Alpha and Omega Semiconductor Limited announced that it will showcase its latest power management technologies at PCIM Expo 2026, addressing the growing power demands of AI computing, AI data centers and industrial applications.
Visitors to the AOS booth will have the opportunity to explore a range of new products designed to help engineers address increasingly complex power management challenges. The company’s latest solutions focus on maximizing system performance, improving efficiency, optimizing board space utilization and supporting evolving AI power-delivery requirements.
Among the key technologies on display will be solutions targeting AI core power, AI data center infrastructure and industrial power applications.
For AI Core Power and High-Performance Computing
AOS will present several recently introduced power management solutions developed for AI computing platforms, graphics processing units (GPUs), system-on-chip (SoC) applications and next-generation notebook computers.
Featured products include the AOZ73216QI and AOZ73104QI controllers, designed to support high-performance GPUs and SoCs deployed in AI data center environments.
The company will also highlight its latest USB Type-C Extended Power Range (EPR) 3.1 protection switches, developed to enable safe and reliable power delivery of up to 240W in next-generation USB Type-C applications. The AOZ13058DI provides overvoltage and overcurrent protection for 48V Type-C sink applications, while the AOZ15953DI delivers additional protection functions required for Type-C source applications.
For AI Data Centers
AOS continues to expand its AI data center power portfolio with a range of MOSFET, αSiC and GaN-based solutions designed to support both existing 48V/54V architectures and emerging 800V DC power distribution systems.
The company’s latest devices are designed for high-density DC-DC and AC-DC conversion, offering enhanced thermal performance, reduced switching losses and compact power solutions optimized for AI servers and accelerators.
Highlighted technologies include double-sided cooling MOSFETs, third-generation αSiC devices for high-voltage power conversion, GaN FETs supporting high-frequency and high-density power delivery, and hot-swap solutions engineered to improve system reliability and efficiency in demanding AI infrastructure environments.
For Industrial Power Applications
AOS will also showcase its brushless DC (BLDC) motor solution portfolio, which includes advanced MOSFETs, motor driver ICs and dual-core motor control microcontrollers (MCUs) for applications ranging from power tools and outdoor equipment to e-mobility systems.
The portfolio features low-loss MOSFETs combined with GTPAK™ topside-cooling technology to enhance thermal and electrical performance. Integrated 3-phase and half-bridge motor driver ICs help simplify system design while providing enhanced protection features.
Complementing these products are highly integrated dual-core MCU solutions that support both sensor-less and sensored motor control. These devices incorporate advanced field-oriented control (FOC) and pulse-width modulation (PWM) capabilities to enable efficient operation in high-performance motor drive applications.
AOS will exhibit its latest technologies at PCIM Expo 2026, taking place from June 9 to June 11, 2026, at the Nuremberg Exhibition Centre in Nuremberg, Germany. Visitors can meet the company at Booth #9-539.
Original – Alpha and Omega Semiconductor