Para Light Electronics has launched its ThermaFlat I and ThermaFlat II silicon carbide MOSFET families, targeting a key thermal challenge in high-power conversion: the increase in MOSFET on-resistance as junction temperature rises. The portfolio targets AI and data-center power supplies, battery backup and UPS systems, EV charging, energy storage, photovoltaic inverters, variable-frequency drives and other industrial power applications.
The central feature of the new platform is what Para Light calls Ultra-Low RDS(on) Drift technology. Conventional SiC MOSFETs experience increasing on-resistance at elevated junction temperatures, which raises conduction losses and can increase cooling requirements. ThermaFlat is designed to keep on-resistance comparatively stable across a broad operating-temperature range, with the objective of improving full-load efficiency and simplifying thermal design.
In benchmark testing cited by Para Light, its 650V, 21 mΩ TO-247 device showed only approximately 8% RDS(on) variation as junction temperature increased from -25°C to +125°C. The company says this is significantly lower than the temperature coefficients of conventional SiC devices. Para Light also states that its 1200V ThermaFlat family exhibits similarly low temperature coefficients for high-power conversion architectures.
Broad portfolio spans 650V, 1200V and 1700V devices. The 650V lineup includes devices with RDS(on) ratings ranging from 8 mΩ to 36 mΩ, while the 1200V portfolio ranges from 10 mΩ to 35 mΩ. A 1700V includes a16 mΩ device. Package options include TO-247-3L, TO-247-4L, TOLL-8L and Q-DPAK, with several products incorporating Kelvin-source connections.
Para Light has divided the platform into two architectures. ThermaFlat I covers 650V and 1200V devices in industry-standard packages and is positioned for mainstream converter topologies. ThermaFlat II combines the low RDS(on) drift characteristic with a higher gate-threshold-voltage architecture intended to improve noise immunity and reduce false turn-on. According to Para Light, ThermaFlat II can operate without requiring a negative gate-off supply, potentially simplifying gate-driver circuitry, reducing component count and lowering system cost.
The company identifies AI data-center power supplies as one of the principal target markets. Other applications include battery backup units, UPS systems, EV charging stations, grid-connected energy-storage charging and discharging systems, photovoltaic inverters, variable-frequency drives and industrial automation. Para Light says it is continuing to expand the portfolio with additional voltage, current and package configurations.
Para Light is also positioning manufacturing and supply-chain capabilities as part of the offering. The company highlights wafer yields, dedicated in-house packaging and process controls, along with vertical integration covering device design, packaging and supply-chain management. It also cites strategic production planning and safety-inventory frameworks as measures intended to improve supply resilience for international customers.
Original – Para Light Electronics