Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration focused on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The initiative aims to combine Nexperia’s expertise in SiC semiconductor technology with Semikron Danfoss’ capabilities in power module packaging and integration to evaluate the development of high-performance, scalable solutions for next-generation electric vehicles.
As the automotive industry continues to increase the adoption of SiC technology in electric drivetrains, the demand for solutions that improve efficiency, power density, and overall vehicle performance continues to grow. Through this collaboration, the two companies intend to leverage their complementary strengths across the value chain, from semiconductor devices to fully integrated power modules, to address the evolving requirements of automotive applications.
The companies will explore joint engineering approaches, including early-stage integration and co-design methodologies, with the objective of maximizing the performance potential of SiC-based power systems.
Commenting on the agreement, Carsten Götte, Senior Vice President of the Automotive Power Modules Division at Semikron Danfoss, said the combination of Nexperia’s semiconductor expertise and Semikron Danfoss’ module capabilities creates an opportunity to explore solutions that could deliver additional value to customers in the rapidly developing electric vehicle market.
Edoardo Merli, Senior Vice President and Head of the Wide Bandgap, IGBT & Modules (WIM) Business Group at Nexperia, highlighted the importance of industry partnerships in advancing the adoption of wide-bandgap technologies such as SiC and gallium nitride (GaN). He noted that Nexperia’s ongoing investments in research and development, together with a focus on early-stage collaboration, support the alignment of semiconductor and system requirements from the outset of product development.
The Memorandum of Understanding was signed on June 8, 2026, by Stefan Tilger, Nexperia’s Interim Chief Executive Officer, and Carsten Götte, Senior Vice President of the Semikron Danfoss Automotive Power Modules Division.
Both companies share strong European roots and extensive experience in the power electronics industry, providing a foundation for exploring future opportunities in automotive power semiconductor and module technologies.
Original – Semikron Danfoss