:
- Gross margin of 49.0%
- Operating income of $1.83 billion, representing 26.1% of net revenue
- Earnings per share (EPS) of $2.54
On a non-GAAP basis, results included:
- Gross margin of 49.1%
- Operating income of $2.11 billion, or 30.0% of net revenue
- EPS of $2.38
The company generated $1.69 billion in cash from operations and returned $702 million to shareholders, including $337 million in share repurchases and $365 million in dividends.
“Applied Materials delivered strong results in our fiscal first quarter, fueled by the acceleration of industry investments in AI computing,” said Gary Dickerson, President and CEO. “The need for higher performance and more energy-efficient chips is driving high growth rates for leading-edge logic, high-bandwidth memory and advanced packaging. These are areas where Applied is the process equipment leader, and we expect to grow our semiconductor equipment business over 20% this calendar year.”
Brice Hill, Senior Vice President and CFO, added that the company has nearly doubled its system manufacturing capability in recent years, strengthened its supply chain and increased inventories to support anticipated market growth.
Compared with Q1 FY2025, revenue declined 2% year-on-year to $7.01 billion, while gross margin improved slightly to 49.0%. GAAP net income rose 71% to $2.03 billion, with diluted EPS increasing 75% to $2.54.
On a non-GAAP basis, gross margin increased to 49.1%, operating margin was 30.0%, and diluted EPS remained flat at $2.38. Non-GAAP free cash flow rose 91% year-on-year to $1.04 billion.
During the quarter, Applied announced several strategic and technology milestones:
- Samsung Electronics will join Applied’s new EPIC Center in Silicon Valley, aimed at accelerating commercialization of breakthrough semiconductor technologies.
- Introduced new deposition, etch and materials modification systems to enhance energy-efficient performance of Gate-All-Around (GAA) transistors at 2nm and beyond, including:
- Viva™, a radical treatment system to smooth GAA silicon nanosheets with atomic precision.
- Sym3™ Z Magnum™, a conductor etch system enabling angstrom-level 3D trench profile control.
- Spectral™, an atomic layer deposition system replacing tungsten contacts with molybdenum to reduce electrical resistance.
- Received 2025 TSMC Excellent Performance Awards for technology development, production support and green manufacturing.
- Recognized by Micron Technology with a 2025 Outstanding Performance in Sustainability Award.
Applied said demand for leading-edge logic, high-bandwidth memory and advanced packaging continues to strengthen, positioning the company to benefit from ongoing AI-driven semiconductor investment.
Original – Applied Materials
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Okmetic has entered volume production at its expanded Vantaa fab in Finland. The site focuses on 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers, with the expansion significantly increasing 200 mm polished wafer capacity.
“With this expansion, Okmetic strengthens its position as an EU-based, one-stop supplier for 150 to 200 mm silicon wafer platforms serving the MEMS, sensor, RF, and Power markets. The increase in 200 mm polished wafer capacity strengthens long-term supply stability for critical semiconductor applications,” said President and CEO Kai Seikku.
Okmetic produced the first wafers from the expanded fab in June 2025, launching a structured qualification and ramp phase. With volume production now underway in early 2026, the company has started delivering wafers from the expanded capacity to customers, supporting long-term supply readiness across MEMS, RF, Power and GaN-based applications.
The Vantaa expansion is part of Okmetic’s broader plan to more than double capacity by 2030. Construction began in early 2023 and adds more than 40,000 m², including a 6,000 m² cleanroom as well as new crystal growth and wafering areas. Okmetic said the fab upgrade incorporates state-of-the-art equipment with a focus on energy efficiency.
The latest investment builds on prior capacity additions, including the doubling of bonded SOI production capacity between 2017 and 2021 and the introduction of a patterning line for Cavity SOI (C-SOI®) production in 2019. By expanding 200 mm polished wafer output, Okmetic aims to better meet evolving industry demand while reinforcing Europe-based supply of 150–200 mm wafer platforms.
Original – Okmetic
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Wolfspeed is expanding its deployment of Snowflake to boost manufacturing efficiency and operational excellence as it scales output to meet rising market demand. After consolidating factory, supply chain and enterprise data onto a single governed platform, Wolfspeed is now applying AI more broadly across the business to improve cost, quality, speed and workforce readiness—advancing its goal of operating as a fully AI-integrated manufacturing enterprise.
The company is embedding Snowflake Cortex AI into day-to-day decision-making by deploying intelligence, including specialized AI agents, across operations, supply chain, finance and market analysis. By connecting operational and enterprise systems, teams can work from a shared, real-time view of performance, supporting faster decisions, shorter manufacturing cycles and higher productivity from the factory floor to senior leadership.
Wolfspeed said the shift has enabled rollout of predictive and generative AI capabilities powered by Snowflake Intelligence and Cortex AI, including:
- WolfGPT, Wolfspeed’s internal generative AI platform built on Snowflake Intelligence, designed to help teams analyze manufacturing performance, anticipate issues and accelerate training in complex fabrication environments;
- multiple specialized AI agents across manufacturing, quality, supply chain, finance and corporate analytics to improve access to trusted data and institutional knowledge; and
- improved decision-making during critical manufacturing events, reducing time spent reconciling data across tools and increasing time spent on analysis and action.
“Manufacturing at this scale depends on making the right decisions faster, with confidence,” said Priya Almelkar, senior vice president and chief information officer at Wolfspeed. “By applying AI across our operations, we’re giving teams better visibility into what’s happening on the factory floor and across the business so they can act earlier, work more safely, and deliver higher-quality outcomes. Ultimately, this helps us bring even greater value to our customers.”
“Wolfspeed is showing what it looks like when AI moves out of experimentation and onto the factory floor,” said Baris Gultekin, vice president of AI at Snowflake. “By unifying their manufacturing, supply chain, and enterprise data on Snowflake, Wolfspeed has built a trusted foundation where AI agents can operate in real time to help teams predict issues, resolve problems faster, and make higher-impact decisions at scale.”
Wolfspeed said the expanded Snowflake deployment strengthens its ability to run a predictive, data-driven operation that supports sustained growth, accelerates innovation and reinforces long-term competitiveness.
Original – Wolfspeed
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Nexperia B.V. announced an update regarding recent legal developments and proceedings before the Dutch Enterprise Chamber, following a public hearing held on January 14, 2026.
The Dutch Enterprise Chamber ruled that there are valid reasons to doubt proper management at Nexperia under its previous governance structure and in light of certain actions taken by Wingtech Technology Co. Ltd. since October 2025.
Nexperia stated that it welcomes and respects the ruling and will fully comply with the court-ordered investigation, which is expected to continue for several months.
The measures imposed by the Enterprise Chamber in October 2025 remain effective. These include:
- The suspension of Zhang Xuezheng (Wing).
- The independent administration of voting rights on Nexperia shares indirectly held by Wingtech.
The company’s leadership continues under:
- Stefan Tilger as interim CEO
- Achim Kempe as COO
- Ruben Lichtenberg as Chief Legal Officer
- Guido Dierick as court-appointed non-executive director
Nexperia emphasized that its executive team remains focused on operational continuity and governance stability.
Despite the ongoing legal proceedings, Nexperia stated that its core business remains healthy and resilient. The company reaffirmed its commitment to customers, suppliers, employees and other stakeholders.
In light of the Enterprise Chamber’s ruling, Nexperia indicated that its immediate priorities include:
- Stabilizing its supply chain
- Ensuring reliable fulfillment of global customer demand
Nexperia confirmed it will provide further updates as circumstances evolve. Customers and partners are encouraged to contact the company directly with any questions and to verify official communications.
The company reiterated its commitment to transparency, business continuity and safeguarding stakeholder interests worldwide.
Original – Nexperia
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GLOBALFOUNDRIES Inc. reported preliminary financial results for the fourth quarter and full year ended December 31, 2025, highlighting strong execution, margin expansion and strategic portfolio growth.
GF generated revenue of $1.830 billion in the fourth quarter. Gross margin was 27.8%, with Non-IFRS gross margin at 29.0%. Operating margin reached 13.9%, while Non-IFRS operating margin was 18.3%.
Net income totaled $200 million, with Non-IFRS net income of $310 million. Diluted earnings per share were $0.36, compared with Non-IFRS diluted EPS of $0.55. Non-IFRS adjusted EBITDA came in at $641 million.
The company ended the quarter with $4.0 billion in cash, cash equivalents and marketable securities. Net cash provided by operating activities was $374 million, and Non-IFRS adjusted free cash flow totaled $264 million.
For the full year, GF reported revenue of $6.791 billion. Gross margin was 24.9%, with Non-IFRS gross margin at 26.1%. Operating margin reached 11.7%, and Non-IFRS operating margin was 15.7%.
Net income for the year was $888 million, with Non-IFRS net income of $965 million. Diluted EPS came in at $1.59, while Non-IFRS diluted EPS was $1.72. Non-IFRS adjusted EBITDA reached $2.357 billion.
Net cash provided by operating activities totaled $1.731 billion for the year, with Non-IFRS adjusted free cash flow of $1.157 billion.
“GF delivered a strong fourth quarter, with revenue, gross margin, operating margin and earnings per share at or above the high end of the guidance ranges,” said Tim Breen, CEO of GF. He highlighted nearly 400 basis points of year-over-year improvement in Non-IFRS gross margin during the fourth quarter, driven by disciplined cost management and strong execution. He also noted that recent acquisitions are expanding GF’s capabilities as a diversified technology solutions provider aligned with AI data center, Physical AI and on-shoring megatrends.
GF’s Board of Directors approved a new share repurchase authorization of up to $500 million of common stock. The program is valid for 12 months and allows the company to repurchase shares through open market transactions, privately negotiated transactions or other permitted methods. The timing and amount of repurchases will depend on market conditions and other factors.
In January 2026, GF announced a definitive agreement to acquire Synopsys’ ARC Processor IP Solutions business. The acquisition includes ARC-V, ARC-Classic, ARC VPX-DSP and ARC NPX NPU product lines, along with ASIP processor tools. These assets will be integrated with MIPS, a GlobalFoundries company, to create a comprehensive processor IP suite tailored for physical AI applications. The transaction is expected to close in the second half of 2026.
In November 2025, GF announced a long-term strategic partnership with Navitas to accelerate U.S.-based gallium nitride (GaN) technology, design and manufacturing for high-power applications such as AI data centers, performance computing, grid infrastructure and industrial electrification.
That same month, GF acquired Advanced Micro Foundry (AMF), a Singapore-based silicon photonics manufacturer, to accelerate its silicon photonics roadmap and expand its footprint in AI data centers and advanced telecom networks. GF also acquired Infinilink, an Egypt-based design company specializing in high-speed connectivity chips and silicon photonics, enhancing its in-house design capabilities and strengthening customer optical roadmaps.
Original – GlobalFoundries
