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STMicroelectronics reported solid financial results for the first quarter of 2026, reflecting improving demand conditions and early momentum from AI-driven applications.
The company posted net revenues of $3.10 billion, representing a 23.0% year-over-year increase, with gross margin at 33.8%. Operating income reached $70 million, while net income totaled $37 million, equivalent to $0.04 per diluted share. On a non-GAAP basis, profitability was stronger, with net income of $122 million and improved operating margins.
Performance was primarily driven by stronger revenues in personal electronics and customer engagement programs, along with a favorable product mix. The contribution from the acquired MEMS sensor business also supported growth, although underlying demand improvements were evident even excluding this factor.
From a market perspective, ST highlighted signs of recovery, including stronger bookings and normalized inventory levels across distribution channels, despite ongoing macroeconomic uncertainty.
Looking ahead, the company expects continued growth in Q2 2026, with projected revenues of approximately $3.45 billion at the midpoint, representing both sequential and year-over-year increases. Gross margin is expected to improve further to around 34.8%.
Strategically, ST emphasized its positioning in AI infrastructure as a key growth driver. The company expects data center-related revenues to exceed $500 million in 2026 and surpass $1 billion in 2027, supported by its portfolio spanning silicon, SiC, and GaN technologies.
From an industry standpoint, ST’s results reinforce a broader trend of recovery in semiconductor demand, led by AI, data centers, and high-performance applications. At the same time, margin performance indicates ongoing cost pressures and capacity utilization challenges, which remain key factors to monitor across the sector.
Original – STMicroelectronics
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Wolfspeed has appointed Yasuhisa Harita as regional president for Asia Pacific, effective June 1, 2026, reinforcing its strategic focus on expanding commercial operations across key high-growth markets.
Based in Tokyo, Harita will lead Wolfspeed’s business across Japan, Korea, and the ASEAN region, with responsibility for driving revenue growth, strengthening customer relationships, and executing regional strategy aligned with the company’s global objectives.
Harita brings more than 30 years of semiconductor industry experience, including leadership roles at Infineon, Micron, and most recently ams-OSRAM, where he focused on expanding regional business and improving market positioning. His background spans sales, marketing, and strategic growth in highly competitive markets.
From a strategic standpoint, this appointment highlights Wolfspeed’s continued investment in regional leadership as it scales its silicon carbide business globally. Asia Pacific remains a critical market for power semiconductors, driven by strong demand in automotive electrification, industrial automation, and energy infrastructure.
Strengthening leadership in this region is particularly important as SiC adoption accelerates across EVs, renewable energy systems, and AI-related power infrastructure. By enhancing local execution capabilities and customer engagement, Wolfspeed aims to capture a larger share of this growth.
This move aligns with a broader industry trend where leading power semiconductor companies are localizing commercial and technical support to better serve regional ecosystems and secure long-term design wins in strategic markets.
Original – Wolfspeed
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Vishay Intertechnology has launched a new family of 16 FRED Pt ultrafast rectifiers in the DFN6546A package, targeting space-constrained, high-efficiency applications across automotive, industrial, and consumer markets.
The new 200 V devices offer current ratings from 6 A to 15 A and are available in both commercial and AEC-Q101 qualified automotive-grade versions. The DFN6546A package features a compact 6.5 mm × 4.6 mm footprint with an ultra-low height of 0.88 mm, enabling improved PCB space utilization and supporting increasingly dense power designs.
From a performance standpoint, the rectifiers deliver low forward voltage (approximately 0.75 V), fast reverse recovery, and low reverse recovery charge, reducing switching losses and improving overall system efficiency. Enhanced thermal performance is achieved through optimized copper mass and die placement, allowing higher current capability compared to similarly sized packages.
The devices are designed for a wide range of applications, including DC/DC converters, high-frequency inverters, freewheeling diodes, and protection circuits. In automotive systems, they target use cases such as ECUs, ADAS, lighting, and 48 V power architectures in EVs and HEVs. They also support industrial automation, telecom, and consumer electronics applications.
A key packaging advantage is the inclusion of wettable flanks, enabling automated optical inspection (AOI) and eliminating the need for X-ray inspection—an important factor for high-volume manufacturing efficiency.
From a market perspective, this release highlights the continued evolution of silicon-based rectifiers through packaging and thermal innovation. While wide-bandgap devices are gaining share in high-voltage segments, optimized silicon rectifiers remain highly relevant in cost-sensitive, high-volume applications where efficiency, reliability, and compact form factors are critical.
Vishay’s latest offering reinforces its position in discrete power components by addressing the growing demand for miniaturization and improved thermal performance in modern power electronics systems.
Original – Vishay Intertechnology
